VBsemi Elec IRF7473TRPBF VB 100 Volt N Channel MOSFET with Low Qgd and RoHS Directive Compliance SO8

Key Attributes
Model Number: IRF7473TRPBF-VB
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
9A
Operating Temperature -:
-55℃~+150℃
RDS(on):
32mΩ@10V
Gate Threshold Voltage (Vgs(th)):
1V
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
50pF@50V
Number:
1 N-channel
Output Capacitance(Coss):
150pF
Pd - Power Dissipation:
14W
Input Capacitance(Ciss):
1.9nF@50V
Gate Charge(Qg):
28.5nC@10V
Mfr. Part #:
IRF7473TRPBF-VB
Package:
SO-8
Product Description

Product Overview

The IRF7473TRPBF-VB is a N-Channel 100 V (D-S) MOSFET designed for primary side switching applications. It features extremely low Qgd for reduced switching losses, 100% Rg tested, and 100% avalanche tested. This device is compliant with RoHS Directive 2002/95/EC and Halogen-free according to IEC 61249-2-21 Definition.

Product Attributes

  • Brand: VBsemi
  • Certifications: Halogen-free, RoHS Directive 2002/95/EC
  • Package Type: SO-8

Technical Specifications

ParameterSymbolLimitUnitTest Conditions
Absolute Maximum Ratings
Drain-Source VoltageVDS100V
Gate-Source VoltageVGS± 20V
Continuous Drain Current (TJ = 150 °C)ID9aATC = 25 °C
Continuous Drain Current (TJ = 150 °C)ID6a,bATC = 70 °C
Pulsed Drain CurrentIDM40b,cATA = 25 °C
Continuous Source-Drain Diode CurrentIS7ATC = 25 °C
Single Pulse Avalanche Current (L = 0.1 mH)IAS30A
Single Pulse Avalanche EnergyEAS112mJ
Maximum Power DissipationPD14bWTC = 25 °C
Maximum Power DissipationPD5b,cWTC = 70 °C
Operating Junction and Storage Temperature RangeTJ, Tstg-55 to 150°C
Thermal Resistance Ratings
Maximum Junction-to-AmbientRthJA33 / 40°C/WTypical / Maximum (t ≤ 10 s)b,f
Maximum Junction-to-Foot (Drain)RthJF17 / 21°C/WSteady Stateb
Specifications
Static Drain-Source Breakdown VoltageVDS100VVGS = 0 V, ID = 250 µA
VDS Temperature CoefficientΔVDS /ΔT J172mV/°CID = 250 µA
VGS(th) Temperature CoefficientΔVGS(th) /ΔT J-10mV/°CVDS = VGS , ID = 250 µA
Gate-Source Threshold VoltageVGS(th)1.0 / 3.0VID = 250 µA
Gate-Source LeakageIGSS± 100nAVDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain CurrentIDSS1µAVDS = 100 V, VGS = 0 V
Zero Gate Voltage Drain CurrentIDSS10µAVDS = 100 V, VGS = 0 V, TJ = 55 °C
On-State Drain CurrentID(on)30AVDS ≥ 10 V, VGS = 10 Va
Drain-Source On-State ResistanceRDS(on)2 / 3VGS = 10 V, ID = 5 Aa
Drain-Source On-State ResistanceRDS(on)33VGS = 4.5 V, ID = 5 Aa
Forward Transconductancegfs20SVDS = 15 V, ID = 5 Aa
Dynamic
Input CapacitanceCiss1900pFVDS = 50 V, VGS = 0 V, f = 1 MHz
Output CapacitanceCoss150pFVDS = 75 V, VGS = 10 V, ID = 5 A
Reverse Transfer CapacitanceCrss50pFVDS = 75 V, VGS = 10 V, ID = 5 A
Total Gate ChargeQg28.5 / 43nCVDS = 75 V, VGS = 10 V, ID = 5 A
Gate-Source ChargeQgs23 / 35nCVDS = 75 V, VGS = 8 V, ID = 5 A
Gate-Drain ChargeQgd6.5nCVDS = 75 V, VGS = 8 V, ID = 5 A
Gate ResistanceRg0.8 / 1.3Ωf = 1 MHz
Switching Times (VDD = 50 V, RL = 10 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω)
Turn-on Delay Timetd(on)14 / 21ns
Rise Timetr12 / 18ns
Turn-Off Delay Timetd(off)22 / 33ns
Fall Timetf6 / 10ns
Switching Times (VDD = 50 V, RL = 10 Ω, ID ≅ 5 A, VGEN = 8 V, Rg = 1 Ω)
Turn-On Delay Timetd(on)16 / 24ns
Rise Timetr12 / 18ns
Turn-Off Delay Timetd(off)20 / 30ns
Fall Timetf7 / 12ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode CurrentIS7.7ATC = 25 °C
Pulse Diode Forward CurrentISM50A
Body Diode VoltageVSD0.77 / 1.2VIS = 2.6 A
Body Diode Reverse Recovery Timetrr63 / 95nsIF = 5 A, dI/dt = 100 A/µs, TJ = 25 °C
Body Diode Reverse Recovery ChargeQrr110 / 165nCIF = 5 A, dI/dt = 100 A/µs, TJ = 25 °C
Reverse Recovery Fall Timeta49ns
Reverse Recovery Rise Timetb14ns

Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Surface mounted on 1” x 1” FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 80 °C/W.
f. Guaranteed by design, not subject to production testing.


2410121826_VBsemi-Elec-IRF7473TRPBF-VB_C6705274.pdf

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