Trench DMOS Technology MOSFET Bruckewell MSHM40N085 with 40 Volt Drain Source Voltage and Operation

Key Attributes
Model Number: MSHM40N085
Product Custom Attributes
Drain To Source Voltage:
40V
Current - Continuous Drain(Id):
43A
RDS(on):
8.5mΩ@10V
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
2.5V@250uA
Type:
N-Channel
Reverse Transfer Capacitance (Crss@Vds):
38pF
Input Capacitance(Ciss):
690pF@15V
Pd - Power Dissipation:
27.8W
Gate Charge(Qg):
5.8nC@4.5V
Mfr. Part #:
MSHM40N085
Package:
PDFN3.3x3.3-8
Product Description

Product Overview

The MSHM40N085 is an N-Channel 40-V (D-S) MOSFET utilizing advanced trench DMOS technology. This technology is optimized for minimal RDS(ON), superior switching performance, and enhanced high-energy pulse handling in avalanche and commutation modes. It is well-suited for high-efficiency, fast-switching applications and meets RoHS and Green Product requirements, with 100% EAS guaranteed and full function reliability approval. Key features include a low RDS(ON) of 8.5m @ VGS =10V, super low gate charge, and 100% EAS guaranteed. Typical applications include motor control, DC/DC converters, and synchronous rectifier applications.

Product Attributes

  • Brand: Bruckewell Technology Corporation
  • Technology: Trench DMOS
  • Certifications: RoHS Compliant, Green Device Available
  • Guarantees: 100% EAS Guaranteed, Full Function Reliability Approved
  • Package Type: PDFN 3.3X3.3
  • Packing: 3,000/Reel

Technical Specifications

Symbol Parameter Test Conditions Min. Typ. Max. Units
Absolute Maximum Ratings
VDS Drain-Source Voltage 40 V
VGS Gate-Source Voltage ±20 V
ID Continuous Drain Current (TC =25°C) 43 A
ID Continuous Drain Current (TC =100°C) 28 A
IDM Pulsed Drain Current 60 A
IAS Single Pulse Avalanche Current, L =0.1mH 30 A
EAS Single Pulse Avalanche Energy, L =0.1mH 45 mJ
PD Power Dissipation (TC =25°C) 27.8 W
TJ/TSTG Operating Junction and Storage Temperature -55 150 °C
Thermal Resistance Ratings
RθJA Maximum Junction-to-Ambient 65 °C/W
RθJC Maximum Junction-to-Case 4.5 °C/W
Electrical Characteristics (TJ=25°C unless otherwise specified)
VGS (th) Gate Threshold Voltage VDS =VGS, ID =250µA 1.0 1.5 2.5 V
BVDSS Drain-Source Breakdown Voltage VGS =0V, ID =250µA 40 - - V
IGSS Gate-Source Leakage Current VDS =0V, VGS =±20V - - ±100 nA
IDSS Drain-Source Leakage Current VDS =32V, VGS =0V, TJ =25°C - - 1 µA
IDSS Drain-Source Leakage Current VDS =32V, VGS =0V, TJ =55°C - - 5 µA
RDS (on) Static Drain-Source On-Resistance VGS =10V, ID =12A - 8.5 -
RDS (on) Static Drain-Source On-Resistance VGS =4.5V, ID =10A - 10.5 15
EAS Single Pulse Avalanche Energy VDD =25V, L =0.1mH, IAS =15A 11 - - mJ
VSD Diode Forward Voltage IS =1A, VGS =0V, TJ =25°C - - 1.0 V
IS Continuous Source Current VG =VD =0V, Force Current - - 30 A
ISM Pulsed Source Current - - 60 A
Dynamic Characteristics
Qg Total Gate Charge VDS =20V ID =12A VGS =4.5V -- 5.8 -- nC
Qgs Gate-Source Charge -- 3 -- nC
Qgd Gate-Drain Charge -- 1.2 -- nC
td(on) Turn-On Delay Time VDS =15V ID =1A VGS =10V RG =3.3Ω -- 14.3 -- ns
tr Rise Time -- 5.6 -- ns
td(off) Turn-Off Delay Time -- 20 -- ns
tf Fall Time -- 11 -- ns
CISS Input Capacitance VDS =15V VGS =0V f =1.0MHz -- 690 -- pF
COSS Output Capacitance -- 193 -- pF
CRSS Reverse Transfer Capacitance -- 38 -- pF
Rg Gate Resistance VDS =0V, VGS =0V, f =1.0MHz 1.7 - - Ω

Notes:

  • 1. Data tested by surface mounted on a 1 inch² FR-4 board with 2OZ copper.
  • 2. Data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
  • 3. EAS data shows maximum rating. Test condition: VDD=25V, VGS=10V, L=0.1mH, IAS=30A.
  • 4. Power dissipation is limited by 150°C junction temperature.
  • 5. Minimum value is 100% EAS tested guarantee.
  • 6. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.

2410121637_Bruckewell-MSHM40N085_C22465535.pdf

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