Fast Switching Silicon N channel MOSFET Minos MD100N20 with 200V Drain to Source Voltage and Low RDS

Key Attributes
Model Number: MD100N20
Product Custom Attributes
Drain To Source Voltage:
200V
Current - Continuous Drain(Id):
100A
Operating Temperature -:
-55℃~+150℃@(Tj)
RDS(on):
23mΩ@10V,40A
Gate Threshold Voltage (Vgs(th)):
4V
Reverse Transfer Capacitance (Crss@Vds):
57pF@25V
Number:
1 N-channel
Input Capacitance(Ciss):
9.65nF@25V
Pd - Power Dissipation:
390W
Gate Charge(Qg):
152nC@10V
Mfr. Part #:
MD100N20
Package:
TO-247
Product Description

Product Description

The MD100N20 is a silicon N-channel Enhanced MOSFET, developed using advanced MOSFET technology. This technology significantly reduces conduction losses, improves switching performance, and enhances avalanche energy. It is an ideal transistor for applications such as Switched-Mode Power Supplies (SMPS), high-speed switching, and general-purpose use.

General Features

  • VDS=200V, ID=100A
  • RDS(ON) < 28m @ VGS=10V
  • Fast Switching
  • Low Crss
  • 100% avalanche tested
  • Improved dv/dt capability
  • RoHS product

Application

  • High frequency switching mode power supply

Product Attributes

  • Brand: MNS-KX (Shenzhen Minos)
  • Origin: Shenzhen, China
  • Material: Silicon N-channel Enhanced MOSFET
  • Certifications: RoHS

Technical Specifications

SymbolParameterTest ConditionsMin.Typ.Max.Units
Absolute Maximum Ratings
VDSSDrain-to-Source Voltage200V
IDContinuous Drain Current @ TC=25C100A
IDContinuous Drain Current @ TC=100C50A
IDMPulsed Drain Current (Note1)320A
VGSGate-to-Source Voltage30V
EASSingle Pulse Avalanche Energy (Note2)2600mJ
dv/dtPeak Diode Recovery dv/dt (Note3)5.0V/ns
PDPower Dissipation @ TO-3PN/TO-247390W
TJ, TstgOperating Junction and Storage Temperature Range55150
TLMaximum Temperature for Soldering300
Thermal Characteristics
RJCJunction-to-Case0.32/W
RJAJunction-to-Ambient40/W
Electrical Characteristics
VDSSDrain to Source Breakdown VoltageVGS=0V, ID=250A200----V
BVDSS/TJBvdss Temperature CoefficientID=250uA, Reference 25C--0.25--V/
IDSSDrain to Source Leakage CurrentVDS =200V, VGS= 0V, Tj = 25----1A
IDSSDrain to Source Leakage CurrentVDS =160V, VGS= 0V, Tj =125----10A
IGSS(F)Gate to Source Forward LeakageVGS=+30V----100nA
IGSS(R)Gate to Source Reverse LeakageVGS=-30V----100nA
RDS(ON)Drain-to-Source On- ResistanceVGS=10V, ID=40A (Note4)--2328m
VGS(TH)Gate Threshold VoltageVDS = VGS, ID=250A (Note4)2.0--4.0V
gfsForward TransconductanceVDS=15V, ID=40A (Note4)--50--S
Dynamic Characteristics
RgGate resistancef = 1.0MHz--0.95--
CissInput CapacitanceVGS=0V, VDS=25V, f=1.0MHz--9650--PF
CossOutput Capacitance--968--PF
CrssReverse Transfer Capacitance--57--PF
Switching Characteristics
td(ON)Turn-on Delay TimeID =100A, VDD = 100V, VGS = 10V, RG =20--60--ns
trRise Time--250--ns
td(OFF)Turn-Off Delay Time--92--ns
tfFall Time--118--ns
QgTotal Gate ChargeID =100A, VDD =160V, VGS = 10V--152--nC
QgsGate to Source Charge--56--nC
QgdGate to Drain (Miller)Charge--39.5--nC
Source-Drain Diode Characteristics
ISContinuous Source Current (Body Diode) @ TC=25 C----100A
ISMMaximum Pulsed Current (Body Diode)----320A
VSDDiode Forward VoltageIS=100A, VGS=0V (Note4)----1.2V
TrrReverse Recovery TimeIS=100A, Tj = 25C, dIF/dt=100A/us, VGS=0V--192--ns
QrrReverse Recovery Charge--1853--nC
IrrmReverse Recovery Current--19.3--A

2410122013_Minos-MD100N20_C6719394.pdf

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