N Channel MOSFET Bruckewell MSD60N085 60 Volt Trench DMOS Device for Switching and Motor Control

Key Attributes
Model Number: MSD60N085
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
60V
Current - Continuous Drain(Id):
58A
RDS(on):
12.5mΩ@4.5V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.3V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
40pF
Number:
1 N-channel
Output Capacitance(Coss):
479pF
Input Capacitance(Ciss):
1.27nF
Pd - Power Dissipation:
50W
Gate Charge(Qg):
15nC@10V
Mfr. Part #:
MSD60N085
Package:
TO-252
Product Description

Product Overview

The MSD60N085 is an N-Channel 60-V (D-S) MOSFET utilizing advanced trench DMOS technology. This technology is engineered to minimize on-resistance (RDS(ON)) and enhance switching performance, making it ideal for high-efficiency, fast-switching applications. The device is designed to withstand high energy pulses in avalanche and commutation modes. It meets RoHS and Green Product requirements and is 100% EAS guaranteed with full function reliability approval. Typical applications include motor control, DC/DC converters, and synchronous rectifier applications.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Product Line: MSD60N085
  • Technology: Trench DMOS
  • Certifications: RoHS Compliant, Green Device Available
  • Reliability: 100% EAS guaranteed

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Unit
Absolute Maximum Ratings (Tc=25C unless otherwise noted)
VDS Drain-Source Voltage 60 V
VGS Gate-Source Voltage ±20 V
ID Continuous Drain Current @ TC=25C 58 A
ID Continuous Drain Current @ TC=100C 37 A
IDM Pulsed Drain Current2 250 A
IAS Single Pulse Avalanche Current, L =0.1mH3 23 A
EAS Single Pulse Avalanche Energy, L =0.1mH3 26.5 mJ
PD Power Dissipation (TC=25C) 50 W
Tj, Tstg Operating Junction and Storage Temperature -55 ~ +150 C
Thermal Resistance Ratings
RJA Maximum Junction-to-Ambient1 60 C/W
RJC Maximum Junction-to-Case 3 C/W
Electrical Characteristics (TJ=25C unless otherwise specified)
VGS (th) Gate Threshold Voltage VDS =VGS, ID =250A 1.2 - 2.3 V
BVDSS Drain-Source Breakdown Voltage VGS =0V, ID =250A 60 - - V
IGSS Gate-Source Leakage Current VDS =0V, VGS =±20V - - ±100 nA
IDSS Drain-Source Leakage Current VDS =48V, VGS =0V, TJ =25C - - 1 µA
IDSS Drain-Source Leakage Current VDS =48V, VGS =0V, TJ =55C - 5 - µA
RDS (on) Static Drain-Source On-Resistance2 VGS =10V, ID =15A - 7 8.5
RDS (on) Static Drain-Source On-Resistance2 VGS =4.5V, ID =15A - 10.5 12.5
EAS Single Pulse Avalanche Energy5 VDD =50V, L =0.1mH, IAS =11A 6 - - mJ
VSD Diode Forward Voltage2 IS =1A, VGS =0V, TJ =25C - - 1.2 V
IS Continuous Source Current1,6 VG =VD =0V, Force Current - - 30 A
ISM Pulsed Source Current2,6 - - 58 A
Dynamic
Qg Total Gate Charge2 VDS =30V, VGS =10V, ID =15A - 15 - nC
Qgs Gate-Source Charge - 3.5 - nC
Qgd Gate-Drain Charge - 4.2 - nC
td(on) Turn-On Delay Time2 VDS =30V, ID =15A, VGS =10V, RG =3.3Ω - 7 - ns
tr Rise Time - 4.5 - ns
td(off) Turn-Off Delay Time - 26 - ns
tf Fall Time - 5 - ns
CISS Input Capacitance VDS =30V, VGS =0V, f =1.0MHz - 1270 - pF
COSS Output Capacitance - 479 - pF
CRSS Reverse Transfer Capacitance - 40 - pF
trr Reverse Recovery Time IF=15A, dl/dt=100A/µs, Tj=25°C - 22 - nS
Qrr Reverse Recovery Charge - 72 - nC
Rg Gate Resistance VDS =0V, VGS =0V, f =1.0MHz - 1.3 - Ω

Notes:
1 The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2 The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3 The EAS data shows maximum rating. The test condition is VDD=50V, VGS=10V, L=0.1mH, IAS=23A.
4 The power dissipation is limited by 150 junction temperature.
5 The Min. value is 100% EAS tested guarantee.
6 The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.


2412061551_Bruckewell-MSD60N085_C42407726.pdf

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