Trench DMOS Technology MOSFET Bruckewell MSHM40N085 with 40 Volt Drain Source Voltage and Operation
Product Overview
The MSHM40N085 is an N-Channel 40-V (D-S) MOSFET utilizing advanced trench DMOS technology. This technology is optimized for minimal RDS(ON), superior switching performance, and enhanced high-energy pulse handling in avalanche and commutation modes. It is well-suited for high-efficiency, fast-switching applications and meets RoHS and Green Product requirements, with 100% EAS guaranteed and full function reliability approval. Key features include a low RDS(ON) of 8.5m @ VGS =10V, super low gate charge, and 100% EAS guaranteed. Typical applications include motor control, DC/DC converters, and synchronous rectifier applications.
Product Attributes
- Brand: Bruckewell Technology Corporation
- Technology: Trench DMOS
- Certifications: RoHS Compliant, Green Device Available
- Guarantees: 100% EAS Guaranteed, Full Function Reliability Approved
- Package Type: PDFN 3.3X3.3
- Packing: 3,000/Reel
Technical Specifications
| Symbol | Parameter | Test Conditions | Min. | Typ. | Max. | Units |
|---|---|---|---|---|---|---|
| Absolute Maximum Ratings | ||||||
| VDS | Drain-Source Voltage | 40 | V | |||
| VGS | Gate-Source Voltage | ±20 | V | |||
| ID | Continuous Drain Current (TC =25°C) | 43 | A | |||
| ID | Continuous Drain Current (TC =100°C) | 28 | A | |||
| IDM | Pulsed Drain Current | 60 | A | |||
| IAS | Single Pulse Avalanche Current, L =0.1mH | 30 | A | |||
| EAS | Single Pulse Avalanche Energy, L =0.1mH | 45 | mJ | |||
| PD | Power Dissipation (TC =25°C) | 27.8 | W | |||
| TJ/TSTG | Operating Junction and Storage Temperature | -55 | 150 | °C | ||
| Thermal Resistance Ratings | ||||||
| RθJA | Maximum Junction-to-Ambient | 65 | °C/W | |||
| RθJC | Maximum Junction-to-Case | 4.5 | °C/W | |||
| Electrical Characteristics (TJ=25°C unless otherwise specified) | ||||||
| VGS (th) | Gate Threshold Voltage | VDS =VGS, ID =250µA | 1.0 | 1.5 | 2.5 | V |
| BVDSS | Drain-Source Breakdown Voltage | VGS =0V, ID =250µA | 40 | - | - | V |
| IGSS | Gate-Source Leakage Current | VDS =0V, VGS =±20V | - | - | ±100 | nA |
| IDSS | Drain-Source Leakage Current | VDS =32V, VGS =0V, TJ =25°C | - | - | 1 | µA |
| IDSS | Drain-Source Leakage Current | VDS =32V, VGS =0V, TJ =55°C | - | - | 5 | µA |
| RDS (on) | Static Drain-Source On-Resistance | VGS =10V, ID =12A | - | 8.5 | - | mΩ |
| RDS (on) | Static Drain-Source On-Resistance | VGS =4.5V, ID =10A | - | 10.5 | 15 | mΩ |
| EAS | Single Pulse Avalanche Energy | VDD =25V, L =0.1mH, IAS =15A | 11 | - | - | mJ |
| VSD | Diode Forward Voltage | IS =1A, VGS =0V, TJ =25°C | - | - | 1.0 | V |
| IS | Continuous Source Current | VG =VD =0V, Force Current | - | - | 30 | A |
| ISM | Pulsed Source Current | - | - | 60 | A | |
| Dynamic Characteristics | ||||||
| Qg | Total Gate Charge | VDS =20V ID =12A VGS =4.5V | -- | 5.8 | -- | nC |
| Qgs | Gate-Source Charge | -- | 3 | -- | nC | |
| Qgd | Gate-Drain Charge | -- | 1.2 | -- | nC | |
| td(on) | Turn-On Delay Time | VDS =15V ID =1A VGS =10V RG =3.3Ω | -- | 14.3 | -- | ns |
| tr | Rise Time | -- | 5.6 | -- | ns | |
| td(off) | Turn-Off Delay Time | -- | 20 | -- | ns | |
| tf | Fall Time | -- | 11 | -- | ns | |
| CISS | Input Capacitance | VDS =15V VGS =0V f =1.0MHz | -- | 690 | -- | pF |
| COSS | Output Capacitance | -- | 193 | -- | pF | |
| CRSS | Reverse Transfer Capacitance | -- | 38 | -- | pF | |
| Rg | Gate Resistance | VDS =0V, VGS =0V, f =1.0MHz | 1.7 | - | - | Ω |
Notes:
- 1. Data tested by surface mounted on a 1 inch² FR-4 board with 2OZ copper.
- 2. Data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
- 3. EAS data shows maximum rating. Test condition: VDD=25V, VGS=10V, L=0.1mH, IAS=30A.
- 4. Power dissipation is limited by 150°C junction temperature.
- 5. Minimum value is 100% EAS tested guarantee.
- 6. Data is theoretically the same as ID and IDM; in real applications, should be limited by total power dissipation.
2410121637_Bruckewell-MSHM40N085_C22465535.pdf
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