1.8 Volt Rated N Channel MOSFET LRC LSI1012LT1G with Low Threshold Voltage and Fast Switching Speed

Key Attributes
Model Number: LSI1012LT1G
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
500mA
Operating Temperature -:
-55℃~+150℃
RDS(on):
1.25Ω@1.8V,350mA
Gate Threshold Voltage (Vgs(th)):
900mV@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
-
Number:
1 N-channel
Input Capacitance(Ciss):
-
Output Capacitance(Coss):
-
Pd - Power Dissipation:
225mW
Gate Charge(Qg):
750pC@4.5V,10V
Mfr. Part #:
LSI1012LT1G
Package:
SOT-23
Product Description

Product Overview

The LESHAN RADIO COMPANY, LTD. S-LSI1012LT1G is an N-Channel 1.8-V (G-S) Power MOSFET designed for high-side switching applications. It features TrenchFET technology, offering low on-resistance and a low threshold voltage for ease of driving and low-voltage operation. The device includes Gate-Source ESD protection, fast switching speeds, and is suitable for battery-operated systems and power supply converter circuits. Applications include drivers for relays, solenoids, lamps, displays, and memory, as well as load/power switching in cell phones and pagers.

Product Attributes

  • Brand: LESHAN RADIO COMPANY, LTD.
  • Device Type: N-Channel MOSFET
  • Voltage Rating: 1.8-V Rated
  • Protection: Gate-Source ESD Protected
  • Package: SOT-23
  • Automotive Qualification: S- Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.

Technical Specifications

Model Shipping Marking Parameter Symbol Test Condition Min Typ Max Unit
LSI1012LT1G 10000/Tape&Reel A2 Drain-Source Voltage VDS 20 V
LSI1012LT3G 3000/Tape&Reel A2 Gate-Source Voltage VGS 6 V
Continuous Drain Current (TJ = 150 C) ID TA = 25 C 600 500 mA
Continuous Drain Current (TJ = 150 C) ID TA = 85 C 400 350 mA
Pulsed Drain Current IDM 1000 mA
Continuous Source Current (diode conduction) IS 275 250 mA
Maximum Power Dissipation P mW
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 C
Static Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250 uA 0.45 0.9 V
Gate-Body Leakage IGSS VDS = 0 V, VGS = -4.5 V 0.5 1.0 uA
Zero Gate Voltage Drain Current IDSS VDS = 20 V, VGS = 0 V 0.3 100 nA
Zero Gate Voltage Drain Current IDSS VDS = 20 V, VGS = 0 V, TJ = 85 C 5 uA
On-State Drain Current ID(on) VDS = 5 V, VGS = 4.5 V 700 mA
Drain-Source On-State Resistance rDS(on) VGS = 4.5 V, ID = 600 mA 0.41 0.70 Ohm
Drain-Source On-State Resistance rDS(on) VGS = 2.5 V, ID = 500 mA 0.53 0.85 Ohm
Drain-Source On-State Resistance rDS(on) VGS = 1.8 V, ID = 350 mA 0.70 1.25 Ohm
Forward Transconductance gfs VDS = 10 V, ID = 400 mA 1.0 S
Diode Forward Voltage VSD IS = 150 mA, VGS = 0 V 0.8 1.2 V
Total Gate Charge Qg VDS = 10 V, VGS = 4.5 V, ID = 250 mA 750 pC
Gate-Source Charge Qgs 75 pC
Gate-Drain Charge Qgd 225 pC
Turn-On Delay Time td(on) VDD = 10 V, RL = 47 Ohm, ID = 200 mA, VGEN = 4.5 V, RG = 10 Ohm 5 ns
Rise Time tr 5 ns
Turn-Off Delay Time td(off) 25 ns
Fall Time tf 11 ns

Notes:

  • Pulse width limited by maximum junction temperature.
  • Surface Mounted on FR4 Board.
  • Pulse test; pulse width <= 300 us, duty cycle <= 2%.
  • Guaranteed by design, not subject to production testing.

1809051322_LRC-LSI1012LT1G_C136183.pdf

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