N Channel Power MOSFET NH NPS16N65F Featuring Low Gate Charge and High EAS for Switching Applications

Key Attributes
Model Number: NPS16N65F
Product Custom Attributes
Drain To Source Voltage:
650V
Configuration:
-
Current - Continuous Drain(Id):
10A
RDS(on):
830.8mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
28pF
Number:
1 N-channel
Output Capacitance(Coss):
225pF
Input Capacitance(Ciss):
2.75nF
Pd - Power Dissipation:
14W
Gate Charge(Qg):
60nC@10V
Mfr. Part #:
NPS16N65F
Package:
TO-220F
Product Description

Product Overview

The NPS16N65F is an N-Channel Enhancement Mode Power MOSFET from Guangdong Niuhang Specification Electronic Technology Co., Ltd. Designed for high efficiency and high-speed switching, this MOSFET features low RDS(ON), low gate charge, and high EAS for enhanced reliability. It is ideal for applications such as AC/DC converters, adaptors, chargers, LED drives, high-frequency circuits, and switching power supplies. The product is 100% UIS and RG tested.

Product Attributes

  • Brand: Niuhang (NH)
  • Origin: Guangdong, China
  • Product Line Code: FF
  • Certifications: RoHS COMPLIANT, Pb-Free
  • Package: TO-220F

Technical Specifications

Model ID VDS (Volts) Current (Amperes) RDS(ON) Type @ 10V (m) Package Weight (Grams)
NPS16N65F 650 16 480.00 TO-220F 2.048
Parameter Test Conditions Symbol Min. Typ. Max. Unit
Absolute Maximum Ratings (Ta=25 Unless Otherwise Specified)
Drain-Source Voltage VDS 650 V
Gate-Source Voltage VGS 30 V
Continuous Drain Current (Note 1) Ta= 25 ID 16 A
Continuous Drain Current (Note 1) Ta= 100 ID 10 A
Drain Current-Pulsed (Note 1) TJ< 150 IDM 64 A
Maximum Power Dissipation Ta= 25 PD 34 W
Power Dissipation Derating Factor Above 25 Ta= 100 DF 0.27 W/
Junction Temperature TJ -55 150
Storage Temperature Range TSTD -55 150
Avalanche Current,Single Pulse (Note 1) L= 0.5 mH IAS 58.2 A
Single Pulse Avalanche Energy (Note 1) L= 0.5 mH,VDD= 325 V EAS 845 mJ
Thermal Characteristics (Ta=25 Unless Otherwise Specified)
Thermal Resistance Junction To Ambient Still Air Environment With Ta =25C RJA 52.0 /W
Thermal Resistance Junction-Case Device Mounted On 1 in 2 FR-4 Board With 2oz RJC 3.70 /W
Electrical Characteristics (Ta=25 Unless Otherwise Specified)
Static Off Characteristics
Drain-Source Breakdown Voltage VGS=0V,ID=250uA BV DSS 650 -- -- V
Bvdss Temperature Coefficient ID=250uA,Reference25 BV DSS/T J -- 0.772 -- V/
Drain-Source Leakage Current VDS= 650 V,VGS=0V I DSS -- -- 1.0 uA
Gate-Body Leakage Current VGS= 30 V,VDS=0V I GSS -- -- 100 nA
Static On Characteristics
Gate Threshold Voltage VGS= VDS ID=250uA V GS(TH) 2.0 3.0 4.0 V
Drain-Source On Resistance ID= 8 A,VGS= 10 V R DS(ON) -- 480.00 620.00 m
Drain-Source On Resistance ID= 8 A,VGS= 4.5 V R DS(ON) -- 552.00 830.80 m
Dynamic Characteristics
Gate Resistance VGS=0V,VDS=0V, Freq.=1MHz R g -- 2.50 --
Input Capacitance VDS= 25 V C iss -- 2750.0 -- pF
Output Capacitance VGS= 0 V C oss -- 225.0 -- pF
Reverse Transfer Capacitance F= 1 MHZ C rss -- 28.0 -- pF
Switching Parameters (Test Circuit & Waveform See Fig.14)
Turn-On Delay Time VDS= 325 V t d(on) -- 40.0 -- ns
Turn-On Rise Time VGS= 10 V t r -- 50.0 -- ns
Turn-Off Delay Time RL= 1.2 t d(off) -- 175.0 -- ns
Turn-Off Rise Time RG= 10 t f -- 69.0 -- ns
Gate Charge Parameters (Test Circuit & Waveform See Fig.15)
Total Gate Charge VDS= 325 V Q g -- 60.0 -- nC
Gate-Source Charge VGS= 10 V Q gs -- 15.0 -- nC
Gate-Drain Charge ID= 8 A Q gd -- 25.0 -- nC
Drain-Source Diode Characteristics And Maximum Ratings (Test Circuit & Waveform See Fig.17)
Max. Diode Forward Current I S -- -- 16 A
Max. Pulsed Forward Current I SM -- -- 56 A
Diode Forward Voltage ID= 8 A,VGS=0V V SD -- 0.87 1.2 V
Reverse Recovery Time ID= 8 A,di/dt= 100 A/us t rr -- 475 -- ns
Reverse Recovery Charge VGS= 10 V,VDS= 325 V Q rr -- 7.0 -- uC
OUTLINE DRAWINGS - TO-220F
Dim Description Millimeters Inches
A 9.25 - 10.75 0.36 - 0.42
B 2.30 - 2.90 0.09 - 0.11
C 4.20 - 5.20 0.17 - 0.20
D 0.35 - 0.75 0.01 - 0.03
E 14.80 - 16.80 0.58 - 0.66
F 8.25 - 9.75 0.32 - 0.38
G 12.15 - 14.15 0.48 - 0.56
H 2.40 - 3.00 0.09 - 0.12
J 1.10 - 1.50 0.04 - 0.06
K 0.60 - 1.00 0.02 - 0.04
M 2.20 - 3.00 0.09 - 0.12
O 2.70 - 3.50 0.11 - 0.14
P 2.25 - 2.85 0.09 - 0.11
PACKING INFORMATION
Package Code Package Method Inner Box Size LWH(mm) Quantity (Pcs/Inner Box) Outer Carton Size LWH(mm) Quantity (Pcs/Carton)
TO-220F Tube Packaging 560x155x55 1000 570284185 5000
Recommended wave soldering condition
Pb-free devices
Product Peak Temperature 260 +0/-5 C Soldering Time 5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature Sn-Pb eutectic Assembly Pb-free Assembly
Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max.
Preheat
Temperature Min(TS min) 100C 150C
Temperature Max(TS max) 150C 200C
Time(ts min to ts max) 60-120 seconds 60-180 seconds
Time maintained above:
Temperature (TL) 183C 217C
Time (tL) 60-150 seconds 60-150 seconds
Peak Temperature(TP) 240 +0/-5 C 260 +0/-5 C
Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds
Ramp down rate 6C/second max. 6C/second max.
Time 25 C to peak temperature 6 minutes max. 8 minutes max.

2411011351_NH-NPS16N65F_C41784109.pdf

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