High Voltage Silicon Carbide MOSFET SG2M040120LH with Low Reverse Recovery Charge and TO 247 Package

Key Attributes
Model Number: SG2M040120LH
Product Custom Attributes
Mfr. Part #:
SG2M040120LH
Package:
TO-247-4L
Product Description

Product Overview

The SG2M040120LH is a 1200V Silicon Carbide (SiC) Power MOSFET designed for high-speed switching applications. It offers very low switching losses, IGBT-compatible driving voltage, fully controllable dv/dt, and high blocking voltage with low on-resistance. The device features a fast intrinsic diode with low reverse recovery charge (Qrr) and temperature-independent turn-off switching losses. These characteristics contribute to reduced cooling effort, improved efficiency, increased power density, and the ability to operate at higher system switching frequencies. It is halogen-free and RoHS compliant, making it suitable for demanding applications such as on-board chargers, EV battery chargers, booster/DC-DC converters, and switch-mode power supplies.

Product Attributes

  • Brand: (Sichain Semiconductor)
  • Material: Silicon Carbide (SiC)
  • Compliance: Halogen Free, RoHS Compliant, REACH Compliant
  • Package Type: TO-247-4L
  • Channel Type: N Channel Enhancement

Technical Specifications

Type VDS (V) IDS (TC = 25, A) RDS(on), typ (m) TJ,max () Package Marking
SG2M040120LH 1200 62 40 (VGS = 15V, ID = 32A, TJ = 25) 175 TO-247-4L SG2M040120LH
Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 1200 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -8 /+19 V Absolute maximum values Note1
VGSop Gate source voltage -4 /+15 V Recommended operational values
ID Continuous drain current 62 A VGS = 15V, TC = 25C Fig.19
ID Continuous drain current 44 A VGS = 15V, TC = 100C
ID(pulse) Pulsed drain current 124 A Pulse width tP limited by TJ,max Fig.22
PD Power dissipation 268 W TC= 25C,TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175
TL Soldering temperature 260 1.6mm (0.063) from case for 10s
TM Mounting torque 1.8 Nm lbf-in M3 or 6-32 screw
Rth(j-c) Thermal resistance from junction to case 0.45 - 0.56 C/W Fig.21
V(BR)DSS Drain-source breakdown voltage 1200 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 - 3.6 V VDS = VGS, ID = 9mA Fig.11
VGS(th) Gate threshold voltage 2.0 V VDS = VGS, ID = 9mA, TJ = 175C
IDSS Zero gate voltage drain current 1 - 10 A VDS = 1200V, VGS = 0V
IGSS Gate source leakage current 100 nA VGS = 15V, VDS = 0V
RDS(on) Current drain-source on-state resistance 40 - 52 m VGS = 15V, ID = 32A Fig.4,5, 6
RDS(on) Current drain-source on-state resistance 70 m VGS = 15V, ID = 32A, TJ = 175C
gfs Transconductance 22 S VDS = 20V, ID = 32A Fig.7
gfs Transconductance 20 S VDS = 20V, ID = 32A, TJ = 175C
Rg,int Internal gate resistance 2.1 VAC = 25mV, f = 1MHz, open drain
Ciss Input capacitance 2171 pF VDS = 1000V, VGS = 0V, TJ = 25C, VAC = 25mV, f = 100kHz Fig.17, 18
Coss Output capacitance 109 pF
Crss Reverse capacitance 3.8 pF
Eoss Coss stored energy 56 J Fig.16
Qgs Gate source charge 25 nC VDS = 800V, VGS = -4/+15V, ID = 32A Fig.12
Qgd Gate drain charge 19 nC
Qg Gate charge 65 nC
Eon Turn on switching energy 255 J VDS = 800V, VGS = -4/+15V, ID = 32A, Rg = 2.5, L = 120H Fig.26
Eoff Turn off switching energy 47 J
tdon Turn on delay time 18 ns Fig.27
tr Rise time 14 ns
tdoff Turn off delay time 23 ns
tf Fall time 9 ns
VSD Diode forward voltage 3.8 V VGS = -4V, ISD = 16A Fig.8,9, 10
VSD Diode forward voltage 3.3 V VGS = -4V, ISD = 16A, TJ = 175C
IS Continuous diode forward current 62 A VGS = -4V, Tc = 25C Note2
trr Reverse recovery time 31 ns VR = 800V, VGS = -4V, ISD = 32A, di/dt = 3015A/s, TJ = 175C
Qrr Reverse recovery charge 524 nC
Irrm Peak reverse recovery current 29 A

2504101957_Sichainsemi-SG2M040120LH_C42456093.pdf

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