AC switching triac HXY MOSFET BTA16-HXY suitable for static relays heating regulation and light dimmers
Product Description
The BTA16 Triac series is designed for general-purpose AC switching in mains power applications. It functions as an ON/OFF switch and is suitable for static relays, heating regulation, and induction motor starting circuits. Additionally, it is recommended for phase control operations in light dimmers and appliance motor speed controllers.
Product Attributes
- Brand: HUAXUANYANG
- Model: BTA16
- Origin: Shenzhen, China
- Material: Plastic-Encapsulate Thyristors
- Package: TO-220A
- Website: www.hxymos.com
Technical Specifications
| Parameter | Symbol | Test Conditions | Value | Unit | Notes |
|---|---|---|---|---|---|
| RMS on-state current | IT(RMS) | Tc = 100 C | 16 | A | (full sine wave) |
| 16 | A | (full cycle) | |||
| 18 | A | (full cycle) | |||
| 10 | A | (full cycle) | |||
| Non repetitive surge peak on-state current | ITSM | Tj initial = 25 C, tp = 20 ms, F = 50 Hz | 160 | A | (full cycle) |
| Non repetitive surge peak on-state current | ITSM | Tj initial = 25 C, tp = 16.7 ms, F = 60 Hz | 168 | A | (full cycle) |
| I2t value for fusing | I2t | tp = 10 ms | 144 | A2s | |
| Critical rate of rise of on-state current | dl/dt | IG = 2 x IGT , tr 100 ns, F = 120 Hz, Tj = 125 C | 50 | A/s | |
| Non repetitive surge peak off-state voltage | VDSM/VRSM | Tj = 25 C, tp = 10 ms | + 100 | V | |
| Peak gate current | IGM | Tj = 125 C, tp = 20 s | 4 | A | |
| Average gate power dissipation | PG(AV) | Tj = 125 C | 1 | W | |
| Storage junction temperature range | Tstg | -40 to +150 | C | ||
| Operating junction temperature range | Tj | -40 to +125 | C | ||
| RMS on-state current | IT(RMS) | 16 | A | Absolute Maximum Rating | |
| Off-state voltage | VDRM/VRRM | 600 | V | Absolute Maximum Rating | |
| Non repetitive surge peak on-state current | ITSM | 160 | A | Absolute Maximum Rating | |
| On-state voltage | VT(1) | ITM = 22.5 A, tp = 380 s, Tj = 25 C | Max. 1.55 | V | |
| Threshold on-state voltage | VTO(1) | Tj = 125 C | Max. 0.85 | V | |
| Dynamic resistance | RD(1) | Tj = 125 C | Max. 25 | m | |
| Off-state current | IDRM/IRRM | VDRM = VRRM, Tj = 25 C | Max. 5 | A | |
| Off-state current | IDRM/IRRM | VDRM = VRRM, Tj = 125 C | 2 | mA | |
| Gate Trigger Current (Standard) | IGT(1) | VD = 12 V, RL = 33 | Max. 25 (I), 50 (II-IV) | mA | Quadrant |
| Gate Trigger Voltage (Standard) | VGT | Max. 1.3 | V | All Quadrants | |
| Gate Non-Trigger Voltage (Standard) | VGD | VD = VDRM, RL = 3.3 k, Tj = 125 C | Min. 0.2 | V | All Quadrants |
| Holding Current (Standard) | IH(2) | IT = 500 mA | Max. 50 (I, III-IV), Max. 80 (II) | mA | Quadrant |
| Latching Current (Standard) | IL | IG = 1.2 IGT | Max. 100 (I, III-IV), Max. 150 (II) | mA | Quadrant |
| Rate of rise of off-state voltage | dV/dt(2) | VD = 67 % VDRM, gate open, Tj = 125 C | Min. 200 | V/s | Quadrant |
| Critical rate of decrease of main current | (dI/dt)c | (dV/dt)c = 7 A/ms, Tj = 125 C | Min. 8.5 | A/ms | |
| Gate Trigger Current (Logic Level) | IGT(1) | VD = 12 V, RL = 30 | Max. 35 (I-III) | mA | Quadrant |
| Gate Trigger Voltage (Logic Level) | VGT | Max. 1.3 | V | All Quadrants | |
| Gate Non-Trigger Voltage (Logic Level) | VGD | VD = VDRM, RL = 3.3 k, Tj = 125 C | Min. 0.2 | V | All Quadrants |
| Holding Current (Logic Level) | IH(2) | IT = 500 mA | Max. 35 (I, III), Max. 60 (II) | mA | Quadrant |
| Latching Current (Logic Level) | IL | IG = 1.2 IGT | Max. 50 (I, III), Max. 80 (II) | mA | Quadrant |
| Rate of rise of off-state voltage (Logic Level) | dV/dt(2) | VD = 67 % VDRM, gate open, Tj = 125 C | Min. 500 | V/s | Quadrant |
| Critical rate of decrease of main current (Logic Level) | (dI/dt)c | (dV/dt)c = 0.1 V/s, Tj = 125 C | Min. 8.5 | A/ms | |
| Thermal resistance (junction to case) | Rth(j-c) | (AC) | Max. 2.1 | C/W | |
| Thermal resistance (junction to ambient) | Rth(j-a) | 60 | C/W |
Package Information (TO-220A)
| Ref | Dimensions (mm) | Dimensions (inches) |
|---|---|---|
| A | 15.20 - 15.90 | 0.598 - 0.625 |
| a1 | 3.75 | 0.147 |
| a2 | 13.00 - 14.00 | 0.511 - 0.551 |
| B | 10.00 - 10.40 | 0.393 - 0.409 |
| b1 | 0.61 - 0.88 | 0.024 - 0.034 |
| b2 | 1.23 - 1.32 | 0.048 - 0.051 |
| C | 4.40 - 4.60 | 0.173 - 0.181 |
| c1 | 0.49 - 0.70 | 0.019 - 0.027 |
| c2 | 2.40 - 2.72 | 0.094 - 0.107 |
| e | 2.40 - 2.70 | 0.094 - 0.106 |
| F | 6.20 - 6.60 | 0.244 - 0.259 |
| I | 3.75 - 3.85 | 0.147 - 0.151 |
| I4 | 15.80 - 16.80 | 0.622 - 0.661 |
| L | 2.65 - 2.95 | 0.104 - 0.116 |
| l2 | 1.14 - 1.70 | 0.044 - 0.066 |
| l3 | 1.14 - 1.70 | 0.044 - 0.066 |
| M | 2.60 | 0.102 |
Attention
Any and all HUA XUAN YANG ELECTRONICS products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your HUA XUAN YANG ELECTRONICS representative nearest you before using any HUA XUAN YANG ELECTRONICS products described or contained herein in such applications.
HUA XUAN YANG ELECTRONICS assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all HUA XUAN YANG ELECTRONICS products described or contained herein.
Specifications of any and all HUA XUAN YANG ELECTRONICS products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customers products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customers products or equipment.
HUA XUAN YANG ELECTRONICS CO.,LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design.
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