Gallium Nitride GaN FET Renesas TP65H100G4PS 650V TO220 Package for High Speed Power Circuits

Key Attributes
Model Number: TP65H100G4PS
Product Custom Attributes
Mfr. Part #:
TP65H100G4PS
Package:
TO-220
Product Description

Product Overview

The TP65H100G4PS is a 650V, 92m Gallium Nitride (GaN) FET utilizing Renesass Gen IV platform. This normally-off device integrates a high-voltage GaN HEMT with a low-voltage silicon MOSFET, offering enhanced reliability and performance. The Gen IV SuperGaN platform leverages advanced epitaxy and patented design technologies to improve manufacturability and efficiency over silicon by reducing gate charge, output capacitance, crossover loss, and reverse recovery charge. It is designed for increased efficiency in both hard- and soft-switched circuits, leading to higher power density, reduced system size and weight, and lower overall system cost. It is easy to drive with commonly-used gate drivers, and its GSD pin layout aids high-speed design.

Product Attributes

  • Brand: Renesas
  • Platform: Gen IV SuperGaN
  • Material: Gallium Nitride (GaN)
  • Certifications: JEDEC-qualified, RoHS compliant, Halogen-free packaging

Technical Specifications

Part NumberPackageVDS (V) minVDSS(TR) (V) maxRDS(on) (m) max*QOSS (nC) typQG (nC) typ
TP65H100G4PSTO-2206508001105614.4

Absolute Maximum Ratings

SymbolParameterLimit ValueUnit
VDSSDrain to source voltage (TJ = -55C to 150C)650V
VDSS(TR)Transient drain to source voltage (a)800V
VGSSGate to source voltage20V
PDMaximum power dissipation @TC=25C65.8W
IDContinuous drain current @TC=25C (b)18.9A
IDContinuous drain current @TC=100C (b)12A
IDMPulsed drain current (pulse width: 10s)95A
TCOperating temperature Case-55 to +150C
TJJunction-55 to +150C
TSStorage temperature-55 to +150C
TSOLDReflow soldering temperature (c)260C

Thermal Resistance

SymbolParameterTypicalUnit
RJCJunction-to-case1.9C/W
RJAJunction-to-ambient (d)50C/W

ESD

SymbolParameterMaximumUnit
HDMHuman-body model750V
CDMCharged-device model2000V

Electrical Parameters

SymbolParameterMinTypMaxUnitTest Conditions
Forward Device Characteristics
VDSS(BL)Maximum drain-source voltage650VVGS=0V
VGS(th)Gate threshold voltage3.23.654.1VVDS=VGS, ID=1.8mA
VGS(th)/TJGate threshold voltage temperature coefficient-5.8mV/C
RDS(on)effDrain-source on-resistance (f)92110mVGS=10V, ID=12A, TJ=25C
RDS(on)effDrain-source on-resistance (f)184mVGS=10V, ID=12A, TJ=150C
IDSSDrain-to-source leakage current2.525AVDS=650V, VGS=0V, TJ=25C
IDSSDrain-to-source leakage current5AVDS=650V, VGS=0V, TJ=150C
IGSSGate-to-source forward leakage current100nAVGS=20V
IGSSGate-to-source reverse leakage current-100nAVGS=-20V
CISSInput capacitance818pFVGS=0V, VDS=400V, f=500kHz
COSSOutput capacitance53pF
CRSSReverse transfer capacitance3.6pF
CO(er)Output capacitance, energy related (g)78pFVGS=0V, VDS=0V to 400V
CO(tr)Output capacitance, time related (h)139pF
QGTotal gate charge14.4nCVDS=400V, VGS=0V to 10V, ID=12A
QGSGate-source charge4.7nC
QGDGate-drain charge5.2nC
QOSSOutput charge56nCVGS=0V, VDS=0V to 400V
tD(on)Turn-on delay23nsVDS=400V, VGS=0V to 12V, ID=13A, RG=36, ZFB=120 at 100MHz
tRRise time7.1ns
tD(off)Turn-off delay58ns
tFFall time7.5ns
Reverse Device Characteristics
ISReverse current12AVGS=0V, TC=100C, 20% duty cycle
VSDReverse voltage (i)1.7VVGS=0V, IS=12A
VSDReverse voltage (i)1.4VVGS=0V, IS=8A
tRRReverse recovery time17nsIS=13A, VDD=400V, di/dt=1000A/ms
QRRReverse recovery charge (j)0nCExcludes QOSS

2509151016_RENESAS-TP65H100G4PS_C46642546.pdf

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