Power Conversion N Channel MOSFET ASD65R850E Featuring Low On Resistance and Fast Switching

Key Attributes
Model Number: ASD65R850E
Product Custom Attributes
Drain To Source Voltage:
700V
Current - Continuous Drain(Id):
6A
RDS(on):
850mΩ
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
3.5V
Reverse Transfer Capacitance (Crss@Vds):
4.55pF
Input Capacitance(Ciss):
377pF
Pd - Power Dissipation:
74W
Gate Charge(Qg):
10.3nC
Mfr. Part #:
ASD65R850E
Package:
TO-252
Product Description

Product Overview

The ASA65R850E, ASU65R850, and ASD65R850E are N-Channel Silicon MOSFETs designed for high-efficiency power conversion applications. These devices offer a low drain-source on-resistance (RDS(on)) and are easy to control via gate switching. Key applications include boost PFC switches, single-ended flyback and two-transistor forward topologies, PC power supplies, PD adaptors, and LCD & PDP TVs and LED lighting.

Product Attributes

  • Brand: Not specified
  • Origin: Not specified
  • Material: Silicon
  • Type: N-Channel MOS

Technical Specifications

Model Package VDS @ Tj,max (V) RDS(on),max () Qg,typ (nC) ID,pulse (A)
ASA65R850E TO220F 700 0.850 10.3 18
ASU65R850 TO251 700 0.850 10.3 18
ASD65R850E TO252 700 0.850 10.3 18
Parameter Symbol Value Unit Note / Test Condition
Drain-source breakdown voltage V(BR)DSS 655 V VGS=0V, ID=10mA
Gate threshold voltage V(GS)th 2.8 - 4.2 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - 100 nA VDS=650V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - 100 nA VGS=30V, VDS=0V
Drain-source on-state resistance RDS(on) - 0.75 - 0.85 VGS=10V, ID=2.5A, Tj=25C
Continuous drain current ID - 6 A TC=25C, Limited by Tj,max, Max Duty Cycle D = 0.50
Pulsed drain current ID,pulse - 18 A TC=25C, Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS - 624 mJ
MOSFET dv/dt ruggedness dv/dt - 36 V/ns VDS=0...400V
Gate source voltage (static) VGS -20 - 20 V static
Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz)
Power dissipation (TO220F) Ptot - 27 W TC=25C
Power dissipation (TO252&TO251) Ptot - 74 W TC=25C
Storage temperature Tstg -55 - 150 C
Operating junction temperature Tj -55 - 150 C
Reverse diode dv/dt dv/dt - 15 V/ns VDS=0...400V, ISD<=48A, Tj=25C
Thermal resistance, junction - case (TO220 FullPAK) RthJC - 4.6 C/W
Thermal resistance, junction - ambient (TO220 FullPAK) RthJA - 80 C/W device on PCB, minimal footprint
Thermal resistance, junction - case (TO251 & TO252) RthJC - 1.7 C/W
Thermal resistance, junction - ambient (TO251 & TO252) RthJA - 62 C/W device on PCB, minimal footprint
Input capacitance Ciss - 377 pF VGS=0V, VDS=50V, f=10kHz
Output capacitance Coss - 33 pF VGS=0V, VDS=50V, f=10kHz
Reverse transfer capacitance Crss - 4.55 pF VGS=0V, VDS=50V, f=10kHz
Turn-on delay time td(on) - 8.4 ns VDD=400V,VGS=13V,ID=2.5A, RG=6.8
Rise time tr - 21.6 ns VDD=400V,VGS=13V,ID=2.5A, RG=6.8
Turn-off delay time td(off) - 45.2 ns VDD=400V,VGS=13V,ID=2.5A, RG=6.8
Fall time tf - 24.4 ns VDD=400V,VGS=13V,ID=2.5A, RG=6.8
Gate to source charge Qgs - 1.845 nC VDD=400V, ID=2.5A, VGS=0 to 10V
Gate to drain charge Qgd - 2.723 nC VDD=400V, ID=2.5A, VGS=0 to 10V
Gate charge total Qg - 10.3 nC VDD=400V, ID=2.5A, VGS=0 to 10V
Gate plateau voltage Vplateau - 6.4 V VDD=400V, ID=2.5A, VGS=0 to 10V
Diode forward voltage VSD - 0.78 V VGS=0V, IF=1A, Tj=25C
Reverse recovery time trr - 124 ns VR=400V, IF=2.5 A, diF/dt=100A/s
Reverse recovery charge Qrr - 0.88 uC VR=400V, IF=2.5 A, diF/dt=100A/s
Peak reverse recovery current Irrm - 10 A VR=400V, IF=2.5 A, diF/dt=100A/s

2410121550_ANHI-ASD65R850E_C5440012.pdf

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