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quality pcb bridge rectifier JUXING GBU810 featuring glass passivated chip junction and molded plastic design factory
quality pcb bridge rectifier JUXING GBU810 featuring glass passivated chip junction and molded plastic design factory

pcb bridge rectifier JUXING GBU810 featuring glass passivated chip junction and molded plastic design

Key Attributes
Model Number: GBU810
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
150A
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - Forward(Vf@If):
1.1V
Current - Rectified:
8A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
GBU810
Package:
GBU
Product Description

Product Overview

The GBU8005 THRU GBU810 series are glass passivated chip junction bridge rectifiers designed for printed circuit board applications. They offer reliable, low-cost construction utilizing a molded plastic technique, with advantages including low forward voltage drop, low reverse leakage current, and high surge current capability. These rectifiers are ideal for various applications requiring efficient AC to DC conversion.

Product Attributes

  • Brand: GBU (implied from product numbering)
  • Construction: Molded plastic
  • Epoxy: UL 94V-O rate flame retardant
  • Terminals: Leads solderable per MIL-STD-202, method 208 guaranteed
  • Mounting Position: Any
  • Certifications: UL Recognized File # E469616

Technical Specifications

TYPE NUMBERVRRM (V)VRWM (V)VDC (V)VRMS (V)IFSM (A)IF(AV) (A)I2t (A2s)VF (V)IR (uA)CJ (pF)RJA (/W)RJL (/W)TJ,TSTG ()Weight (oz/g)
GBU8005353535251008.0931.0 (at IF=8A)5.0 (at 25C)150 (typical)10.9 (mounted on glass epoxy PC board with 1.3mm solder pad)75 (Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink)-55 to +1500.15 / 4.0
GBU801707070501008.0931.0 (at IF=8A)5.0 (at 25C)150 (typical)10.9 (mounted on glass epoxy PC board with 1.3mm solder pad)75 (Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink)-55 to +1500.15 / 4.0
GBU8021401401401001008.0931.0 (at IF=8A)5.0 (at 25C)150 (typical)10.9 (mounted on glass epoxy PC board with 1.3mm solder pad)75 (Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink)-55 to +1500.15 / 4.0
GBU8042802802802001008.0931.0 (at IF=8A)5.0 (at 25C)150 (typical)10.9 (mounted on glass epoxy PC board with 1.3mm solder pad)75 (Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink)-55 to +1500.15 / 4.0
GBU8064204204203001008.0931.0 (at IF=8A)5.0 (at 25C)150 (typical)10.9 (mounted on glass epoxy PC board with 1.3mm solder pad)75 (Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink)-55 to +1500.15 / 4.0
GBU8085605605604001008.0931.0 (at IF=8A)5.0 (at 25C)150 (typical)10.9 (mounted on glass epoxy PC board with 1.3mm solder pad)75 (Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink)-55 to +1500.15 / 4.0
GBU8107007007005001008.0931.0 (at IF=8A)5.0 (at 25C)150 (typical)10.9 (mounted on glass epoxy PC board with 1.3mm solder pad)75 (Device mounted on 50mm x 50mm x 1.6mm Cu Plate Heatsink)-55 to +1500.15 / 4.0

Note: Ratings at 25 ambient temperature unless otherwise specified. Single phase, half wave, 60HZ, resistive or inductive load. For capacitive load, derate current by 20%.


2208151830_JUXING-GBU810_C5138253.pdf

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