N Channel MOSFET AUR030N10 for dc dc conversion and synchronous rectification in industrial applications

Key Attributes
Model Number: AUR030N10
Product Custom Attributes
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
195A
Operating Temperature -:
-55℃~+175℃
RDS(on):
3mΩ@10V,20A
Gate Threshold Voltage (Vgs(th)):
4V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
280pF
Number:
1 N-channel
Output Capacitance(Coss):
-
Pd - Power Dissipation:
330W
Input Capacitance(Ciss):
10nF
Gate Charge(Qg):
138nC@10V
Mfr. Part #:
AUR030N10
Package:
TOLL
Product Description

Product Overview

The AUP034N10, AUB034N10, and AUR030N10 are N-Channel Silicon MOSFETs designed for high-performance applications. They are particularly suited for synchronous rectification in Switched-Mode Power Supplies (SMPS), and for hard switching and high-speed DC/DC conversion circuits in telecommunications and industrial sectors. Key features include low drain-source on-resistance, high-speed power switching, an enhanced body diode with dv/dt capability, and improved avalanche ruggedness.

Product Attributes

  • Type: N-Channel MOS
  • Material: Silicon

Technical Specifications

Part Name Package Marking VDS @ Tj,max (V) RDS(on),max TO220&TO263 (m) RDS(on),max TOLL (m) Qg,typ (nC) ID,pulse (A)
AUP034N10 TO220 AUP034N10 100 3.4 - 138 856
AUB034N10 TO263 AUB034N10 100 3.4 - 138 856
AUR030N10 TOLL AUR030N10 100 - 3.0 138 856
Parameter Symbol Values (Unit) Note / Test Condition
Continuous drain current at silicon ID - 214 A (TC=25C) Limited by Tj,max
Continuous drain current at package ID - 195 A (TC=25C) Limited by Tj,max
Continuous drain current at silicon ID 151 A (TC=100C) Limited by Tj,max
Pulsed drain current ID,pulse - 856 A (TC=25C) Pulse width tp limited by Tj,max
Avalanche energy, single pulse EAS - 512 mJ Tc=25,VDD=40V,Vgs=10V, L=1mH, RG=25
Avalanche current, single pulse IAR - 32 A Tc=25, VDD=40V, L=1mH, RG=25
Gate source voltage (static) VGS -20 to 20 V static
Power dissipation Ptot - 330 W TC=25C
Storage temperature Tstg -55 to 175 C
Operating junction temperature Tj -55 to 175 C
Soldering Temperature TL 300 C Distance of 1.6mm from case for 10s
Drain-source breakdown voltage V(BR)DSS 100 V VGS=0V, ID=250uA
Gate threshold voltage V(GS)th 2 to 4 V VDS=VGS, ID=250uA
Zero gate voltage drain current IDSS - 1 uA VDS=100V, VGS=0V, Tj=25C
Gate-source leakage current IGSS - +/-100 nA VGS=+/-20V, VDS=0V
Drain-source on-state resistance (TO220&TO263) RDS(on) 2.8 to 3.4 m VGS=10V, ID=20A, Tj=25C
Drain-source on-state resistance (TOLL) RDS(on) 2.4 to 3.0 m VGS=10V, ID=20A, Tj=25C
Gate resistance (Intrinsic) RG 2.6 f=1MHz, open drain
Transconductance Gfs 197.2 S VDS=5V, ID=90A
Input capacitance Ciss - 10000 pF VGS=0V, VDS=25V, f=1MHz
Output capacitance Coss - 2900 pF VGS=0V, VDS=25V, f=1MHz
Reverse transfer capacitance Crss - 280 pF VGS=0V, VDS=25V, f=1MHz
Turn-on delay time td(on) - 38 ns VDD=50V,VGS=10V,ID=80A, RG=2.5
Rise time tr - 50 ns VDD=50V,VGS=10V,ID=80A, RG=2.5
Turn-off delay time td(off) - 69 ns VDD=50V,VGS=10V,ID=80A, RG=2.5
Fall time tf - 33 ns VDD=50V,VGS=10V,ID=80A, RG=2.5
Gate to source charge Qgs - 58 nC VDD=50V, ID=80A, VGS=10V
Gate to drain charge Qgd - 44 nC VDD=50V, ID=80A, VGS=10V
Gate charge total Qg - 138 nC VDD=50V, ID=80A, VGS=10V
Continuous Source Current at silicon ISD - 214 A
Diode forward voltage VSD - 1.2 V VGS=0V, Is=80A, Tj=25C
Reverse recovery time trr - 95 ns Vgs=0V, IF=80A, diF/dt=100A/s
Reverse recovery charge Qrr - 143 nC Vgs=0V, IF=80A, diF/dt=100A/s
Package Thermal resistance, junction - case (RthJC) (C/W) Thermal resistance, junction - ambient (RthJA) (C/W)
TO263&TO252 - 0.46 - 63 (device on PCB, minimal footprint)
TOLL - 0.28 - 48 (device on PCB, minimal footprint)

2410121510_ANHI-AUR030N10_C19192885.pdf

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