Surface Mount N Channel MOSFET LRC LN2312LT1G with Low On Resistance and 2.5V Gate Drive Capability

Key Attributes
Model Number: LN2312LT1G
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
4.9A
Operating Temperature -:
-55℃~+150℃
RDS(on):
41mΩ@4.5V,5A
Gate Threshold Voltage (Vgs(th)):
600mV
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
140pF
Number:
1 N-channel
Output Capacitance(Coss):
300pF
Input Capacitance(Ciss):
500pF
Pd - Power Dissipation:
750mW
Mfr. Part #:
LN2312LT1G
Package:
SOT-23
Product Description

Product Overview

The LN2312LT1G and S-LN2312LT1G are N-Channel Enhancement-Mode MOSFETs from LESHAN RADIO COMPANY, LTD., designed for high-density cell applications to achieve ultra-low on-resistance. These devices feature advanced trench process technology and are suitable for various applications requiring efficient power management. They offer a 2.5V gate drive capability and a lower on-resistance, available in a surface mount SOT-23 package. The S-prefix variants are AEC-Q101 Qualified and PPAP Capable, meeting automotive requirements.

Product Attributes

  • Brand: LESHAN RADIO COMPANY, LTD.
  • Technology: Advanced trench process technology
  • Cell Design: High Density Cell Design
  • Package: SOT 23 (TO236AB)
  • Compliance: RoHS requirements
  • Automotive Qualification (S-prefix): AEC-Q101 Qualified and PPAP Capable

Technical Specifications

Parameter Symbol Test Condition Min Typ Max Unit
Absolute Maximum Ratings
Drain-Source Voltage VDS 20 V
Gate-Source Voltage VGS 8 V
Continuous Drain Current (TA=25) ID@TA=25 VGS @ 4.5V 3.4 A
Continuous Drain Current (TA=70) ID@TA=70 VGS @ 4.5V 4.9 A
Pulsed Drain Current IDM 15 A
Total Power Dissipation (TA=25) PD@TA=25 0.75 W
Linear Derating Factor 1.3 W/
Storage Temperature Range TSTG -55 150
Operating Junction Temperature Range TJ -55 150
Thermal Resistance
Junction-ambient Rthj-a 3 140 /W
Electrical Characteristics@Tj=25 (unless otherwise specified)
Static Drain-Source Breakdown Voltage BVDSS VGS = 0V, ID = 250uA 20 - - V
Drain-Source On-State Resistance RDS(on) VGS = 1.8V, ID = 4.0A 31 57 m
Drain-Source On-State Resistance RDS(on) VGS = 2.5V, ID = 4.5A 24 47 m
Drain-Source On-State Resistance RDS(on) VGS = 4.5V, ID = 5A 21 41 m
Gate Threshold Voltage VGS(th) VDS =VGS, ID = 250uA 0.4 0.6 1 V
Zero Gate Voltage Drain Current IDSS VDS = 20V, VGS = 0V 1 uA
Gate Body Leakage IGSS VGS = +8V, VDS = 0V 100 nA
Gate Resistance Rg 25
Forward Transconductance gfs VDS = 10V, ID = 5A 40 S
Dynamic
Total Gate Charge Qg VDD = 10V, D = 1, VGEN = 4.5V RG = 6 11.2 nC
Gate-Source Charge Qgs 1.4 nC
Gate-Drain Charge Qg 2.2 nC
Turn-On Delay Time td(on) 15 ns
Turn-On Rise Time tr 40 ns
Turn-Off Delay Time td(off) 48 ns
Turn-Off Fall Time tf 31 ns
Input Capacitance Ciss VDS = 10V, ID = 5A VGS = 4.5V 500 pF
Output Capacitance Coss 300 pF
Reverse Transfer Capacitance Crss 140 pF
Source-Drain Diode
Max. Diode Forward Current IS 1.7 A
Diode Forward Voltage VSD IS = 1.7A, VGS = 0V 1.2 V
Ordering Information
Model
LN2312LT1G
S-LN2312LT1G Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.
LN2312LT3G
S-LN2312LT3G Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.
Device Marking
LN2312LT1G N12
LN2312LT3G N12
Shipping
3000/Tape&Reel
10000/Tape&Reel

Notes:

  • 1. Pulse width limited by Max. junction temperature.
  • 2. Pulse width <300us , duty cycle <2%.
  • 3. Surface mounted on 1 in copper PCB board.

1809291621_LRC-LN2312LT1G_C91165.pdf

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