P Channel MOSFET Bruckewell MSD100P12 designed to meet RoHS compliance and green device requirements

Key Attributes
Model Number: MSD100P12
Product Custom Attributes
Configuration:
-
Drain To Source Voltage:
100V
Current - Continuous Drain(Id):
12A
RDS(on):
210mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
29pF@30V
Number:
1 P-Channel
Pd - Power Dissipation:
38W
Input Capacitance(Ciss):
1.228nF@30V
Gate Charge(Qg):
19nC@10V
Mfr. Part #:
MSD100P12
Package:
TO-252
Product Description

Product Overview

The MSD100P12 is a high-performance P-Channel MOSFET featuring extreme high cell density, offering excellent RDS(ON) and gate charge for synchronous buck converter applications. This device meets RoHS and Green Product requirements, is 100% EAS guaranteed, and has full function reliability approval. It is suitable for networking, load switch, and LED applications.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Model: MSD100P12
  • Technology: P-Channel MOSFET
  • Certifications: RoHS Compliant, Green Device Available
  • Package Type: TO-252
  • Sold As: 2,500/Reel

Technical Specifications

Parameter Test Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS (Drain-Source Voltage) -100 V
VGS (Gate-Source Voltage) ±20 V
ID (Continuous Drain Current) (TC =25°C) -12 A
ID (Continuous Drain Current) (TC =100°C) -7.8 A
IDM (Pulsed Drain Current) 1,2 -24 A
IAS (Single Pulse Avalanche Current) L =0.5mH3 -14 A
EAS (Single Pulse Avalanche Energy) L =0.5mH3 49 mJ
PD (Power Dissipation) (TC =25°C) 38 W
PD (Power Dissipation) (TA =25°C) 2 W
TJ/TSTG (Operating Junction and Storage Temperature) -55 +150 °C
Thermal Resistance Ratings
RθJA (Maximum Junction-to-Ambient) 1 62.5 °C/W
RθJC (Maximum Junction-to-Case) 1 2.8 °C/W
Electrical Characteristics (TJ=25°C unless otherwise specified)
VGS (th) (Gate Threshold Voltage) VDS =VGS, ID =-250µA -1.0 -1.9 -2.5 V
BVDSS (Drain-Source Breakdown Voltage) VGS =0V, ID =-250µA -100 - - V
IGSS (Gate-Source Leakage Current) VDS =0V, VGS =±20V - - ±100 nA
IDSS (Drain-Source Leakage Current) VDS =-100V, VGS =0V, TJ =25°C - - -1 µA
IDSS (Drain-Source Leakage Current) VDS =-80V, VGS =0V, TJ =125°C - - -10 µA
RDS (on) (Static Drain-Source On-Resistance) VGS =-10V, ID =-5A - 170 210
RDS (on) (Static Drain-Source On-Resistance) VGS =-4.5V, ID =-3A - 190 240
EAS (Single Pulse Avalanche Energy) VDD =-25V, L =0.5mH, IAS =-10A5 25 - - mJ
VSD (Diode Forward Voltage) IS =-5A, VGS =0V, TJ =25°C2 - - -1.2 V
IS (Continuous Source Current) 1,6 - - -12 A
ISM (Pulsed Source Current) 2,6 - - -24 A
Dynamic Characteristics
Qg (Total Gate Charge) 2 - 19 - nC
Qgs (Gate-Source Charge) - 3.4 - nC
Qgd (Gate-Drain Charge) VDS =-50V, ID =-5A, VGS =-10V - 2.9 - nC
td(on) (Turn-On Delay Time) 2 - 9 - ns
tr (Rise Time) - 6 - ns
td(off) (Turn-Off Delay Time) VDS =-30V, ID =-1A, VGS =-10V, RG =3.3Ω - 39 - ns
tf (Fall Time) - 33 - ns
CISS (Input Capacitance) VDS =-30V, VGS =0V, f =1.0MHz - 1228 - pF
COSS (Output Capacitance) - 41 - pF
CRSS (Reverse Transfer Capacitance) - 29 - pF
Rg (Gate Resistance) VGS =VDS =0V, f =1.0MHz - 13 - Ω

Notes:
1. The data tested by surface mounted on a 1 inch² FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3. The EAS data shows maximum rating. The test condition is V DD=-25V, VGS=-10V, L=0.5mH, IAS=-14A.
4. The power dissipation is limited by 150 junction temperature.
5. The Min. value is 100% EAS tested guarantee.
6. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation.


2412061551_Bruckewell-MSD100P12_C42407724.pdf

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