Pb Free SOT 723 Package N Channel MOSFET LRC L2N7002M3T5G for Automotive and Industrial Applications

Key Attributes
Model Number: L2N7002M3T5G
Product Custom Attributes
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
115mA
Operating Temperature -:
-55℃~+150℃
RDS(on):
4Ω@10V,500mA
Gate Threshold Voltage (Vgs(th)):
2.2V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
5pF
Number:
1 N-channel
Output Capacitance(Coss):
25pF
Input Capacitance(Ciss):
50pF
Pd - Power Dissipation:
150mW
Gate Charge(Qg):
-
Mfr. Part #:
L2N7002M3T5G
Package:
SOT-723
Product Description

Product Overview

The L2N7002M3T5G and S-L2N7002M3T5G are N-Channel Small Signal MOSFETs from LESHAN RADIO COMPANY, LTD., designed for various applications. These devices are available in a Pb-Free SOT-723 package, with the S- prefix indicating suitability for automotive and other applications requiring unique site and control change requirements, including AEC-Q101 qualification and PPAP capability. They offer reliable performance with specific voltage and current ratings, making them suitable for general-purpose switching and amplification.

Product Attributes

  • Brand: LESHAN RADIO COMPANY, LTD.
  • Package Type: SOT-723
  • Channel Type: N-Channel
  • Lead Free: Yes
  • Certifications: AEC-Q101 Qualified (S- prefix models)
  • Compliance: PPAP Capable (S- prefix models)

Technical Specifications

Characteristic Symbol Min Typ Max Unit
DrainSource Voltage VDSS 60 Vdc
DrainGate Voltage (RGS = 1.0 M) VDGR 60 Vdc
GateSource Voltage Continuous VGS 20 Vdc
Drain Current Continuous (TC = 25C) ID 115 mAmps
Drain Current Pulse IDM 800 mAmps
Total Device Dissipation (FR5 Board, TA = 25C) PD 150 mW
Derate above 25C 1.2 mW/C
Thermal Resistance, Junction to Ambient RJA 833 C/W
Junction and Storage Temperature TJ, Tstg -55 +150 C
DrainSource Breakdown Voltage (VGS = 0, ID = 10 Adc) V(BR)DSS 60 Vdc
Zero Gate Voltage Drain Current (TJ = 25C, VGS = 0, VDS = 60 Vdc) IDSS 1.0 Adc
Zero Gate Voltage Drain Current (TJ = 125C, VGS = 0, VDS = 60 Vdc) IDSS 500 Adc
GateBody Leakage Current, Forward (VGS = 20 Vdc) IGSSF 100 nAdc
GateBody Leakage Current, Reverse (VGS = 20 Vdc) IGSSR -100 nAdc
Gate Threshold Voltage (VDS = VGS, ID = 250 Adc) VGS(th) 1.0 1.8 2.2 Vdc
OnState Drain Current (VDS 2.0 VDS(on), VGS = 10 Vdc) ID(on) 500 mA
Static DrainSource OnState Voltage (VGS = 10 Vdc, ID = 500 mAdc) VDS(on) 0.375 Vdc
Static DrainSource OnState Voltage (VGS = 5.0 Vdc, ID = 50 mAdc) VDS(on) 3.75 Vdc
Static DrainSource OnState Resistance (VGS = 10 V, ID = 500 mAdc) rDS(on) 4 Ohms
Static DrainSource OnState Resistance (VGS = 5.0 Vdc, ID = 50 mAdc) rDS(on) 4 Ohms
Forward Transconductance (VDS 2.0 VDS(on), ID = 200 mAdc) gFS 80 mmhos
Input Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) Ciss 17 50 pF
Output Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) Coss 10 25 pF
Reverse Transfer Capacitance (VDS = 25 Vdc, VGS = 0, f = 1.0 MHz) Crss 2.5 5.0 pF
TurnOn Delay Time (V DD = 25 Vdc , ID = 500 mAdc) td(on) 7 20 ns
TurnOff Delay Time (V RG = 25 , RL = 50 , Vgen = 10 V) td(off) 11 40 ns
Diode Forward OnVoltage (IS = 115 mAdc, V GS = 0 V) VSD -1.5 Vdc
Source Current Continuous (Body Diode) IS -115 mAdc
Source Current Pulsed (Body Diode) ISM -800 mAdc

Note 1: The Power Dissipation of the package may result in a lower continuous drain current.

Note 2: Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%.

Note 3: FR5 Board = 1.0 x 0.75 x 0.062 in.

Note 4: Alumina = 0.4 x 0.3 x 0.025 in 99.5% alumina.

SOT-723 Package Dimensions

Dimension MILLIMETERS INCHES
MIN NOM MAX MIN NOM MAX
A 0.45 0.50 0.55 0.018 0.020 0.022
b 0.15 0.20 0.27 0.0059 0.0079 0.0106
b1 0.25 0.3 0.35 0.010 0.012 0.014
C 0.07 0.12 0.17 0.0028 0.0047 0.0067
D 1.15 1.20 1.25 0.045 0.047 0.049
E 0.75 0.80 0.85 0.030 0.032 0.034
e 0.40 BSC 0.016 BSC
H 1.15 1.20 1.25 0.045 0.047 0.049
L 0.15 0.20 0.25 0.0059 0.0079 0.0098

NOTES:

  • 1. Dimensioning and Tolerancing per ANSI Y14.5M, 1982.
  • 2. Controlling Dimension: Millimeters.
  • 3. Maximum lead thickness includes lead finish. Minimum lead thickness is the minimum thickness of base material.
  • 4. Dimensions D and E do not include mold flash, protrusions or gate burrs.

1806142033_LRC-L2N7002M3T5G_C172394.pdf

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