1200 Volt 40 Amp Field Stop Trench IGBT onsemi FGY40T120SMD ideal for UPS and power factor correction

Key Attributes
Model Number: FGY40T120SMD
Product Custom Attributes
Pd - Power Dissipation:
882W
Td(off):
475ns
Td(on):
40ns
Collector-Emitter Breakdown Voltage (Vces):
1.2kV
Reverse Transfer Capacitance (Cres):
100pF
IGBT Type:
FS (Field Stop)
Gate-Emitter Threshold Voltage (Vge(th)@Ic):
4.9V@40mA
Operating Temperature:
-55℃~+175℃
Gate Charge(Qg):
370nC@15V
Reverse Recovery Time(trr):
65ns
Switching Energy(Eoff):
1.1mJ
Turn-On Energy (Eon):
2.7mJ
Pulsed Current- Forward(Ifm):
240A
Output Capacitance(Coes):
180pF
Mfr. Part #:
FGY40T120SMD
Package:
TO-247-3
Product Description

ON Semiconductor FGY40T120SMD - 1200 V, 40 A Field Stop Trench IGBT

The FGY40T120SMD is a Field Stop Trench IGBT from ON Semiconductor, utilizing innovative FS Trench technology for optimal performance in hard switching applications. It offers a positive temperature coefficient, high speed switching, and low saturation voltage, making it suitable for solar inverters, UPS, welders, and PFC applications.

Product Attributes

  • Brand: ON Semiconductor (formerly Fairchild Semiconductor)
  • Technology: FS Trench Technology
  • Certifications: RoHS Compliant

Technical Specifications

Symbol Description Test Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings
VCES Collector to Emitter Voltage 1200 V
VGES Gate to Emitter Voltage ±25 V
ILM (1) Clamped Inductive Load Current @ TC = 25oC 160 A
ICM (2) Pulsed Collector Current 160 A
IF Diode Continuous Forward Current @ TC = 25oC 80 A
IFM Diode Maximum Forward Current 240 A
PD Maximum Power Dissipation @ TC = 25oC 882 W
TJ Operating Junction Temperature -55 +175 oC
Tstg Storage Temperature Range -55 +175 oC
Thermal Characteristics
RJC(IGBT) Thermal Resistance, Junction to Case -- 0.17 oC/W
RJC(Diode) Thermal Resistance, Junction to Case -- 0.55 oC/W
RJA Thermal Resistance, Junction to Ambient -- 40 oC/W
Electrical Characteristics of the IGBT
BVCES Collector to Emitter Breakdown Voltage VGE = 0 V, IC = 250 uA 1200 - - V
ICES Collector Cut-Off Current VCES = VCES, VGE = 0 V - - 250 uA
IGES G-E Leakage Current VGE = VGES, VCE = 0 V - - ±400 nA
VGE(th) G-E Threshold Voltage IC = 40 mA, VCE = VGE 4.9 6.2 7.5 V
VCE(sat) Collector to Emitter Saturation Voltage IC = 40 A, VGE = 15 V, TC = 25oC - 1.8 2.4 V
VCE(sat) Collector to Emitter Saturation Voltage IC = 40 A, VGE = 15 V, TC = 175oC - 2.0 - V
Cies Input Capacitance VCE = 30 V, VGE = 0 V, f = 1MHz - 4300 - pF
Coes Output Capacitance - 180 - pF
Cres Reverse Transfer Capacitance - 100 - pF
td(on) Turn-On Delay Time VCC = 600 V, IC = 40 A, RG = 10 , VGE = 15 V, Inductive Load, TC = 25oC - 40 - ns
tr Rise Time - 47 - ns
td(off) Turn-Off Delay Time - 475 - ns
tf Fall Time - 10 - ns
Eon Turn-On Switching Loss - 2.7 - mJ
Eoff Turn-Off Switching Loss - 1.1 - mJ
Ets Total Switching Loss - 3.8 - mJ
Qg Total Gate Charge VCE = 600 V, IC = 40 A, VGE = 15 V - 370 - nC
Qge Gate to Emitter Charge - 23 - nC
Qgc Gate to Collector Charge - 210 - nC
Electrical Characteristics of the DIODE
VFM Diode Forward Voltage IF = 40 A, TC = 25oC - 3.8 4.8 V
VFM Diode Forward Voltage IF = 40 A, TC = 175oC - 2.7 - V
trr Diode Reverse Recovery Time VR = 600 V, IF = 40 A, diF/dt = 200 A/us, TC = 25oC - 65 - ns
Qrr Diode Reverse Recovery Charge - 234 - nC
Erec Reverse Recovery Energy VR = 600 V, IF = 40 A, diF/dt = 200 A/us, TC = 175oC - 97 - uJ

2410121610_onsemi-FGY40T120SMD_C898205.pdf

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