30V N Channel MOSFET ASDsemi ASDM30N150Q R with Low Gate Charge and High Pulsed Drain Current Rating

Key Attributes
Model Number: ASDM30N150Q-R
Product Custom Attributes
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
150A
RDS(on):
2.5mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.4V@250uA
Reverse Transfer Capacitance (Crss@Vds):
718pF@15V
Pd - Power Dissipation:
43W
Input Capacitance(Ciss):
-
Gate Charge(Qg):
143nC@10V
Mfr. Part #:
ASDM30N150Q-R
Package:
DFN5x6-8
Product Description

Product Overview

The Ascend Semiconductor ASDM30N150Q is a 30V N-Channel MOSFET designed for high-performance applications. It features high ruggedness, low gate charge (typically 143nC), and improved dv/dt capability, with 100% avalanche testing for reliability. This MOSFET is suitable for synchronous rectification, Li-battery protection boards, and inverters.

Product Attributes

  • Brand: Ascend Semiconductor Co.,Ltd
  • Product Line: ASDM30N150Q
  • Package Type: DFN5*6-8
  • Technology: N-Channel MOSFET

Technical Specifications

General Parameters
Model ASDM30N150Q
Voltage Rating (VDS) 30 V
Typical RDS(on) @ VGS=10V 1.7 m
Continuous Drain Current (ID) @ TC=25C 150* A
Continuous Drain Current (ID) @ TC=100C 78* A
Pulsed Drain Current (IDM) 600 A
Continuous Drain Current (ID) @ TA=25C 30 A
Continuous Drain Current (ID) @ TA=70C 24 A
Gate to Source Voltage (VGS) 20 V
Single Pulsed Avalanche Energy (EAS) 576 mJ
Repetitive Avalanche Energy (EAR) 57 mJ
Peak Diode Recovery dv/dt 5 V/ns
Total Power Dissipation (PD) @ TC=25C 43 W
Total Power Dissipation (PD) @ TA=25C 2.6 W
Operating Junction & Storage Temperature (TSTG, TJ) -55 ~ +150 C
Thermal Characteristics
Parameter Value Unit
Thermal Resistance, Junction to Case (Rthjc) 1.8 C/W
Thermal Resistance, Junction to Ambient (Rthja) 62 C/W
Electrical Characteristics (TJ = 25C unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
Off Characteristics
BVDSS Drain to source breakdown voltage VGS=0V, ID=250uA 30 V
BVDSS / TJ Breakdown voltage temperature coefficient ID=250uA, referenced to 25C 0.02 V/C
IDSS Drain to source leakage current VDS=30V, VGS=0V 1 uA
VDS=24V, TJ=125C 50 uA
IGSS Gate to source leakage current, forward VGS=20V, VDS=0V 100 nA
Gate to source leakage current, reverse VGS=-20V, VDS=0V -100 nA
On Characteristics
VGS(TH) Gate threshold voltage VDS=VGS, ID=250uA 1.2 2.4 V
RDS(ON) Drain to source on state resistance VGS=4.5V, ID=30A, TJ=25C 3.4 4.5 m
VGS=10V, ID=30A, TJ=25C 1.7 2.5 m
Gfs Forward transconductance VDS=5V, ID=30A 73 S
Dynamic Characteristics
Ciss Input capacitance VGS=0V, VDS=15V, f=1MHz 6272 pF
Coss Output capacitance 1022 pF
Crss Reverse transfer capacitance 718 pF
td(on) Turn on delay time VDS=15V, ID=30A, RG=4.7, VGS=10V 20 ns
tr Rising time 58 ns
td(off) Turn off delay time 158 ns
tf Fall time 77 ns
Qg Total gate charge VDS=24V, VGS=10V, ID=30A, IG=5mA 143 nC
Qgs Gate-source charge 17 nC
Qgd Gate-drain charge 43 nC
Rg Gate resistance VDS=0V, Scan F mode 4.2
Source to Drain Diode Ratings Characteristics
IS Continuous source current Integral reverse p-n Junction diode in the MOSFET 150 A
ISM Pulsed source current 600 A
VSD Diode forward voltage drop IS=45A, VGS=0V 1.4 V
trr Reverse recovery time IS=30A, VGS=0V, dIF/dt=100A/us 26 ns
Qrr Reverse recovery charge 10 nC
Package Dimensions (DFN5*6-8)
Symbol Min Max Unit
A 0.85 1.00 mm
A1 0.01 0.05 mm
A2 0.69 0.75 mm
b 0.40 0.45 mm
C 0.20 0.30 mm
D 4.80 4.95 mm
D1 3.91 4.06 mm
D2 1.60 1.80 mm
E 5.65 5.80 mm
E1 3.46 3.50 mm
E2 0.80 0.95 mm
L 0.15 0.3 mm
L1 0.08 0.15 mm
L2 0.58 0.73 mm
L3 0.45 0.60 mm
H 6.15 6.28 mm
8 12
Ordering and Marking Information
Package Marking Device No. Packing Quantity
DFN5*6-8 30N150 ASDM30N150Q-R Tape&Reel 4000/Reel

2410121617_ASDsemi-ASDM30N150Q-R_C2972857.pdf

Contact Our Experts And Get A Free Consultation!

Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.