Pb Free SOT 723 Package N Channel MOSFET LRC L2N7002M3T5G for Automotive and Industrial Applications
Product Overview
The L2N7002M3T5G and S-L2N7002M3T5G are N-Channel Small Signal MOSFETs from LESHAN RADIO COMPANY, LTD., designed for various applications. These devices are available in a Pb-Free SOT-723 package, with the S- prefix indicating suitability for automotive and other applications requiring unique site and control change requirements, including AEC-Q101 qualification and PPAP capability. They offer reliable performance with specific voltage and current ratings, making them suitable for general-purpose switching and amplification.
Product Attributes
- Brand: LESHAN RADIO COMPANY, LTD.
- Package Type: SOT-723
- Channel Type: N-Channel
- Lead Free: Yes
- Certifications: AEC-Q101 Qualified (S- prefix models)
- Compliance: PPAP Capable (S- prefix models)
Technical Specifications
| Characteristic | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| DrainSource Voltage | VDSS | 60 | Vdc | ||
| DrainGate Voltage (RGS = 1.0 M) | VDGR | 60 | Vdc | ||
| GateSource Voltage Continuous | VGS | 20 | Vdc | ||
| Drain Current Continuous (TC = 25C) | ID | 115 | mAmps | ||
| Drain Current Pulse | IDM | 800 | mAmps | ||
| Total Device Dissipation (FR5 Board, TA = 25C) | PD | 150 | mW | ||
| Derate above 25C | 1.2 | mW/C | |||
| Thermal Resistance, Junction to Ambient | RJA | 833 | C/W | ||
| Junction and Storage Temperature | TJ, Tstg | -55 | +150 | C | |
| DrainSource Breakdown Voltage (VGS = 0, ID = 10 Adc) | V(BR)DSS | 60 | Vdc | ||
| Zero Gate Voltage Drain Current (TJ = 25C, VGS = 0, VDS = 60 Vdc) | IDSS | 1.0 | Adc | ||
| Zero Gate Voltage Drain Current (TJ = 125C, VGS = 0, VDS = 60 Vdc) | IDSS | 500 | Adc | ||
| GateBody Leakage Current, Forward (VGS = 20 Vdc) | IGSSF | 100 | nAdc | ||
| GateBody Leakage Current, Reverse (VGS = 20 Vdc) | IGSSR | -100 | nAdc | ||
| Gate Threshold Voltage (VDS = VGS, ID = 250 Adc) | VGS(th) | 1.0 | 1.8 | 2.2 | Vdc |
| OnState Drain Current (VDS 2.0 VDS(on), VGS = 10 Vdc) | ID(on) | 500 | mA | ||
| Static DrainSource OnState Voltage (VGS = 10 Vdc, ID = 500 mAdc) | VDS(on) | 0.375 | Vdc | ||
| Static DrainSource OnState Voltage (VGS = 5.0 Vdc, ID = 50 mAdc) | VDS(on) | 3.75 | Vdc | ||
| Static DrainSource OnState Resistance (VGS = 10 V, ID = 500 mAdc) | rDS(on) | 4 | Ohms | ||
| Static DrainSource OnState Resistance (VGS = 5.0 Vdc, ID = 50 mAdc) | rDS(on) | 4 | Ohms | ||
| Forward Transconductance (VDS 2.0 VDS(on), ID = 200 mAdc) | gFS | 80 | mmhos | ||
| Input Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) | Ciss | 17 | 50 | pF | |
| Output Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) | Coss | 10 | 25 | pF | |
| Reverse Transfer Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) | Crss | 2.5 | 5.0 | pF | |
| TurnOn Delay Time (V DD = 25 Vdc , ID = 500 mAdc) | td(on) | 7 | 20 | ns | |
| TurnOff Delay Time (V RG = 25 , RL = 50 , Vgen = 10 V) | td(off) | 11 | 40 | ns | |
| Diode Forward OnVoltage (IS = 115 mAdc, V GS = 0 V) | VSD | -1.5 | Vdc | ||
| Source Current Continuous (Body Diode) | IS | -115 | mAdc | ||
| Source Current Pulsed (Body Diode) | ISM | -800 | mAdc |
Note 1: The Power Dissipation of the package may result in a lower continuous drain current.
Note 2: Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.
Note 3: FR5 Board = 1.0 x 0.75 x 0.062 in.
Note 4: Alumina = 0.4 x 0.3 x 0.025 in 99.5% alumina.
SOT-723 Package Dimensions
| Dimension | MILLIMETERS | INCHES | ||||
|---|---|---|---|---|---|---|
| MIN | NOM | MAX | MIN | NOM | MAX | |
| A | 0.45 | 0.50 | 0.55 | 0.018 | 0.020 | 0.022 |
| b | 0.15 | 0.20 | 0.27 | 0.0059 | 0.0079 | 0.0106 |
| b1 | 0.25 | 0.3 | 0.35 | 0.010 | 0.012 | 0.014 |
| C | 0.07 | 0.12 | 0.17 | 0.0028 | 0.0047 | 0.0067 |
| D | 1.15 | 1.20 | 1.25 | 0.045 | 0.047 | 0.049 |
| E | 0.75 | 0.80 | 0.85 | 0.030 | 0.032 | 0.034 |
| e | 0.40 BSC | 0.016 BSC | ||||
| H | 1.15 | 1.20 | 1.25 | 0.045 | 0.047 | 0.049 |
| L | 0.15 | 0.20 | 0.25 | 0.0059 | 0.0079 | 0.0098 |
NOTES:
- 1. Dimensioning and Tolerancing per ANSI Y14.5M, 1982.
- 2. Controlling Dimension: Millimeters.
- 3. Maximum lead thickness includes lead finish. Minimum lead thickness is the minimum thickness of base material.
- 4. Dimensions D and E do not include mold flash, protrusions or gate burrs.
1806142033_LRC-L2N7002M3T5G_C172394.pdf
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