Low Gate Charge 150V N Channel Power MOSFET Siliup SP015N04AGHTO for Power Conversion Applications

Key Attributes
Model Number: SP015N04AGHTO
Product Custom Attributes
Drain To Source Voltage:
150V
Current - Continuous Drain(Id):
250A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.7mΩ@10V
Gate Threshold Voltage (Vgs(th)):
3V
Reverse Transfer Capacitance (Crss@Vds):
23pF
Number:
1 N-channel
Output Capacitance(Coss):
587pF
Pd - Power Dissipation:
196W
Input Capacitance(Ciss):
9.023nF
Gate Charge(Qg):
89nC@10V
Mfr. Part #:
SP015N04AGHTO
Package:
TOLL
Product Description

Product Overview

The SP015N04AGHTO is a 150V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd. This device features fast switching, low gate charge, and low RDS(on) thanks to its advanced split gate trench technology. It is designed for applications requiring high efficiency and reliability, including PWM applications, hard-switched, and high-frequency circuits, as well as power management systems. The MOSFET has undergone 100% single pulse avalanche energy testing.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Device Code: SP015N04AGHTO
  • Package: TOLL
  • Technology: Advanced Split Gate Trench Technology
  • Channel Type: N-Channel
  • Origin: China (implied by www.siliup.com and company name)

Technical Specifications

Parameter Symbol Conditions Min. Typ. Max. Unit
Product Summary
Drain-Source Voltage V(BR)DSS 150 V
RDS(on) RDS(on) @10V 3.7 m
Continuous Drain Current ID 250 A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25) 135 V
Gate-Source Voltage VGS (Ta=25) 20 V
Continuous Drain Current ID (Tc=25) 250 A
Continuous Drain Current ID (Tc=100) 167 A
Pulsed Drain Current IDM 1000 A
Single Pulse Avalanche Energy EAS (Note 1) 1386 mJ
Power Dissipation PD (Tc=25) 196 W
Thermal Resistance Junction-to-Case RJC 0.64 /W
Storage Temperature Range TSTG -55 150
Operating Junction Temperature Range TJ -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS ID = 250A, VGS = 0V 135 150 - V
Drain-Source Leakage Current IDSS VDS =108V, VGS = 0V - - 1 uA
Gate-Source Leakage Current IGSS VGS = 20V, VDS = 0V - - 100 nA
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250A 2 3 4 V
Static Drain-Source On-Resistance RDS(ON) VGS = 10V, ID = 20A - 3.7 4.2 m
Input Capacitance Ciss VDS=75V , VGS=0V , f=1MHz - 9023 - pF
Output Capacitance Coss VDS=75V , VGS=0V , f=1MHz - 587 - pF
Reverse Transfer Capacitance Crss VDS=75V , VGS=0V , f=1MHz - 23 - pF
Total Gate Charge Qg VDS=75V , VGS=10V , ID=20A - 89 - nC
Gate-Source Charge Qgs VDS=75V , VGS=10V , ID=20A - 43 - nC
Gate-Drain Charge Qgd VDS=75V , VGS=10V , ID=20A - 28 - nC
Turn-On Delay Time Td(on) VDD=75V, VGS=10V , RG=3.0, ID=20A - 26 - nS
Rise Time Tr VDD=75V, VGS=10V , RG=3.0, ID=20A - 39 - nS
Turn-Off Delay Time Td(off) VDD=75V, VGS=10V , RG=3.0, ID=20A - 54 - nS
Fall Time Tf VDD=75V, VGS=10V , RG=3.0, ID=20A - 21 - nS
Diode Forward Voltage VSD VGS=0V , IS=1A , TJ=25 - - 1.2 V
Maximum Body-Diode Continuous Current IS - - 250 A
Reverse Recovery Time Trr IS=140A, di/dt=100A/us, TJ=25 - 175 - nS
Reverse Recovery Charge Qrr IS=140A, di/dt=100A/us, TJ=25 - 544 - nC
Package Information (TOLL)
Dimension Symbol Min. Nom. Max. Unit
A A 2.20 2.30 2.40 mm
b b 0.65 0.75 0.85 mm
C C 0.508 REF mm
D D 10.25 10.40 10.55 mm
D1 D1 2.85 3.00 3.15 mm
E E 9.75 9.90 10.05 mm
E1 E1 9.65 9.80 9.95 mm
E2 E2 8.95 9.10 9.25 mm
E3 E3 7.25 7.40 7.55 mm
e e 1.20 BSC mm
F F 1.05 1.20 1.35 mm
H H 11.55 11.70 11.85 mm
H1 H1 6.03 6.18 6.33 mm
H2 H2 6.85 7.00 7.15 mm
H3 H3 3.00 BSC mm
L L 1.55 1.70 1.85 mm
L1 L1 0.55 0.7 0.85 mm
L2 L2 0.45 0.6 0.75 mm
M M 0.08 REF. mm
8 10 12
K K 4.25 4.40 4.55 mm

Note: 1. The test condition for EAS is VDD=50V, VGS=10V, L=0.5mH, RG=25.

Order Information:

Device Package Unit/Tape
SP015N0AGHTO TOLL 2000
SP015N04AGHTO TOLL 2000

2506271720_Siliup-SP015N04AGHTO_C49257273.pdf

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