P Channel MOSFET Load Switch SOT 23 Package Featuring ALJ SI2305 for Portable Device Power Management

Key Attributes
Model Number: SI2305
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
6A
Operating Temperature -:
-
RDS(on):
90mΩ@1.8V
Gate Threshold Voltage (Vgs(th)):
900mV@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
190pF
Output Capacitance(Coss):
290pF
Pd - Power Dissipation:
350mW
Input Capacitance(Ciss):
740pF
Gate Charge(Qg):
15nC@4.5V
Mfr. Part #:
SI2305
Package:
SOT-23
Product Description

Product Overview

The SI2305 is a P-Channel MOSFET in a SOT-23 plastic-encapsulated package, designed for load switching in portable devices and DC/DC converters. It features TrenchFET Power MOSFET technology, offering efficient power management capabilities.

Product Attributes

  • Brand: SHENZHEN LONG JING MICRO-ELECTRONICS CO., LTD.
  • Model: SI2305
  • Package Type: SOT-23
  • Moisture Sensitivity: Level 3 per J-STD-020

Technical Specifications

Symbol Parameter Test Conditions Min Typ Max Unit
Maximum Ratings (Ta=25C unless otherwise specified)
VDSS Drain-Source voltage -20 V
VGSS Gate-Source voltage 12 V
ID Continuous Drain Current -6.0 A
IS Continuous Source-Drain Diode Current -0.8 A
PD Maximum Power Dissipation 0.35 W
RJA Thermal Resistance from Junction to Ambient (t10s) 357 C/W
TJ Junction Temperature 150 C
TSTG Storage Temperature -50 ~+150 C
Electrical Characteristics (TJ=25C unless otherwise specified)
V(BR)DSS Drain-Source Breakdown Voltage VGS = 0V, ID = -250A -20 V
VGS(th) Gate-Threshold Voltage VDS = VGS, ID = -250A -0.5 -0.9 V
lGSS Gate-body Leakage current VDS = 0V, VGS = 12V 100 nA
IDSS Zero Gate Voltage Drain Current VDS = -20V, VGS = 0V -1 A
RDS(on) Drain-Source On-Resistance VGS = -4.5V, ID = -3.5A 30 45 m
VGS = -2.5V, ID = -3.0A 40 60 m
VGS = -1.8V, ID = -2.0A 60 90 m
gfs Forward Trans conductance VDS = -5V, ID = -4.1A 6 S
Dynamic Characteristics
Ciss Input Capacitance VGS = 0V, VDS = -4V, f = 1.0MHz 740 pF
Coss Output Capacitance VGS = 0V, VDS = -4V, f = 1.0MHz 290 pF
Crss Reverse Transfer Capacitance VGS = 0V, VDS = -4V, f = 1.0MHz 190 pF
Qg Total Gate Charge VDS = -4V,VGS = -4.5V, ID = -4.1A 7.8 15 nC
Qgs Gate-Source Charge VDS = -4V,VGS = -2.5V,ID = -4.1A 1.2 nC
Qgd Gate-Drain Charge VDS = -4V,VGS = -2.5V,ID = -4.1A 1.6 nC
Rg Gate resistance f =1MHz 1.4 7
td(on) Turn-On Delay Time VDD = -4V,RL = 1.2, ID -3.3A, VGEN = -4.5V,Rg = 1 13 20 ns
VDD = -4V,RL = 1.2, ID -3.3A, VGEN = -8V,Rg = 1 5 10 ns
tr Rise Time VDD = -4V,RL = 1.2, ID -3.3A, VGEN = -4.5V,Rg = 1 35 53 ns
VDD = -4V,RL = 1.2, ID -3.3A, VGEN = -8V,Rg = 1 11 17 ns
td(off) Turn-Off Delay Time VDD = -4V,RL = 1.2, ID -3.3A, VGEN = -4.5V,Rg = 1 32 48 ns
VDD = -4V,RL = 1.2, ID -3.3A, VGEN = -8V,Rg = 1 22 33 ns
tf Fall Time VDD = -4V,RL = 1.2, ID -3.3A, VGEN = -4.5V,Rg = 1 10 20 ns
VDD = -4V,RL = 1.2, ID -3.3A, VGEN = -8V,Rg = 1 16 24 ns
Drain-Source Body Diode Characteristics
IS Continuous Source-Drain Diode Current TC = 25C -1.4 A
ISM Pulsed Diode Forward Current -10 A
VSD Body diode voltage IF = -3.3A -1.2 V

Note:

  • 1. Pulse Test: Pulse Width 300s, Duty Cycle 2%.
  • 2. Guaranteed by design, not subject to production testing.
  • 3. These parameters have no way to verify.

Soldering Parameters:

Reflow Condition Pb Free assembly

Parameter Min Max Unit
Pre Heat Temperature (Ts(min)) 150 C
Temperature (Ts(max)) 200 C
Time (min to max) (ts ) 60 190 secs
Average ramp up rate (Liquidus Temp) (TL) to peak 5C/second
Reflow Temperature (TL) (Liquidus) 217 C
Time (tL) 60 150 seconds
Temperature (tp ) 260+0/-5 C
Time within actual peak Temperature (tp ) 20 40 seconds
Ramp-down Rate 5C/second max
Time 25C to peak Temperature (TP) 8 minutes Max.

Note: Do not exceed 280C


2410121632_ALJ-SI2305_C22751458.pdf

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