P channel MOSFET Bruckewell MS34P07 featuring advanced trench technology and green device compliance

Key Attributes
Model Number: MS34P07
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
30V
Current - Continuous Drain(Id):
4.1A
RDS(on):
75mΩ@4.5V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
3V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
10pF
Number:
1 P-Channel
Input Capacitance(Ciss):
590pF@25V
Pd - Power Dissipation:
1.38W
Gate Charge(Qg):
15.2nC@10V
Mfr. Part #:
MS34P07
Package:
SOT-23
Product Description

Product Overview

The MS34P07 is a high-performance P-channel Trench MOSFET from Bruckewell Technology Corporation, designed with extreme high cell density. It offers excellent RDS(ON) and low gate charge, making it suitable for load switch applications and PWM applications. This device meets RoHS and Green Product requirements and has undergone full function reliability approval. Typical applications include battery protection, load switching, and use in hand-held instruments.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Product Series: MS34P
  • Channel Type: P-Channel
  • Voltage Rating: 30-V (D-S)
  • Technology: Advanced high cell density Trench technology
  • Certifications: RoHS Compliant, Green Device Available
  • Package Type: SOT-23
  • Packing: 3,000/Reel

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage (unless otherwise specified) -30 V
VGS Gate-Source Voltage (unless otherwise specified) 20 V
ID Continuous Drain Current (TA =25C) -4.1 A
ID Continuous Drain Current (TA =70C) -3.5 A
IDM Pulsed Drain Current (TA =25C) -12 A
PD Power Dissipation (TA =25C) 1.38 W
TJ/TSTG Operating Junction and Storage Temperature -55 +150 C
Thermal Resistance Ratings
RJA Maximum Junction-to-Ambient (Note 3) 90 C/W
Electrical Characteristics (TJ =25C unless otherwise specified)
VGS (th) Gate Threshold Voltage VDS =VGS, ID =-250A -1.0 -3.0 V
BVDSS Drain-Source Breakdown Voltage VGS =0V, ID =-250A -30 V
gfs Forward Transconductance VDS =-5V, ID =-4A 8.2 S
IGSS Gate-Source Leakage Current VDS =0V, VGS =20V 100 nA
IDSS Drain-Source Leakage Current VDS =-24V, VGS =0V, TJ =25C
VDS =-24V, VGS =0V, TJ =55C
-1
-5
A
RDS (on) Static Drain-Source On-Resistance VGS =-10V, ID =-4.1A
VGS =-4.5V, ID =-3.0A
50
75
m
VSD Diode Forward Voltage IS =-1.0A, VGS =0V, TJ =25C -1.2 V
IS Continuous Source Current (Diode) -4.1 A
ISM Pulsed Source Current (Diode) VG =VD =0V, Force Current -8.2 A
Dynamic and switching Characteristics
Qg Total Gate Charge (Note 2) 15.2 nC
Qgs Gate-Source Charge 5.5 nC
Qgd Gate-Drain Charge VDS =-24V ID =-3A VGS =-10V 1 nC
td(on) Turn-On Delay Time (Note 2) 8.6 ns
tr Rise Time 12.2 ns
td(off) Turn-Off Delay Time 36.6 ns
tf Fall Time VDS =-15V ID =-1A VGS =-10V RG =6, RL =15 20.8 ns
CISS Input Capacitance VDS =-25V VGS =0V f =1.0MHz 590 pF
COSS Output Capacitance VDS =-25V VGS =0V f =1.0MHz 75 pF
CRSS Reverse Transfer Capacitance VDS =-25V VGS =0V f =1.0MHz 10 pF

Notes:
1. Pulsed width limited by maximum junction temperature.
2. The data tested by pulsed, pulse width 300us, duty cycle 2%.
3. Surface mounted on 1 in copper pad of FR4 board; 270/W when mounted on min. copper pad.


2409291004_Bruckewell-MS34P07_C22374933.pdf

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