Enhancement Mode N Channel MOSFET ASA60R330E Designed for Boost PFC Switches and Flyback Converters

Key Attributes
Model Number: ASA60R330E
Product Custom Attributes
Drain To Source Voltage:
650V
Current - Continuous Drain(Id):
11A
RDS(on):
330mΩ
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.8V
Reverse Transfer Capacitance (Crss@Vds):
5.3pF@50V
Number:
1 N-channel
Input Capacitance(Ciss):
901pF@50V
Pd - Power Dissipation:
32W
Gate Charge(Qg):
22nC
Mfr. Part #:
ASA60R330E
Package:
TO-220F
Product Description

Product Overview

The ASA60R330E and ASD60R330E are N-Channel Silicon MOSFETs designed for efficient power switching applications. These enhancement-mode devices feature low drain-source on-resistance and are easy to control, making them suitable for boost PFC switches, single-ended flyback converters, half-bridge, asymmetric half-bridge, two-transistor forward, and series resonance half-bridge topologies. Key applications include PC power supplies, PD adapters, LCD & PDP TVs, LED lighting, server power, and UPS systems.

Product Attributes

  • Brand: Not specified
  • Material: Silicon
  • Type: N-Channel MOS
  • Mode: Enhancement Mode

Technical Specifications

Model Name Package Type Marking
ASA60R330E TO220F ASA60R330E
ASD60R330E TO252 ASD60R330E
Parameter Symbol Value Unit Note / Test Condition
Drain-source breakdown voltage V(BR)DSS 605 V VGS=0V, ID=10mA
Gate threshold voltage V(GS)th 2.8 - 4.2 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - 100 nA VDS=600V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - 100 nA VGS=30V, VDS=0V
Drain-source on-state resistance RDS(on) - 0.305 - 0.33 VGS=10V, ID=5.5A, Tj=25C
Gate resistance (Intrinsic) RG - 10.8 - f=1MHz, open drain
Input capacitance Ciss - 901 pF VGS=0V, VDS=50V, f=10kHz
Output capacitance Coss - 59 pF VGS=0V, VDS=50V, f=10kHz
Reverse transfer capacitance Crss - 5.3 pF VGS=0V, VDS=50V, f=10kHz
Turn-on delay time td(on) - 7.2 ns VDD=400V,VGS=13V,ID=4.8A, RG=3.4
Rise time tr - 20.8 ns VDD=400V,VGS=13V,ID=4.8A, RG=3.4
Turn-off delay time td(off) - 29.2 ns VDD=400V,VGS=13V,ID=4.8A, RG=3.4
Fall time tf - 19.2 ns VDD=400V,VGS=13V,ID=4.8A, RG=3.4
Gate to source charge Qgs - 5.8 nC VDD=400V, ID=4.8A, VGS=0 to 10V
Gate to drain charge Qg d - 17 nC VDD=400V, ID=4.8A, VGS=0 to 10V
Gate charge total Qg - 22 nC VDD=400V, ID=4.8A, VGS=0 to 10V
Gate plateau voltage Vplateau - 5.3 V VDD=400V, ID=4.8A, VGS=0 to 10V
Diode forward voltage VSD - 0.74 V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr - 250 ns VR=400V, IF=4.8 A, diF/dt=100A/s
Reverse recovery charge Qrr - 2.572 uC VR=400V, IF=4.8 A, diF/dt=100A/s
Peak reverse recovery current Irrm - 19.6 A VR=400V, IF=4.8 A, diF/dt=100A/s
Continuous drain current ID - 11 A TC=25C, Limited by Tj,max. Maximum Duty Cycle D = 0.50
Pulsed drain current ID,pulse - 33 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS - 400 mJ -
MOSFET dv/dt ruggedness dv/dt - 70 V/ns VDS=0...400V
Gate source voltage (static) VGS -20 - 20 V static
Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz)
Power dissipation (TO220F) Ptot - 32 W TC=25C
Power dissipation (TO252) Ptot - 83 W TC=25C
Storage temperature Tstg -55 - 150 C -
Operating junction temperature Tj -55 - 150 C -
Reverse diode dv/dt dv/dt - 15 V/ns VDS=0...400V, ISD<=48A, Tj=25C
Thermal resistance, junction - case (TO220F) RthJC - 3.9 C/W -
Thermal resistance, junction - ambient (TO220F) RthJA - 80 C/W device on PCB, minimal footprint
Thermal resistance, junction - case (TO252) RthJC - 1.5 C/W -
Thermal resistance, junction - ambient (TO252) RthJA - 62 C/W device on PCB, minimal footprint

2410121550_ANHI-ASA60R330E_C5440000.pdf

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