Power Management MOSFET Leiditech FDMS86163P P Channel with 100V Drain Source Voltage and Low On Resistance

Key Attributes
Model Number: FDMS86163P
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
50A
RDS(on):
52mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
13pF
Number:
1 P-Channel
Output Capacitance(Coss):
194pF
Pd - Power Dissipation:
140W
Input Capacitance(Ciss):
2.12nF
Gate Charge(Qg):
40nC@10V
Mfr. Part #:
FDMS86163P
Package:
DFN-8(4.9x5.7)
Product Description

Product Overview

The FDMS86163P is a P-Channel Enhancement Mode MOSFET designed for various applications. It features a -100V Drain-Source Voltage and a continuous drain current capability of -50A at 25 (VGS @ -10V). This MOSFET offers a low static drain-source on-resistance (RDS(on)) of 40m typically at VGS=-10V and ID=-20A, making it suitable for power management applications.

Product Attributes

  • Brand: Leiditech
  • Model: FDMS86163P
  • Type: P-Channel Enhancement Mode MOSFET
  • Origin: Shanghai Leiditech Electronic Co.,Ltd

Technical Specifications

Symbol Parameter Test Condition Min. Typ. Max. Units
Absolute Maximum Ratings (TC=25 unless otherwise noted)
VDS Drain-Source Voltage -100 V
VGS Gate-Source Voltage 20 V
ID@TC=25 Continuous Drain Current, VGS @ -10V1 -50 A
ID@TC=100 Continuous Drain Current, VGS @ -10V1 -28 A
IDM Pulsed Drain Current2 -150 A
EAS Single Pulse Avalanche Energy3 87 mJ
IAS Avalanche Current -35 A
PD@TC=25 Total Power Dissipation4 140 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
RJA Thermal Resistance Junction-Ambient 125 /W
RJC Thermal Resistance Junction-Case1 1.1 /W
Electrical Characteristics (TJ =25 , unless otherwise noted)
V(BR)DSS Drain-Source Breakdown Voltage VGS=0V, ID=-250A -100 - - V
IDSS Zero Gate Voltage Drain Current VDS=-100V, VGS=0V - - -1.0 A
IGSS Gate to Body Leakage Current VDS=0V, VGS= 20V - - 100 nA
VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250A -1.0 -1.6 -2.5 V
RDS(on) Static Drain-Source on-Resistance VGS=-10V, ID=-20A - 40 52 m
RDS(on) Static Drain-Source on-Resistance VGS=-4.5V, ID=-10A - 44 62 m
Ciss Input Capacitance VDS=-50V, VGS=0V, f=1.0MHz - 2120 - pF
Coss Output Capacitance - 194 - pF
Crss Reverse Transfer Capacitance - 13 - pF
Qg Total Gate Charge VDS=-50V, ID=-5A, VGS=-10V - 40 - nC
Qgs Gate-Source Charge - 7.8 - nC
Qgd Gate-Drain(Miller) Charge - 8.6 - nC
td(on) Turn-on Delay Time VDD=-50V, ID=-5A, RG=6, VGS=-10V - 13 - ns
tr Turn-on Rise Time - 39 - ns
td(off) Turn-off Delay Time - 100.1 - ns
tf Turn-off Fall Time - 105.3 - ns
IS Maximum Continuous Drain to Source Diode Forward Current - - -35 A
ISM Maximum Pulsed Drain to Source Diode Forward Current - - -140 A
VSD Drain to Source Diode Forward Voltage VGS=0V, IS=-30A - - -1.2 V
trr Body Diode Reverse Recovery Time TJ=25, IF=-5A,dI/dt=100A/s - 104 - ns
Qrr Body Diode Reverse Recovery Charge - 280 - nC
Package Mechanical Data-DFN5*6-8L
Symbol Common mm Inch Min Max Min Max
A 1.03 1.17 0.0406 0.0461
b 0.34 0.48 0.0134 0.0189
c 0.824 0.0970 0.0324 0.082
D 4.80 5.40 0.1890 0.2126
D1 4.11 4.31 0.1618 0.1697
D2 4.80 5.00 0.1890 0.1969
E 5.95 6.15 0.2343 0.2421
E1 5.65 5.85 0.2224 0.2303
E2 1.60 / 0.0630 /
e BSC 1.27 BSC 0.05 BSC
L 0.05 0.25 0.0020 0.0098
L1 0.38 0.50 0.0150 0.0197
L2 0.38 0.50 0.0150 0.0197
H 3.30 3.50 0.1299 0.1378
I / 0.18 / 0.0070

Notes:
1. Data tested by surface mounted on a 1 inch 2 FR-4 board with 2OZ copper.
2. Data tested by pulsed, pulse width 300s, duty cycle 2%.
3. EAS data shows Max. rating. Test condition is V DD =-25V, V GS =-10V, L=0.1mH, IAS =-24A.
4. Power dissipation is limited by 150 junction temperature.
5. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.


2410121549_Leiditech-FDMS86163P_C3647072.pdf

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