Resettable overvoltage protection device Littelfuse ZEN132V230A16LS polymer enhanced Zener diode micro assembly
Key Attributes
Model Number:
ZEN132V230A16LS
Product Custom Attributes
Pd - Power Dissipation:
-
Zener Voltage(Nom):
13.4V
Mfr. Part #:
ZEN132V230A16LS
Product Description
PolyZen Polymer Enhanced Zener Diode Micro-Assemblies
Product Overview
The Littelfuse PolyZen devices are polymer enhanced, precision Zener diode micro-assemblies designed to offer resettable protection against multi-Watt fault events without the need for external heat sinks. They feature a Zener diode with a stable voltage vs. current response for improved output voltage clamping, even under high input voltage and large diode currents. An advanced polymer PTC layer is integrated and thermally coupled to the Zener diode. This PTC layer transitions to a high resistance state ('trips') in response to extended diode heating or overcurrent events, limiting current and generating voltage drop to protect the Zener diode and downstream electronics. PolyZen devices are particularly suitable for protecting sensitive portable electronics and other low-power DC devices from inductive voltage spikes, voltage transients, incorrect power supplies, and reverse bias.
Key Benefits
- Stable Zener diode shields downstream electronics from overvoltage and reverse bias.
- Trip events effectively shut out overvoltage and reverse bias sources.
- Analog nature of trip events minimizes upstream inductive spikes.
- Minimal power dissipation requirements.
- Single component placement for ease of integration.
Features
- Overvoltage transient suppression.
- Stable VZ vs. fault current.
- Time-delayed, overvoltage trip.
- Time-delayed, reverse bias trip.
- Multi-Watt power handling capability.
- Integrated device construction.
- RoHS Compliant.
Target Applications
- DC power port protection in portable electronics.
- DC power port protection for systems using barrel jacks for power input.
- Internal overvoltage & transient suppression.
- DC output voltage regulation.
Product Attributes
- Brand: Littelfuse
- Product Line: PolyZen
- Certifications: RoHS Compliant, ELV Compliant, Pb-Free
Technical Specifications
| Specification | Value | Notes |
|---|---|---|
| Product Model | ZEN132V230A16LS | |
| Operating Temperature | -40 to +85C | |
| Storage Temperature | -40 to +85C | |
| Zener Voltage (VZ) @ Izt | 13.2V (Min), 13.4V (Typ), 13.6V (Max) | Izt = 0.1A |
| Current at Zener Voltage (Izt) | 0.1 A | |
| Hold Current (IHOLD) @ 20C | 2.3 A | Max steady state current that will not generate a trip event. |
| Typical Resistance (R Typ) | 0.04 Ohms | Between VIN and VOUT pins during normal operation at room temperature. |
| Max Resistance (R1Max) | 0.06 Ohms | Between VIN and VOUT pins at room temperature, one hour after 1st trip or after reflow soldering. |
| Max Internal Voltage (VINT Max) | +20V | Survivability rating, not a performance rating. |
| Max Fault Current (IFLT Max) | 5A | Related to steady state current through the diode in a fault condition prior to trip. Survivability rating. |
| Tripped Power Dissipation Max | 0.8 W | Measured on Littelfuse test boards. |
| Max Internal Voltage (VINT Max) for Qualification | -12V | Survivability rating at specified voltage and current (IPTC). |
| Device Dimensions (L x W x H) | 4.0 mm (L) x 4.0 mm (W) x 1.7 mm (H) | Typical values. Length: 3.85-4.15 mm; Width: 3.85-4.15 mm; Height: 1.4-2.0 mm. |
| Packaging (Tape & Reel) | 3,000 units | |
| Packaging (Standard Box) | 15,000 units |
Configuration Information
Pin Configuration (Top View):
| Pin Number | Pin Name | Pin Function |
|---|---|---|
| 1 | VIN | Protected input to Zener diode. |
| 2 | GND | Ground. |
| 3 | VOUT | Zener regulated voltage output. |
Definition of Terms
- IPTC: Current flowing through the PTC portion of the circuit.
- IFLT: RMS fault current flowing through the diode.
- IOUT: Current flowing out the VOUT pin of the device.
- Trip Event: A condition where the PTC transitions to a high resistance state, thereby significantly limiting IPTC and related currents.
- Trip Endurance Time: The time the PTC portion of the device remains in a high resistance state.
Solder Reflow Recommendations (Pb-Free Assembly)
| Profile Feature | Specification |
|---|---|
| Average Ramp-Up Rate (Tsmax to Tp) | 3 C/second max. |
| Preheat - Temperature Min (Tsmin) | 150 C |
| Preheat - Temperature Max (Tsmax) | 200 C |
| Preheat - Time (tsmin to tsmax) | 60-180 seconds |
| Time maintained above TL | 60-150 seconds (TL = 217 C) |
| Peak/Classification Temperature (Tp) | 260 C |
| Time within 5 C of actual Peak Temperature (tp) | 20-40 seconds |
| Ramp-Down Rate | 6 C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Materials Information
- ROHS Compliant
- ELV Compliant
- Pb-Free
2411271927_Littelfuse-ZEN132V230A16LS_C58140.pdf
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