Low Gate Charge 60V N Channel MOSFET Leiditech DMN6075SQ with Excellent RDS ON and Trench Technology

Key Attributes
Model Number: DMN6075SQ
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
3A
RDS(on):
100mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
35pF
Number:
1 N-channel
Input Capacitance(Ciss):
715pF
Pd - Power Dissipation:
1W
Gate Charge(Qg):
7nC@4.5V
Mfr. Part #:
DMN6075SQ
Package:
SOT-23
Product Description

Product Overview

The DMN6075SQ is a 60V N-Channel Enhancement Mode MOSFET utilizing advanced trench technology. It offers excellent RDS(ON) and low gate charge, with the capability to operate at gate voltages as low as 4.5V. This device is well-suited for battery protection and other switching applications, providing reliable performance in demanding environments.

Product Attributes

  • Brand: Leiditech
  • Model: DMN6075SQ
  • Package Type: SOT-23

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Units
Absolute Maximum Ratings (TC=25 unless otherwise noted)
VDS Drain-Source Voltage 60 V
VGS Gate-Source Voltage 20 V
ID@TA=25 Continuous Drain Current, VGS @ 10V1 3.0 A
ID@TA=70 Continuous Drain Current, VGS @ 10V1 1.8 A
IDM Pulsed Drain Current2 9.2 A
PD@TA=25 Total Power Dissipation3 1 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
RJA Thermal Resistance Junction-Ambient1 125 /W
RJC Thermal Resistance Junction-Case1 80 /W
Electrical Characteristics (TJ=25, unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 60 --- --- V
BVDSS/TJ BVDSS Temperature Coefficient Reference to 25 , ID=1mA 0.054 --- V/
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=2A 80 100 m
VGS=4.5V , ID=1A 85 110 V
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 --- 2.5 V
VGS(th) VGS(th) Temperature Coefficient -4.96 --- mV/
IDSS Drain-Source Leakage Current VDS=48V , VGS=0V , TJ=25 --- 1 uA
VDS=48V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- 100 nA
gfs Forward Transconductance VDS=5V , ID=2A 13 --- S
Qg Total Gate Charge (4.5V) VDS=48V , VGS=4.5V , ID=2A 5 7.0 nC
Qgs Gate-Source Charge 1.68 2.4 nC
Qgd Gate-Drain Charge 1.9 2.7 nC
Td(on) Turn-On Delay Time VDD=30V , VGS=10V , RG=3.3 , ID=2A 1.6 3.2 ns
Tr Rise Time 7.2 13 ns
Td(off) Turn-Off Delay Time 25 50 ns
Tf Fall Time 14.4 28.8 ns
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz 511 715 pF
Coss Output Capacitance 38 53 pF
Crss Reverse Transfer Capacitance 25 35 pF
IS Continuous Source Current1,4 VG=VD=0V , Force Current --- 2.3 A
ISM Pulsed Source Current2,4 --- 9.2 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- 1.2 V
trr Reverse Recovery Time IF=2A , dI/dt=100A/s , TJ=25 9.7 --- nS
Qrr Reverse Recovery Charge 5.8 --- nC
Dimensions (SOT-23)
Symbol Dimensions in Millimeters MIN. MAX.
A 0.900 1.150
A1 0.000 0.100
A2 0.900 1.050
b 0.300 0.500
c 0.080 0.150
D 2.800 3.000
E 1.200 1.400
E1 2.250 2.550
e 0.950TYP
e1 1.800 2.000
L 0.550REF
L1 0.300 0.500
0 8

Notes:

  • 1 The data tested by surface mounted on a 1 inch FR-4 board with 2OZ copper.
  • 2 The data tested by pulsed, pulse width 300us, duty cycle 2%.
  • 3 The power dissipation is limited by 150 junction temperature.
  • 4 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.

2410121618_Leiditech-DMN6075SQ_C3647060.pdf

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