Field Stop IGBT onsemi FGH40N60UFDTU 600 Volt 40 Amp Optimized for UPS Telecom and Welding Power Circuits

Key Attributes
Model Number: FGH40N60UFDTU
Product Custom Attributes
Td(off):
112ns
Pd - Power Dissipation:
290W
Td(on):
24ns
Collector-Emitter Breakdown Voltage (Vces):
600V
Reverse Transfer Capacitance (Cres):
60pF
IGBT Type:
FS (Field Stop)
Gate-Emitter Threshold Voltage (Vge(th)@Ic):
4V@250uA
Gate Charge(Qg):
120nC
Operating Temperature:
-55℃~+150℃@(Tj)
Reverse Recovery Time(trr):
45ns
Switching Energy(Eoff):
460uJ
Turn-On Energy (Eon):
1.19mJ
Input Capacitance(Cies):
2.11nF
Output Capacitance(Coes):
200pF
Mfr. Part #:
FGH40N60UFDTU
Package:
TO-247
Product Description

FGH40N60UFD IGBT - Field Stop 600 V, 40 A

Utilizing novel Field Stop IGBT technology, ON Semiconductor's field stop IGBTs deliver optimal performance for applications such as solar inverters, UPS, welders, microwave ovens, telecom, ESS, and PFC. These devices are designed for scenarios requiring low conduction and switching losses, offering high current capability, low saturation voltage (VCE(sat) = 1.8 V @ IC = 40 A), high input impedance, and fast switching. The device is Pb-Free and RoHS Compliant.

Product Attributes

  • Brand: ON Semiconductor
  • Certifications: Pb-Free, RoHS Compliant

Technical Specifications

SymbolDescriptionRatingsUnit
ABSOLUTE MAXIMUM RATINGS
VCESCollector to Emitter Voltage600V
VGESGate to Emitter Voltage±20V
Transient Gate-to-Emitter Voltage±30V
ICCollector Current (TC = 25°C)80A
Collector Current (TC = 100°C)40A
ICM (Note 1)Pulsed Collector Current (TC = 25°C)120A
PDMaximum Power Dissipation (TC = 25°C)290W
Maximum Power Dissipation (TC = 100°C)116W
TJOperating Junction Temperature-55 to +150°C
TSTGStorage Temperature Range-55 to +150°C
TLMaximum Lead Temp. for Soldering Purposes, 1/8 from Case for 5 Seconds300°C
THERMAL CHARACTERISTICS
RJC (IGBT)Thermal Resistance, Junction to Case-0.43 °C/W
RJC (Diode)Thermal Resistance, Junction to Case-1.45 °C/W
RJAThermal Resistance, Junction to Ambient-40 °C/W
ELECTRICAL CHARACTERISTICS OF THE IGBT (TC = 25°C unless otherwise noted)
BVCESCollector to Emitter Breakdown Voltage (VGE = 0 V, IC = 250 µA)600V
BVCES / ΔTJTemperature Coefficient of Breakdown Voltage (VGE = 0 V, IC = 250 µA)- 0.6V/°C
ICESCollector Cut-Off Current (VCE = VCES, VGE = 0 V)-250 µA
IGESG-E Leakage Current (VGE = VGES, VCE = 0 V)-±400 nA
VGE(th)G-E Threshold Voltage (IC = 250 µA, VCE = VGE)4.0 - 6.5V
VCE(sat)Collector to Emitter Saturation Voltage (IC = 40 A, VGE = 15 V)- 2.4V
Collector to Emitter Saturation Voltage (IC = 40 A, VGE = 15 V, TC = 125°C)- 2.0V
DYNAMIC CHARACTERISTICS
CiesInput Capacitance (VCE = 30 V, VGE = 0 V, f = 1 MHz)- 2110pF
CoesOutput Capacitance- 200pF
CresReverse Transfer Capacitance- 60pF
SWITCHING CHARACTERISTICS (TC = 25°C)
EonTurn-On Switching Loss- 1.19mJ
EoffTurn-Off Switching Loss- 0.46mJ
EtsTotal Switching Loss- 1.65mJ
SWITCHING CHARACTERISTICS (TC = 125°C)
EonTurn-On Switching Loss- 1.2mJ
EoffTurn-Off Switching Loss- 0.69mJ
EtsTotal Switching Loss- 1.89mJ
GATE CHARGE CHARACTERISTICS
QgTotal Gate Charge (VCE = 400 V, IC = 40 A, VGE = 15 V)- 120nC
QgeGate to Emitter Charge- 14nC
QgcGate to Collector Charge- 58nC
ELECTRICAL CHARACTERISTICS OF THE DIODE (TC = 25°C unless otherwise noted)
VFMDiode Forward Voltage (IF = 20 A, TC = 25°C)- 2.6V
Diode Forward Voltage (IF = 20 A, TC = 125°C)- 1.85V
TrrDiode Reverse Recovery Time (IF = 20 A, diF/dt = 200 A/µs, TC = 25°C)- 45ns
Diode Reverse Recovery Time (IF = 20 A, diF/dt = 200 A/µs, TC = 125°C)- 140ns
QrrDiode Reverse Recovery Charge (TC = 25°C)- 75nC
Diode Reverse Recovery Charge (TC = 125°C)- 375nC

2410121943_onsemi-FGH40N60UFDTU_C442452.pdf

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