Lead Free Surface Mount Schottky Barrier Rectifier BLUE ROCKET SS26 for Electronic Device Integration
Product Overview
The SS22~SS220 series are surface mount Schottky barrier rectifiers designed for general-purpose applications. These diodes feature glass-passivated chip junctions and are lead-free, complying with EU RoHS 2011/65/EU directives. They are also halogen-free (HF product) and suitable for surface-mounted applications. The series offers a range of reverse voltages from 20V to 200V and a forward current of 2.0A, packaged in the compact SMA form factor.
Product Attributes
- Type: Surface Mount Schottky Barrier Rectifiers
- Certifications: EU RoHS 2011/65/EU
- Material: Glass Passivated Chip Junction
- Environmental: Lead-free, Halogen-free (HF product)
- Application: For surface mounted applications
- Purpose: General purpose
Technical Specifications
Absolute Maximum Ratings (Ta=25)
| Parameter | Symbol | SS22 | SS24 | SS26 | SS28 | SS210 | SS212 | SS215 | SS220 | Unit |
|---|---|---|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM | 20 | 40 | 60 | 80 | 100 | 120 | 150 | 200 | V |
| Maximum RMS voltage | VRMS | 14 | 28 | 42 | 56 | 70 | 84 | 105 | 140 | V |
| Maximum DC Blocking Voltage | VDC | 20 | 40 | 60 | 80 | 100 | 120 | 150 | 200 | V |
| Maximum Average Forward Rectified Current | IFAV | 2.0 | A | |||||||
| Peak Forward Surge Current (8.3 ms Single Half Sine Wave) | IFSM | 50 | A | |||||||
| Typical Junction Capacitance (at VR=4V, f=1MHz) | Cj | 220 | pF | |||||||
| Typical Thermal Resistance (P.C.B. mounted with 2.0 X 2.0" copper pad) | RJA | 80 | /W | |||||||
| Operating and Storage Temperature Range | Tj,Tstg | -55~+150 | ||||||||
Electrical Characteristics (Ta=25)
| Parameter | Symbol | Test Conditions | SS22 | SS24 | SS26 | SS28 | SS210 | SS212 | SS215 | SS220 | Unit |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Maximum Instantaneous Forward Voltage | VF | IF=2.0A | 0.55 | 0.70 | 0.85 | 0.95 | V | ||||
| Maximum DC Reverse Current at Rated DC Blocking Voltage | IR | Ta=25 | 0.5 | 0.3 | mA | ||||||
| Ta=100 | 5.0 | 3.0 | mA | ||||||||
Package Dimensions
SMA
Marking Instructions
See Marking Instructions.
Temperature Profile for IR Reflow Soldering (Pb-Free)
- Preheating: 25~150, Time: 60~90 sec
- Peak Temp.: 2455, Duration: 50.5 sec
- Cooling Speed: 2~10/sec
Resistance to Soldering Heat Test Conditions
- Temp.: 2605
- Time: 101 sec
Packaging SPEC.
| Package Type | Dimension | Units/Reel | Reels/Inner Box | Units/Inner Box | Inner Boxes/Outer Box | Units/Outer Box |
|---|---|---|---|---|---|---|
| SMA (Reel) | 1312 (336X336X40) | 5000 | 2 | 10000 | 7 | 70000 |
2410121227_BLUE-ROCKET-SS26_C2900682.pdf
Our mission is to offer "High Quality" & "Good Service" & "Fast Delivery" to help our clients to gain more profits.