High energy pulse withstand MOSFET KIA Semicon Tech KNY3303A ideal for half bridge topology circuits

Key Attributes
Model Number: KNY3303A
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
90A
Operating Temperature -:
-55℃~+150℃
RDS(on):
4mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
315pF
Number:
1 N-channel
Output Capacitance(Coss):
400pF
Input Capacitance(Ciss):
3.07nF
Pd - Power Dissipation:
69W
Gate Charge(Qg):
24nC@4.5V
Mfr. Part #:
KNY3303A
Package:
PDFN-8(5.8x4.9)
Product Description

Product Overview

This N-CHANNEL MOSFET, the KNX3303A from KIA SEMICONDUCTOR, is manufactured using advanced planar stripe DMOS technology. It is engineered for minimal on-state resistance, superior switching performance, and high energy pulse withstand capability in avalanche and commutation modes. This device is ideal for high efficiency switched mode power supplies and active power factor correction circuits utilizing half-bridge topology.

Product Attributes

  • Brand: KIA SEMICONDUCTOR
  • Origin: KIA
  • Type: N-CHANNEL MOSFET
  • Model: KNX3303A
  • Availability: Green device available

Technical Specifications

ParameterSymbolDFN3*3DFN5*6UnitsNotes
Absolute Maximum Ratings
Drain-source voltageVDSS3030V
Gate-source voltageVGSS+20V
Continuous drain currentID90*90*ATC=25C, limited by max junction temperature
57*57*ATC=100C, limited by max junction temperature
Pulse drain currentIDP360*ATC=25C, pulse width limited by max junction temperature
Avalanche currentIAS50ANote 2
Avalanche energyEAS125mJNote 2
Maximum power dissipationPD43.469WTC=25 C
Derate above 25 C0.350.55W/
Junction & storage temperature rangeTJ,TSTG-55-150
Thermal Characteristics
Thermal resistance, Junction-ambientRJA9562C/W
Thermal resistance, Junction-caseRJC2.881.81C/W
Electrical Characteristics
Drain-source breakdown voltageBVDSS30VVGS=0V,IDS=250A
BVDSS temperature coefficientBVDSS /TJ0.03V/CReference to 25C, ID=1mA
Zero gate voltage drain currentIDSS1AVDS=30V, VGS=0V, TJ=25C
10AVDS=24V, VGS=0V, TJ=125C
Gate threshold voltageVGS(th)1.2 - 2.5VVDS=VGS, ID=250A
1.6VTyp.
VGS(th) temperature coefficientVGS(th)-5mV/CVDS=VGS, ID=250A
Gate leakage currentIGSS+100nAVGS=+20V, VDS=0V
Drain-source on-resistanceRDS(on)3.1 - 4mVGS=10V,ID=24A, Note 3
4.5 - 6mVGS=4.5V,ID=12A, Note 3
Forward transconductancegfs15.5SVDS=10V,ID=10A
Gate resistanceRg2 - 4VDS=0V, VGS=0V,f=1MHz
Input capacitanceCiss3070pFVDS=15V,VGS=0V, f=1MHz
Output capacitanceCoss400pF
Reverse transfer capacitanceCrss315pF
Turn-on delay timetd(on)12.6nSVDD=15V, ID=15A, RG=3.3,VGS=10V, Note 3,4
Rise timetr19.5nSNote 3,4
Turn-off delay timetd(off)42.8nSNote 3,4
Fall timetf13.2nSNote 3,4
Total gate chargeQg24nCVDS=15V, VGS=4.5V IDS=24A, Note 3,4
Gate-source chargeQgs4.2nCNote 3,4
Gate-drain chargeQgd13nCNote 3,4
Single pulse avalanche energyEAS31mJVDD=25V,L=0.1mH,IAS=24A
Continuous source currentIS90AVGS=VDS=0V,force current
Pulsed source currentISM360ANote 3
Diode forward voltageVSD1VVGS=0V,IS=1A,TJ=25C, Note 3
Reverse recovery timetrr-nSVDS=30V,IS=1A, di/dt=100A/s
Reverse recovery chargeQrr-nC

2410010001_KIA-Semicon-Tech-KNY3303A_C382144.pdf

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