N Channel MOSFET YANGJIE YJG40G10B Featuring Low RDS ON High Density Cell and Halogen Free Materials

Key Attributes
Model Number: YJG40G10B
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
40A
RDS(on):
25mΩ@6V
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
11pF
Number:
1 N-channel
Input Capacitance(Ciss):
1.2nF
Output Capacitance(Coss):
350pF
Pd - Power Dissipation:
70W
Gate Charge(Qg):
32nC@10V
Mfr. Part #:
YJG40G10B
Package:
PDFN5060-8L
Product Description

Product Overview

The YJG40G10B is an N-Channel Enhancement Mode Field Effect Transistor from Yangzhou Yangjie Electronic Technology Co., Ltd. It features split gate trench MOSFET technology, offering low RDS(ON) due to its high-density cell design and excellent heat dissipation through its package. This transistor is suitable for power switching applications, uninterruptible power supplies, and DC-DC converters. It is 100% EAS and VDS tested, with a Moisture Sensitivity Level 1 and meets UL 94 V-0 flammability rating. It is also Halogen Free.

Product Attributes

  • Brand: Yangzhou Yangjie Electronic Technology Co., Ltd.
  • Model: YJG40G10B
  • Origin: China (implied by manufacturer location)
  • Certifications: UL 94 V-0 Flammability Rating, Halogen Free, RoHS Compliant

Technical Specifications

ParameterSymbolConditionsMinTypMaxUnit
Absolute Maximum Ratings
Drain-source VoltageVDS100V
Gate-source VoltageVGS±20V
Drain CurrentIDTA=257A
Drain CurrentIDTA=1004.5A
Drain CurrentIDTC=2540A
Drain CurrentIDTC=10025A
Pulsed Drain CurrentIDM100A
Avalanche energyEASTJ=25, VDD=50V, VG=10V, RG=25, L=1mH, IAS=13A84mJ
Total Power DissipationPDTA=252.5W
Total Power DissipationPDTA=1001W
Total Power DissipationPDTC=2570W
Total Power DissipationPDTC=10028W
Junction and Storage Temperature RangeTJ ,TSTG-55+150
Thermal resistance
Thermal Resistance Junction-to-Ambient Steady-StateRJA4050/W
Thermal Resistance Junction-to-Case Steady-StateRJC1.51.8/W
Electrical Characteristics
Drain-Source Breakdown VoltageBVDSSVGS= 0V, ID=250µA100V
Zero Gate Voltage Drain CurrentIDSSVDS=100V, VGS=0V1µA
Zero Gate Voltage Drain CurrentIDSSVDS=100V, VGS=0V, Tj=150100µA
Gate-Body Leakage CurrentIGSSVGS= ±20V, VDS=0V±100nA
Gate Threshold VoltageVGS(th)VDS= VGS, ID=250µA22.84V
Static Drain-Source On-ResistanceRDS(ON)VGS=10V, ID=20A1621
Static Drain-Source On-ResistanceRDS(ON)VGS=6V, ID=20A1925
Diode Forward VoltageVSDIS=20A, VGS=0V0.91.2V
Gate resistanceRGf=1MHz1.4Ω
Maximum Body-Diode Continuous CurrentIS40A
Input CapacitanceCissVDS=50V, VGS=0V, f=1MHz1200pF
Output CapacitanceCoss350pF
Reverse Transfer CapacitanceCrss11pF
Total Gate ChargeQgVGS=10V, VDS=50V, ID=20A32nC
Gate-Source ChargeQgs11nC
Gate-Drain ChargeQg d5nC
Reverse Recovery ChargeQrrIF=20A, di/dt=100A/us84nC
Reverse Recovery Timetrr52ns
Turn-on Delay TimetD(on)VGS=10V, VDD=50V, ID=20A RGEN=2.2Ω51ns
Turn-on Rise Timetr14ns
Turn-off Delay TimetD(off)69ns
Turn-off fall Timetf21ns

2401111813_YANGJIE-YJG40G10B_C20605783.pdf

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