650V 7A N channel Multi EPI Super Junction MOSFET with low gate charge and fast switching XCH GSD07N65E

Key Attributes
Model Number: GSD07N65E
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
7A
RDS(on):
700mΩ@10V,3.5A
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
4.5V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
6.4pF@25V
Number:
1 N-channel
Output Capacitance(Coss):
113pF
Input Capacitance(Ciss):
400pF@25V
Pd - Power Dissipation:
35W
Gate Charge(Qg):
10.3nC@10V
Mfr. Part #:
GSD07N65E
Package:
TO-252
Product Description

Product Overview

The GSD07N65E is a 650V, 7A N-channel Multi-EPI Super-Junction Power MOSFET from XCH Semiconductor. Designed with advanced technology, it offers improved characteristics such as fast switching times, low Ciss and Crss, low on-resistance, and excellent avalanche characteristics. This MOSFET is suitable for applications requiring high voltage and efficient power handling.

Product Attributes

  • Brand: XCH Semiconductor
  • Model: GSD07N65E
  • Technology: Multi-EPI Super-Junction
  • Channel Type: N-channel
  • Package: TO-252

Technical Specifications

SymbolParameterConditionsMinTypMaxUnit
Absolute Maximum Ratings
VDSSDrain-Source Voltage650V
IDDrain Current -Continuous(TC = 25)7*A
(TC = 100)4*
IDMDrain Current - Pulsed42A
VGSSGate-Source voltage30V
EASSingle Pulsed Avalanche Energy86mJ
IARAvalanche Current1.7A
EARRepetitive Avalanche Energy0.42mJ
dv/dtPeak Diode Recovery dv/dt15V/ns
dVds/dtDrain Source voltage slope(Vds=480V)50V/ns
PDPower Dissipation(TC = 25)35W
TJ, TSTGOperating and Storage Temperature Range-55+150
TLMax. Lead Temperature for Soldering Purpose, 1/8 from Case for 5 Seconds265
Thermal Characteristics
RJCThermal Resistance, Junction-to-Case3.2/W
RCSThermal Resistance, Case-to-Sink0.8/W
RJAThermal Resistance, Junction-to-Ambient62/W
Electrical Characteristics
Off Characteristics
BVDSSDrain-Source Breakdown VoltageVGS = 0V, ID = 250A, TJ = 25600----V
BVDSSDrain-Source Breakdown VoltageVGS = 0V, ID = 250A, TJ = 150--650--V
BVDSS/TJBreakdown Voltage Temperature CoefficientID = 250A, Referenced to 25--0.6--V/
IDSSZero Gate Voltage Drain CurrentVDS = 650V, VGS = 0V----10A
TJ = 150----1
IGSSFGate-Body Leakage Current, ForwardVGS = 30V, VDS = 0V----100nA
IGSSRGate-Body Leakage Current, ReverseVGS = -30V, VDS = 0V-----100nA
On Characteristics
VGS(th)Gate Threshold VoltageVDS = VGS, ID = 250A2.5--4.5V
RDS(on)Static Drain-Source On-ResistanceVGS = 10V, ID = 3.5A--0.60.7
gFSForward TransconductanceVDS = 40V, ID = 3.5A--16--S
Dynamic Characteristics
CissInput CapacitanceVDS = 25V, VGS = 0V, f = 1.0MHz--400-pF
CossOutput Capacitance--113-pF
CrssReverse Transfer Capacitance--6.4-pF
Switching Characteristics
td(on)Turn-On Delay TimeVDD = 400V, ID = 3.5A RG = 20--25--ns
trTurn-On Rise Time--55--ns
td(off)Turn-Off Delay Time--110--ns
tfTurn-Off Fall Time--9--ns
QgTotal Gate ChargeVDS = 400V, ID = 3.5A VGS = 10V--10.3--nC
QgsGate-Source Charge--4.4--nC
QgdGate-Drain Charge--2.9--nC
Drain-Source Diode Characteristics and Maximum Ratings
ISMaximum Continuous Drain-Source Diode Forward Current----7A
ISMMaximum Pulsed Drain-Source Diode Forward Current----18A
VSDDrain-Source Diode Forward VoltageVGS = 0V, IS = 3.5A--0.91.5V
trrReverse Recovery TimeVGS = 0V, IS = 3.5A dIF/dt =100A/s--190--ns
QrrReverse Recovery Charge--2.3--C

2303201000_XCH-GSD07N65E_C5375282.pdf

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