N Channel Power MOSFET Siliup SP010N02GHTD Featuring Split Gate Trench Technology and Low Gate Charge Design

Key Attributes
Model Number: SP010N02GHTD
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
270A
Operating Temperature -:
-55℃~+150℃
RDS(on):
1.9mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.7V@250uA
Reverse Transfer Capacitance (Crss@Vds):
48pF
Number:
1 N-channel
Input Capacitance(Ciss):
13.42nF
Output Capacitance(Coss):
2.034nF
Pd - Power Dissipation:
260W
Gate Charge(Qg):
156nC@10V
Mfr. Part #:
SP010N02GHTD
Package:
TO-263
Product Description

Product Overview

The SP010N02GHTD is a 100V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd., designed for high-performance applications. It features fast switching, low gate charge, and low RDS(on) thanks to its advanced split gate trench technology. This MOSFET is 100% tested for single pulse avalanche energy, making it suitable for PWM applications, hard switched and high-frequency circuits, and power management solutions.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP010N02GHTD
  • Technology: Advanced Split Gate Trench Technology
  • Package: TO-263
  • Channel Type: N-Channel
  • Device Code: 010N02GH

Technical Specifications

Parameter Symbol Test Condition Min Typ Max Unit
Product Summary
Drain-Source Voltage V(BR)DSS 100 V
RDS(on) Typ RDS(on) @10V 1.9 m
Continuous Drain Current ID 270 A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25) 100 V
Gate-Source Voltage VGS (Ta=25) 20 V
Continuous Drain Current ID (Tc=25) 270 A
Continuous Drain Current ID (Tc=100) 180 A
Pulsed Drain Current IDM 1080 A
Single Pulse Avalanche Energy EAS 1560 mJ
Power Dissipation PD (Tc=25) 260 W
Thermal Resistance Junction-to-Case RJC 0.48 /W
Storage Temperature Range TSTG -55 150
Operating Junction Temperature Range TJ -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS VGS=0V , ID=250uA 100 - - V
Drain Cut-Off Current IDSS VDS=80V , VGS=0V , TJ=25 - - 1 A
Gate Leakage Current IGSS VGS=20V , VDS=0V - - 100 nA
Gate Threshold Voltage VGS(th) VGS=VDS , ID =250uA 2 2.7 4 V
Drain-Source ON Resistance RDS(ON) VGS=10V , ID=20A - 1.9 2.4 m
Dynamic Characteristics
Input Capacitance Ciss VDS=50V , VGS=0V , f=1MHz - 13420 - pF
Output Capacitance Coss VDS=50V , VGS=0V , f=1MHz - 2034 - pF
Reverse Transfer Capacitance Crss VDS=50V , VGS=0V , f=1MHz - 48 - pF
Total Gate Charge Qg VDS=50V , VGS=10V , ID=125A - 156 - nC
Gate-Source Charge Qgs VDS=50V , VGS=10V , ID=125A - 51 - nC
Gate-Drain Charge Qg VDS=50V , VGS=10V , ID=125A - 45 - nC
Switching Characteristics
Turn-On Delay Time td(on) VDD=50V, VGS=10V , RG=1.6, ID=125A - 35 - nS
Rise Time tr VDD=50V, VGS=10V , RG=1.6, ID=125A - 68 - nS
Turn-Off Delay Time td(off) VDD=50V, VGS=10V , RG=1.6, ID=125A - 150 - nS
Fall Time tf VDD=50V, VGS=10V , RG=1.6, ID=125A - 105 - nS
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = 1A, VGS = 0V - - 1.2 V
Maximum Body-Diode Continuous Current IS - - 270 A
Reverse Recovery Time Trr IS=50A, di/dt=100A/us, TJ=25 - 106 - nS
Reverse Recovery Charge Qrr IS=50A, di/dt=100A/us, TJ=25 - 328 - nC
Package Information (TO-263)
Symbol Dimensions In Millimeters Dimensions In Inches Min. Max. Min. Max.
A 4.470 4.670 0.176 0.184
A1 0.000 0.150 0.000 0.006
B 1.120 1.420 0.044 0.056
b 0.710 0.910 0.028 0.036
b1 1.170 1.370 0.046 0.054
c 0.310 0.530 0.012 0.021
c1 1.170 1.370 0.046 0.054
D 10.010 10.310 0.394 0.406
E 8.500 8.900 0.335 0.350
e 2.540 TYP. 0.100 TYP.
e1 4.980 5.180 0.196 0.204
L 14.940 15.500 0.588 0.610
L1 4.950 5.450 0.195 0.215
L2 2.340 2.740 0.092 0.108
L3 1.300 1.700 0.051 0.067
0 8 0 8
V 5.600 REF. 0.220 REF.

2504101957_Siliup-SP010N02GHTD_C22385363.pdf

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