Power Switching MOSFET Siliup SP010N03AGHTF 100V N Channel with Low RDSon and High Current Capacity

Key Attributes
Model Number: SP010N03AGHTF
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
220A
Operating Temperature -:
-55℃~+150℃
RDS(on):
3.3mΩ@10V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Reverse Transfer Capacitance (Crss@Vds):
35pF
Number:
-
Output Capacitance(Coss):
1.067nF
Pd - Power Dissipation:
245W
Input Capacitance(Ciss):
7.162nF
Gate Charge(Qg):
105nC@10V
Mfr. Part #:
SP010N03AGHTF
Package:
TO-247
Product Description

Product Overview

The SP010N03AGHTF is a 100V N-Channel Power MOSFET from Siliup Semiconductor Technology Co. Ltd. It features fast switching, low gate charge, and low RDS(on) thanks to its advanced split gate trench technology. This MOSFET is designed for power switching applications, DC-DC converters, and power management systems. It has undergone 100% single pulse avalanche energy testing.

Product Attributes

  • Brand: Siliup Semiconductor Technology Co. Ltd.
  • Product Code: SP010N03AGH
  • Package: TO-247

Technical Specifications

Parameter Symbol Test Condition Min Typ Max Unit
Product Summary
V(BR)DSS 100V V
RDS(on)TYP @10V 2.6m
ID 220A
Absolute Maximum Ratings
Drain-Source Voltage VDS (Ta=25,unless otherwise noted) 100 V
Gate-Source Voltage VGS (Ta=25,unless otherwise noted) 20 V
Continuous Drain Current (Tc=25) ID (Ta=25,unless otherwise noted) 220 A
Continuous Drain Current (Tc=100) ID (Ta=25,unless otherwise noted) 150 A
Pulsed Drain Current IDM (Ta=25,unless otherwise noted) 880 A
Single Pulse Avalanche Energy EAS (Ta=25,unless otherwise noted) 1332 mJ
Power Dissipation (Tc=25) PD (Ta=25,unless otherwise noted) 245 W
Thermal Resistance Junction-to-Case RJC (Ta=25,unless otherwise noted) 0.51 /W
Storage Temperature Range TSTG (Ta=25,unless otherwise noted) -55 150
Operating Junction Temperature Range TJ (Ta=25,unless otherwise noted) -55 150
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS VGS=0V , ID=250uA 100 - - V
Drain Cut-Off Current IDSS VDS=80V , VGS=0V , TJ=25 - - 1 A
Gate Leakage Current IGSS VGS=20V , VDS=0V - - 0.1 A
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250A 2.0 3.0 4.0 V
Drain-Source ON Resistance RDS(ON) VGS = 10V, ID = 30A - 2.6 3.3 m
Dynamic Characteristics
Input Capacitance Ciss VDS=50V , VGS=0V , f=1MHz - 7162 - pF
Output Capacitance Coss VDS=50V , VGS=0V , f=1MHz - 1067 - pF
Reverse Transfer Capacitance Crss VDS=50V , VGS=0V , f=1MHz - 35 - pF
Total Gate Charge Qg VDS=50V , VGS=10V , ID=125A - 105 - nC
Gate-Source Charge Qgs VDS=50V , VGS=10V , ID=125A - 47 - nC
Gate-Drain Charge Qgd VDS=50V , VGS=10V , ID=125A - 23 - nC
Switching Characteristics
Turn-On Delay Time td(on) VDD=50V, VGS=10V , RG=6, ID=125A - 26 - nS
Rise Time tr VDD=50V, VGS=10V , RG=6, ID=125A - 75 - nS
Turn-Off Delay Time td(off) VDD=50V, VGS=10V , RG=6, ID=125A - 87 - nS
Fall Time tf VDD=50V, VGS=10V , RG=6, ID=125A - 30 - nS
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = 1A, VGS = 0V - - 1.2 V
Maximum Body-Diode Continuous Current IS IS = 1A, VGS = 0V - - 220 A
Reverse Recovery Time Trr IS=20A, di/dt=100A/us, TJ=25 - 75 - nS
Reverse Recovery Charge Qrr IS=20A, di/dt=100A/us, TJ=25 - 210 - nC
Package Information (TO-247)
Symbol Dimensions In Millimeters Dimensions In Inches Min. Max. Min. Max.
A 4.850 - 5.150 0.191 - 0.200
A1 2.200 - 2.600 0.087 - 0.102
b 1.000 - 1.400 0.039 - 0.055
b1 2.800 - 3.200 0.110 - 0.126
b2 1.800 - 2.200 0.071 - 0.087
c 0.500 - 0.700 0.020 - 0.028
c1 1.900 - 2.100 0.075 - 0.083
D 15.450 - 15.750 0.608 - 0.620
E1 3.500 REF. 0.138 REF.
E2 3.600 REF. 0.142 REF.
L 40.900 - 41.300 1.610 - 1.626
L1 24.800 - 25.100 0.976 - 0.988
L2 20.300 - 20.600 0.799 - 0.811
7.100 - 7.300 0.280 - 0.287
e 5.450 TYP. 0.215 TYP.
H 5.980 REF. 0.235 REF.
h 0.000 - 0.300 0.000 - 0.012

Note: 1. The test condition is VDD=50V,VGS=10V,L=0.5mH,RG=25


2410311049_Siliup-SP010N03AGHTF_C42372365.pdf

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