High Voltage Silicon Carbide MOSFET SG2M021120LH with Low Switching Losses and Enhanced Power Density

Key Attributes
Model Number: SG2M021120LH
Product Custom Attributes
Drain To Source Voltage:
1.2kV
Current - Continuous Drain(Id):
112A
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
2.8V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
9pF
Input Capacitance(Ciss):
4.13nF
Pd - Power Dissipation:
441W
Gate Charge(Qg):
119nC
Mfr. Part #:
SG2M021120LH
Package:
TO-247-4L
Product Description

Product Overview

The SG2M021120LH is a 1200V Silicon Carbide (SiC) Power MOSFET from Qingchun Semiconductor (Ningbo) Co., Ltd. This N-channel enhancement mode MOSFET offers high-speed switching, very low switching losses, and fully controllable dv/dt. It features high blocking voltage with low on-resistance, a fast intrinsic diode with low reverse recovery charge (Qrr), and temperature-independent turn-off switching losses. Designed for efficiency and increased power density, it is suitable for applications such as on-board chargers/PFC, EV battery chargers, booster/DC-DC converters, and switch-mode power supplies. The device is halogen-free and RoHS compliant.

Product Attributes

  • Brand: Qingchun Semiconductor (Ningbo) Co., Ltd.
  • Product Line: TriQSiCTM
  • Material: Silicon Carbide (SiC)
  • Channel Type: N Channel Enhancement
  • Compliance: Halogen free, RoHS compliant
  • Package Type: TO-247-4L

Technical Specifications

Type VDS (V) IDS (TC = 25) (A) RDS(on), typ (VGS = 15V, ID = 64A, TJ = 25) (m) TJ,max () Marking Package
SG2M021120LH 1200 112 21 175 SG2M021120LH TO-247-4L

Key Performance Parameters

Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 1200 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -8 /+19 V Absolute maximum values Note1
VGSop Gate source voltage -4 /+15 V Recommended operational values
ID Continuous drain current 112 A VGS = 15V, TC = 25C Fig.19
ID Continuous drain current 79 A VGS = 15V, TC = 100C
ID(pulse) Pulsed drain current 224 A Pulse width tP limited by TJ,max Fig.22
PD Power dissipation 441 W TC= 25C,TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175 C
TL Soldering temperature 260 C 1.6mm (0.063) from case for 10s
Rth(j-c) Thermal resistance from junction to case 0.27 C/W Fig.21
V(BR)DSS Drain-source breakdown voltage 1200 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 - 3.6 V VDS = VGS, ID = 18mA Fig.11
VGS(th) Gate threshold voltage 2.2 V VDS = VGS, ID = 18mA, TJ = 175C
IDSS Zero gate voltage drain current 1 A VDS = 1200V, VGS = 0V
IGSS Gate source leakage current 100 nA VGS = 15V, VDS = 0V
RDS(on) Current drain-source on-state resistance 20 - 28 m VGS = 15V, ID = 64A Fig.4,5, 6
RDS(on) Current drain-source on-state resistance 35 m VGS = 15V, ID = 64A, TJ = 175C
gfs Transconductance 44 S VDS = 20V, ID = 64A Fig.7
gfs Transconductance 42 S VDS = 20V, ID = 64A, TJ = 175C
Ciss Input capacitance 4130 pF VDS = 1000V, VGS = 0V, TJ = 25C, VAC = 25mV, f = 100kHz Fig.17, 18
Coss Output capacitance 189 pF
Crss Reverse capacitance 9 pF
Eoss Coss stored energy 101 J Fig.16
Qgs Gate source charge 41 nC VDS = 800V, VGS = -4/+15V, ID = 64A Fig.12
Qgd Gate drain charge 37 nC
Qg Gate charge 119 nC
Eon Turn on switching energy 1032 J VDS = 800V, VGS = -4/+15V, ID = 64A, Rg = 2.5, L = 16.7H Fig.26
Eoff Turn off switching energy 274 J
tdon Turn on delay time 31 ns Fig.27
tr Rise time 24 ns
tdoff Turn off delay time 45 ns
tf Fall time 11 ns
VSD Diode forward voltage 4.0 V VGS = -4V, ISD = 32A Fig.8,9, 10
VSD Diode forward voltage 3.5 V VGS = -4V, ISD = 32A, TJ = 175C
IS Continuous diode forward current 98 A VGS = -4V, Tc = 25C Note2
trr Reverse recovery time 45 ns VR = 800V, VGS = -4V, ISD = 64A, di/dt = 2341A/s, TJ = 175C
Qrr Reverse recovery charge 740 nC
Irrm Peak reverse recovery current 29 A

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