High Voltage N Channel MOSFET Minos MD59N30 with Fast Switching and Low Capacitance Characteristics

Key Attributes
Model Number: MD59N30
Product Custom Attributes
Drain To Source Voltage:
300V
Current - Continuous Drain(Id):
59A
RDS(on):
35mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
49pF
Number:
1 N-channel
Input Capacitance(Ciss):
9.55nF
Pd - Power Dissipation:
420W
Output Capacitance(Coss):
895pF
Gate Charge(Qg):
155nC@10V
Mfr. Part #:
MD59N30
Package:
TO-3P
Product Description

Product Description

The MD59N30 is an N-Channel Enhanced MOSFET designed using advanced MOSFET technology to minimize conduction losses, improve switching performance, and enhance avalanche energy. It is suitable for high-frequency switching mode power supplies (SMPS), high-speed switching, and general-purpose applications.

Product Attributes

  • Brand: MNS-KX
  • Origin: Shenzhen Minos Technology Co., Ltd.
  • Certifications: RoHS product
  • Package: TO-3PN

Technical Specifications

ParameterValueUnitConditions
General Features
VDS300V
ID59A
RDS(ON)< 45mVGS=10V
SwitchingFast
CapacitanceLow Crss
Avalanche Test100% tested
dv/dt CapabilityImproved
Absolute Maximum Ratings
VDSS300Vat TC = 25C, unless otherwise specified
ID (Continuous Drain Current)59Aat TC = 25C
ID (Continuous Drain Current)36.6Aat TC = 100C
IDM (Pulsed Drain Current)236A(Note1)
VGS (Gate-to-Source Voltage)30V
EAS (Single Pulse Avalanche Energy)2600mJ(Note2)
dv/dt (Peak Diode Recovery)5.0V/ns(Note3)
PD (Power Dissipation)420WTO-247
Derating Factor above 25C3.5W/
TJ, Tstg (Operating Junction and Storage Temperature Range)-55 to 150
TL (Maximum Temperature for Soldering)300
Thermal Characteristics
RJC (Junction-to-Case)0.29/W
RJA (Junction-to-Ambient)40/W
Electrical Characteristics (OFF Characteristics)
VDSS (Drain to Source Breakdown Voltage)300VVGS=0V, ID=250A
BVDSS/ TJ (Bvdss Temperature Coefficient)0.25V/ID=250uA, Reference 25
IDSS (Drain to Source Leakage Current)1AVDS=300V, VGS=0V, Tj = 25
IDSS (Drain to Source Leakage Current)10AVDS =240V, VGS=0V, Tj = 125
IGSS(F) (Gate to Source Forward Leakage)100nAVGS=+30V
IGSS(R) (Gate to Source Reverse Leakage)100nAVGS=-30V
Electrical Characteristics (ON Characteristics)
RDS(ON) (Drain-to-Source On- Resistance)35-45mVGS=10V, ID=29.5A(Note4)
VGS(TH) (Gate Threshold Voltage)2.0-4.0VVDS = VGS, ID = 250A(Note4)
gfs (Forward Transconductance)52SVDS=15V, ID =40A(Note4)
Dynamic Characteristics
Rg (Gate resistance)0.85f = 1.0MHz
Ciss (Input Capacitance)9550PFVGS = 0V, VDS=25V, f=1.0MHz
Coss (Output Capacitance)895PF
Crss (Reverse Transfer Capacitance)49PF
Switching Characteristics
td(ON) (Turn-on Delay Time)160nsID =59A, VDD=150V, VGS= 10V, RG =20
tr (Rise Time)550ns
td(OFF) (Turn-Off Delay Time)122ns
tf (Fall Time)198ns
Qg (Total Gate Charge)155nCID =59A, VDD=240V, VGS = 10V
Qgs (Gate to Source Charge)46nC
Qgd (Gate to Drain (Miller)Charge)40nC
Source-Drain Diode Characteristics
IS (Continuous Source Current (Body Diode))59ATC=25 C
ISM (Maximum Pulsed Current (Body Diode))36.6A
VSD (Diode Forward Voltage)1.2VIS=59A, VGS=0V(Note4)
Trr (Reverse Recovery Time)236nsIS=59A, Tj = 25C, dIF/dt=100A/us, VGS=0V
Qrr (Reverse Recovery Charge)6879nC
Irrm (Reverse Recovery Current)58.3A

2506121200_Minos-MD59N30_C49108787.pdf

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