Battery protection MOSFET A Power microelectronics AP50N03DF 30V N Channel enhancement mode device

Key Attributes
Model Number: AP50N03DF
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
50A
Operating Temperature -:
-55℃~+150℃
RDS(on):
12mΩ@10V
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
87pF
Number:
1 N-channel
Output Capacitance(Coss):
135pF
Pd - Power Dissipation:
26W
Input Capacitance(Ciss):
870pF
Gate Charge(Qg):
4.2nC@4.5V
Mfr. Part #:
AP50N03DF
Package:
PDFN-8L(3x3)
Product Description

Product Overview

The AP50N03DF is a 30V N-Channel Enhancement Mode MOSFET utilizing advanced trench technology. It offers excellent RDS(ON) and low gate charge, enabling operation with gate voltages as low as 4.5V. This device is suitable for battery protection and other switching applications, including lithium battery protection, wireless impact, and mobile phone fast charging.

Product Attributes

  • Brand: APM Microelectronics ()
  • Product ID: AP50N03DF
  • Package Type: PDFN3*3-8L
  • Mode: N-Channel Enhancement Mode
  • Origin: China ()

Technical Specifications

Symbol Parameter Conditions Min. Typ. Max. Units
Absolute Maximum Ratings (TC=25 unless otherwise noted)
VDS Drain-Source Voltage 30 V
VGS Gate-Source Voltage 20 20 V
ID@TC=25 Continuous Drain Current, VGS @ 10V1 50 A
ID@TC=100 Continuous Drain Current, VGS @ 10V1 23 A
IDM Pulsed Drain Current2 75 A
EAS Single Pulse Avalanche Energy3 24.2 mJ
IAS Avalanche Current 22 A
PD@TC=25 Total Power Dissipation4 26 W
PD@TA=25 Total Power Dissipation4 1.67 W
TSTG Storage Temperature Range -55 150
TJ Operating Junction Temperature Range -55 150
RJA Thermal Resistance Junction-Ambient1 75 /W
RJC Thermal Resistance Junction-Case1 4.8 /W
Electrical Characteristics (TC=25 unless otherwise noted)
BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 --- --- V
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V , ID=6A 10.5 12 m
VGS=4.5V , ID=5A 15.5 19 m
VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.2 1.6 2.5 V
IDSS Drain-Source Leakage Current VDS=24V , VGS=0V , TJ=25 --- 1 uA
VDS=24V , VGS=0V , TJ=55 --- 5 uA
IGSS Gate-Source Leakage Current VGS=20V , VDS=0V --- 100 nA
gfs Forward Transconductance VDS=5V , ID=12A 32 --- S
Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz 2.1 ---
Qg Total Gate Charge (4.5V) VDS=15V , VGS=4.5V , ID=6A 4.2 --- nC
Qgs Gate-Source Charge 2.6 ---
Qgd Gate-Drain Charge 1.4 ---
Td(on) Turn-On Delay Time VDD=15V , VGS=10V , RG=1.5 ID=1A 13.1 --- ns
Tr Rise Time 6.3 ---
Td(off) Turn-Off Delay Time 21 ---
Tf Fall Time 7 ---
Ciss Input Capacitance VDS=15V , VGS=0V , f=1MHz 870 --- pF
Coss Output Capacitance 135 ---
Crss Reverse Transfer Capacitance 87 ---
IS Continuous Source Current1,5 VG=VD=0V , Force Current --- 37 A
VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25 --- 1 V
Package Mechanical Data-DFN3*3-8L-JQ
Symbol mm Nom Min Max
A 0.75 0.70 0.85
A1 / / 0.05
b 0.30 0.20 0.40
c 0.152 0.10 0.25
D 3.30 3.15 3.45
D1 3.15 3.00 3.25
D2 2.45 2.29 2.65
E 3.30 3.15 3.45
E1 3.05 2.90 3.20
E2 1.74 1.54 1.94
E3 0.48 0.28 0.65
E4 0.57 0.37 0.77
E5 0.20 0.10 0.30
e 0.65 0.60 0.70
K 0.69 0.59 0.89
L 0.40 0.30 0.50
L1 0.125 0.06 0.20
t 0.075 0 0.13
12 10 14

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