single phase bridge rectifier JUXING EGBU606 with 6 ampere current and molded plastic body design
Product Overview
The EGBU606 is a single-phase 6.0 Ampere glass-passivated bridge rectifier. It features a molded plastic body with solder-plated terminals, suitable for printed circuit board mounting. Key advantages include low reverse leakage, high forward surge current capability, and high temperature soldering guarantee. It is ideal for applications requiring efficient rectification with a compact and reliable component.
Product Attributes
- Brand: EGBU
- Material: Glass passivated Junction chip
- Certifications: Underwriters Laboratory Flammability Classification 94V-0
- Polarity: Polarity symbol marking on body
- Mounting Position: Any
Technical Specifications
| Parameter | SYMBOLS | UNITS | EGBU606 | Notes |
|---|---|---|---|---|
| Maximum Ratings And Electrical Characteristics | ||||
| Maximum RMS voltage | VRMS | V | 600 | |
| Maximum DC blocking voltage | VDC | V | 600 | |
| Maximum average forward rectified current | I(AV) | A | 6.0 | @ TA =25 C ambient temperature unless otherwise specified. With heatsink. Single Phase. Derate by 20% for capacitive load current. |
| Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load | IFSM | A | 420 | 127.1 Number of cycles |
| Maximum instantaneous forward voltage at 6.0A | VF | V | 1.7 | @ 6.0A |
| Maximum DC reverse current | IR | A | 0.01 | @ TA =25 C at rated DC blocking voltage |
| 5.0 | @ TA=125 C | |||
| Operating junction and storage temperature range | TJ, T STG | C | -55 to +150 | |
| Maximum reverse recovery time | Trr | ns | 500 | Note 4 |
| Typical thermal resistance | RqJA | C/W | 175.0 | Mounted on glass epoxy PC board with 1.3mm solder pad. |
| 6.0 | Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink. | |||
| It Rating for fusing (t=8.3ms, Ta=25 C) | As | 2 | ||
| Maximum repetitive peak reverse voltage | VRRM | V | 600 | |
| C/10 seconds at terminals | Single phase half-wave 60Hz,resistive or inductive load |
Note:
1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.Mounted on glass epoxy PC board with 1.3mm solder pad.
3.Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink.
4.Reverse Recovery Test Conditions:IF=0.5A,IR=1.0A,IRR=0.25A.
2501061745_JUXING-EGBU606_C42433398.pdf
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