1200V SiC MOSFET Module S1P14R120HSE-A Suitable for Smart Grid Transmission and Distribution Systems

Key Attributes
Model Number: S1P14R120HSE-A
Product Custom Attributes
Drain To Source Voltage:
1.2kV
Current - Continuous Drain(Id):
120A
Operating Temperature -:
-55℃~+175℃
Gate Threshold Voltage (Vgs(th)):
2.8V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
22pF
Input Capacitance(Ciss):
5.521nF
Pd - Power Dissipation:
349W
Gate Charge(Qg):
230nC
Mfr. Part #:
S1P14R120HSE-A
Package:
SOT-227
Product Description

Product Overview

The S1P14R120HSE-A is a 1200V / 14m SiC Power MOSFET Module designed for high-speed switching applications. It offers very low switching losses, high blocking voltage with low on-resistance, and temperature-independent turn-off switching losses. With ultra-low thermal resistance and an isolated back-side, this module is suitable for demanding applications such as solar power optimizers, UPS systems, motor drives, high power converters, photovoltaic and wind power generation, induction heating equipment, and smart grid transmission and distribution.

Product Attributes

  • Brand: (Sichain Semiconductor)
  • Origin: (Ningbo)
  • Material: SiC (Silicon Carbide)
  • Model: S1P14R120HSE-A
  • Package: SOT227

Technical Specifications

Parameter Value Unit Test Conditions Note
Key Performance and Package Parameters
Type S1P14R120HSE-A
VDS 1200 V
IDS (TC = 25) 120 A
Rth (j-c),max 14 m (VGS = 18V, ID = 100A, TJ = 25)
RDS(on), typ 14 m (VGS = 18V, ID = 100A, TJ = 25)
TJ,max 175
Marking S1P14R120HSE-A
Package SOT227
Maximum Ratings
VDS,max (Drain source voltage) 1200 V VGS = 0V, ID = 100A
VGS,max (Gate source voltage) -8 /+22 V Absolute maximum values
VGSop (Gate source voltage) -4 /+18 V Recommended operational values
ID (Continuous drain current) 120 A VGS = 18V, TC = 25C Fig.16
ID 85 A VGS = 18V, TC = 100C
ID(pulse) (Pulsed drain current) 240 A Pulse width tp limited by TJ,max Fig.19
PD (Power dissipation) 349 W TC= 25C, TJ = 175C Fig.17
TJ ,Tstg (Operating Junction and storage temperature) -55 to +175 C
Thermal / Packaging Characteristics
Rth-JC (Thermal Resistance, Junction to Case) - /W Note1: Rth-JC for SiC MOS
Rth-JC 0.34 - 0.43 /W Note1
Rth-JC - 0.5 /W Note2: Rth-JC for SiC SBD
VISO (Isolation Test Voltage RMS) 2.5 kV f=50Hz, t=1min
Creepage (Terminal to Heatsink) 8.5 mm
Creepage (Terminal to Terminal) 10.5 mm
Clearance (Terminal to Heatsink) 6.8 mm
Clearance (Terminal to Terminal) 4.4 mm
Tjmax (Maximum Junction Temperature) 175 C
Tjop (Operation Junction Temperature) -55 to +175 -
TSTG (Storage Temperature Range) -55 to +175 -
W (Weight) 28.5 g
TM (Screws to Heatsink Mounting Torque) 1.5 Nm
TC (Terminal Connection Torque (M4 *9mm)) 1.3 Nm
Electrical Characteristics
V(BR)DSS (Drain-source breakdown voltage) 1200 V VGS = 0V, ID = 100A
VGS(th) (Gate threshold voltage) 2.3 - 3.6 V VDS = VGS, ID = 28mA Fig.11
VGS(th) 2.0 V VDS = VGS, ID = 28mA, TJ = 175C
IDSS (Zero gate voltage drain current) 1 - 10 A VDS = 1200V, VGS = 0V
IGSS (Gate source leakage current) - 100 nA VGS = 18V, VDS = 0V
RDS(on) (Current drain-source on-state resistance) 17 - 21 m VGS = 15V, ID = 100A Fig.4,5, 6
RDS(on) 28 m VGS = 15V, ID =100A, TJ = 175C
RDS(on) 14 - 18 m VGS = 18V, ID = 100A
RDS(on) 24 m VGS = 18V, ID =100A, TJ = 175C
gfs (Transconductance) 72 S VDS = 20V, ID = 100A Fig.7
gfs 57 S VDS = 20V, ID =100A, TJ = 175C
Rg,int (Internal gate resistance) 0.9 VAC = 25mV, f = 1MHz, open drain
VSD (Diode forward voltage) 4.0 V VGS = -4V, ISD = 50A Fig.8,9, 10
VSD 3.5 V VGS = -4V, ISD = 5A TJ = 175C
Ciss (Input capacitance) 5521 pF VDS = 1000V, VGS = 0V TJ = 25C, VAC = 25mV f = 100kHz Fig.14, 15
Coss (Output capacitance) 247 pF
Crss (Reverse capacitance) 22 pF
Eoss (Coss stored energy) 158 J
Qgs (Gate source charge) 54 nC VDS = 800V, VGS = -4/+18V ID = 100A Fig.12
Qgd (Gate drain charge) 45 nC
Qg (Gate charge) 230 nC
Eon (Turn on switching energy) 812* J VDS = 800V, VGS = -4/+18V ID = 100A, Rg = 2.5, L = 16.7H * By estimated
Eoff (Turn off switching energy) 383* J * By estimated
tdon (Turn on delay time) 19* ns * By estimated
tr (Rise time) 29* ns * By estimated
tdoff (Turn off delay time) 42* ns * By estimated
tf (Fall time) 9.3* ns * By estimated
SiC SBD Characteristics
VRRM (Repetitive Peak Reverse Voltage) 1200 V
IF (Continuous Forward Current) 134 A Tc = 25
IF 64 A Tc = 135
IF 40 A Tc = 155
IFSM (Non-Repetitive Peak Forward Surge Current) 300 A Tp=10ms, Half Sine Pulse
VF (Forward Voltage) 1.4 - 1.8 V IDS=40A
VF 1.9 - 2.5 V IDS=40A, Tj=175
IR (Reverse Current) 2 - 200 A VR=1200V
IR 20 - 500 A VR=1200V, Tj=175
Qc (Total Capacitive Charge) 228 nC VR=800V, IF=40A di/dt=200A/s
C (Total Capacitance) 4240 pF VR=0V, f=1MHz
C 208 pF VR=400V, f=1MHz
C 152 pF VR=800V, f=1MHz

2411261513_Sichainsemi-S1P14R120HSE-A_C37636089.pdf

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