SG2M023120LJ 1200V Silicon Carbide Power MOSFET with Fast Switching and Low Reverse Recovery Charge

Key Attributes
Model Number: SG2M023120LJ
Product Custom Attributes
Drain To Source Voltage:
1.2kV
Current - Continuous Drain(Id):
97A
Operating Temperature -:
-55℃~+175℃
RDS(on):
31mΩ
Gate Threshold Voltage (Vgs(th)):
3.6V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
7.4pF
Number:
1 N-channel
Output Capacitance(Coss):
147pF
Input Capacitance(Ciss):
2.78nF
Pd - Power Dissipation:
395W
Gate Charge(Qg):
95nC
Mfr. Part #:
SG2M023120LJ
Package:
TO-247-4L
Product Description

Product Overview

The SG2M023120LJ is a 1200V Silicon Carbide (SiC) Power MOSFET designed for high-speed switching applications. It offers very low switching losses, fully controllable dv/dt, and high blocking voltage with low on-resistance. Featuring a fast intrinsic diode with low reverse recovery charge (Qrr) and temperature-independent turn-off switching losses, this device contributes to reduced cooling efforts, improved efficiency, and increased power density. It is suitable for applications such as on-board chargers, EV battery chargers, booster/DC-DC converters, and switch-mode power supplies.

Product Attributes

  • Brand: (Sichain)
  • Material: Silicon Carbide (SiC)
  • Package Type: TO-247-4L
  • Certifications: Halogen free, RoHS compliant

Technical Specifications

Model VDS (V) IDS (TC = 25) (A) RDS(on), typ (m) TJ,max () Package
SG2M023120LJ 1200 97 23 (VGS = 18V, ID = 49A, TJ = 25) 175 TO-247-4L
Symbol Parameter Value Unit Test Conditions Note
VDS,max Drain source voltage 1200 V VGS = 0V, ID = 100A
VGS,max Gate source voltage -8 /+22 V Absolute maximum values Note1
VGSop Gate source voltage -4 /+18 V Recommended operational values
ID Continuous drain current 97 A VGS = 18V, TC = 25C Fig.19
ID Continuous drain current 68 A VGS = 18V, TC = 100C
ID(pulse) Pulsed drain current 194 A Pulse width tP limited by TJ,max Fig.22
PD Power dissipation 395 W TC= 25C,TJ = 175C Fig.20
TJ ,Tstg Operating Junction and storage temperature -55 to +175 C
TL Soldering temperature 260 C 1.6mm (0.063) from case for 10s
TM Mounting torque 8.8 Nm lbf-in M3 or 6-32 screw
V(BR)DSS Drain-source breakdown voltage 1200 V VGS = 0V, ID = 100A
VGS(th) Gate threshold voltage 2.3 - 3.6 V VDS = VGS, ID = 14mA Fig.11
IDSS Zero gate voltage drain current - 10 A VDS = 1200V, VGS = 0V
IGSS Gate source leakage current - 100 nA VGS = 18V, VDS = 0V
RDS(on) Current drain-source on-state resistance 28 - 38 m VGS = 15V, ID = 49A Fig.4,5, 6
RDS(on) Current drain-source on-state resistance 44 m VGS = 15V, ID = 49A, TJ = 175C
RDS(on) Current drain-source on-state resistance 23 - 31 m VGS = 18V, ID = 49A
RDS(on) Current drain-source on-state resistance 42 m VGS = 18V, ID = 49A, TJ = 175C
gfs Transconductance 36 S VDS = 20V, ID = 49A Fig.7
Ciss Input capacitance 2780 pF VDS = 1000V, VGS = 0V, TJ = 25C, VAC = 25mV, f = 100kHz Fig.17, 18
Coss Output capacitance 147 pF VDS = 1000V, VGS = 0V, TJ = 25C, VAC = 25mV, f = 100kHz Fig.17, 18
Crss Reverse capacitance 7.4 pF VDS = 1000V, VGS = 0V, TJ = 25C, VAC = 25mV, f = 100kHz Fig.17, 18
Eoss Coss stored energy 81 J VDS = 1000V, VGS = 0V, TJ = 25C, VAC = 25mV, f = 100kHz Fig.16
Qgs Gate source charge 28 nC VDS = 800V, VGS = -4/+18V, ID = 49A Fig.12
Qgd Gate drain charge 26 nC VDS = 800V, VGS = -4/+18V, ID = 49A Fig.12
Qg Gate charge 95 nC VDS = 800V, VGS = -4/+18V, ID = 49A Fig.12
Eon Turn on switching energy 562 J VDS = 800V, VGS = -4/+18V, ID = 49A, Rg = 2.5, L = 16.7H Fig.26
Eoff Turn off switching energy 199 J VDS = 800V, VGS = -4/+18V, ID = 49A, Rg = 2.5, L = 16.7H Fig.26
tdon Turn on delay time 17 ns VDS = 800V, VGS = -4/+18V, ID = 49A, Rg = 2.5, L = 16.7H Fig.27
tr Rise time 20 ns VDS = 800V, VGS = -4/+18V, ID = 49A, Rg = 2.5, L = 16.7H Fig.27
tdoff Turn off delay time 42 ns VDS = 800V, VGS = -4/+18V, ID = 49A, Rg = 2.5, L = 16.7H Fig.27
tf Fall time 11 ns VDS = 800V, VGS = -4/+18V, ID = 49A, Rg = 2.5, L = 16.7H Fig.27
VSD Diode forward voltage 3.7 V VGS = -4V, ISD = 24.5A Fig.8,9, 10
VSD Diode forward voltage 3.3 V VGS = -4V, ISD = 24.5A, TJ = 175C
IS Continuous diode forward current 91 A VGS = -4V, Tc = 25C Note2
trr Reverse recovery time 30 ns VR = 800V, VGS = -4V, ISD = 49A, di/dt = 3787A/s, TJ = 175C
Qrr Reverse recovery charge 780 nC VR = 800V, VGS = -4V, ISD = 49A, di/dt = 3787A/s, TJ = 175C
Irrm Peak reverse recovery current 44 A VR = 800V, VGS = -4V, ISD = 49A, di/dt = 3787A/s, TJ = 175C
Rth(j-c) Thermal resistance from junction to case 0.30 - 0.38 C/W Fig.21

2504101957_Sichainsemi-SG2M023120LJ_C42456091.pdf

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