power management MOSFET Siliup SP010N03AGHTO with 100V drain source voltage and low RDS on resistance

Key Attributes
Model Number: SP010N03AGHTO
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
240A
Operating Temperature -:
-55℃~+150℃
RDS(on):
2.6mΩ@10V
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
35pF
Number:
1 N-channel
Output Capacitance(Coss):
1.067nF
Input Capacitance(Ciss):
7.162nF
Pd - Power Dissipation:
260W
Gate Charge(Qg):
105nC@10V
Mfr. Part #:
SP010N03AGHTO
Package:
TOLL-8L
Product Description

Product Overview

The SP010N03AGHTO is a 100V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd., designed for high-performance applications. It features fast switching, low gate charge, and low RDS(on) thanks to its advanced split gate trench technology. This MOSFET is 100% tested for single pulse avalanche energy and is ideal for PWM applications, hard switched, and high-frequency circuits, as well as power management systems.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP010N03AGHTO
  • Technology: Advanced Split Gate Trench Technology
  • Package: TOLL
  • Channel Type: N-Channel

Technical Specifications

Parameter Symbol Test Condition Min Typ Max Unit
Product Summary
Drain-Source Voltage V(BR)DSS 100 V
RDS(on) Typ RDS(on)TYP @10V 2.6 m
Continuous Drain Current ID 240 A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25, unless otherwise noted) 100 V
Gate-Source Voltage VGS (Ta=25, unless otherwise noted) 20 V
Continuous Drain Current (Tc=25) ID (Ta=25, unless otherwise noted) 240 A
Continuous Drain Current (Tc=100) ID (Ta=25, unless otherwise noted) 160 A
Pulsed Drain Current IDM (Ta=25, unless otherwise noted) 960 A
Single Pulse Avalanche Energy EAS (Ta=25, unless otherwise noted) 1225 mJ
Power Dissipation (Tc=25) PD (Ta=25, unless otherwise noted) 260 W
Thermal Resistance Junction-to-Case RJC (Ta=25, unless otherwise noted) 0.48 /W
Storage Temperature Range TSTG (Ta=25, unless otherwise noted) -55 150
Operating Junction Temperature Range TJ (Ta=25, unless otherwise noted) -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS ID = 250A, VGS = 0V 100 110 - V
Drain Cut-Off Current IDSS VDS = 80V, VGS = 0V - - 1 A
Gate Leakage Current IGSS VGS = 20V, VDS = 0V - - 0.1 A
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250A 2.0 3.0 4.0 V
Drain-Source ON Resistance RDS(ON) VGS = 10V, ID = 30A - 2.6 3.0 m
Dynamic Characteristics
Input Capacitance Ciss VDS =50V, VGS = 0V, f = 1.0MHz - 7162 - pF
Output Capacitance Coss VDS =50V, VGS = 0V, f = 1.0MHz - 1067 - pF
Reverse Transfer Capacitance Crss VDS =50V, VGS = 0V, f = 1.0MHz - 35 - pF
Switching Characteristics
Total Gate Charge Qg VDS=50V , VGS=10V , ID=100A - 105 - nC
Gate-Source Charge Qgs VDS=50V , VGS=10V , ID=100A - 47 - nC
Gate-Drain Charge Qg d VDS=50V , VGS=10V , ID=100A - 23 - nC
Turn-On Delay Time td(on) VGS = 10V, VDS =50V, ID=100A RG = 6 - 26 - nS
Rise Time tr VGS = 10V, VDS =50V, ID=100A RG = 6 - 75 - nS
Turn-Off Delay Time td(off) VGS = 10V, VDS =50V, ID=100A RG = 6 - 87 - nS
Fall Time tf VGS = 10V, VDS =50V, ID=100A RG = 6 - 30 - nS
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = 1A, VGS = 0V - - 1.2 V
Maximum Body-Diode Continuous Current IS - - 240 A
Body Diode Reverse Recovery Time Trr IS=100A, di/dt=100A/us, TJ=25 - 72 - nS
Body Diode Reverse Recovery Charge Qrr IS=100A, di/dt=100A/us, TJ=25 - 180 - nC
Package Dimensions (TOLL)
Symbol Dimensions In Millimeters Min. Nom. Max.
A 2.20 2.30 2.40
b 0.65 0.75 0.85
C 0.508 REF
D 10.25 10.40 10.55
D1 2.85 3.00 3.15
E 9.75 9.90 10.05
E1 9.65 9.80 9.95
E2 8.95 9.10 9.25
E3 7.25 7.40 7.55
e 1.20 BSC
F 1.05 1.20 1.35
H 11.55 11.70 11.85
H1 6.03 6.18 6.33
H2 6.85 7.00 7.15
H3 3.00 BSC
L 1.55 1.70 1.85
L1 0.55 0.7 0.85
L2 0.45 0.6 0.75
M 0.08 REF.
8 10 12
K 4.25 4.40 4.55

2504101957_Siliup-SP010N03AGHTO_C22385353.pdf

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