Planar Die Zener Diode CBI BZT52B30 with Low Reverse Current and 0.9V Forward Voltage Characteristics

Key Attributes
Model Number: BZT52B30
Product Custom Attributes
Impedance(Zzt):
80Ω
Zener Voltage(Range):
29.4V~30.6V
Pd - Power Dissipation:
350mW
Zener Voltage(Nom):
30V
Impedance(Zzk):
300Ω
Mfr. Part #:
BZT52B30
Package:
SOD-123
Product Description

Product Overview

This Zener Diode series features a planar die construction and 350mW power dissipation on a ceramic PCB, making it ideal for general-purpose, medium current applications. Designed for automated assembly processes, these diodes are available in lead-free versions. They offer a wide range of Zener voltages from 2.4V to 43V, with precise voltage regulation and low reverse current characteristics.

Product Attributes

  • Brand: Heyuan China Base Electronics Technology Co., Ltd.
  • Construction: Planar Die
  • Packaging: Plastic Encapsulate Diodes (SOD-123)
  • Availability: Lead Free Version

Technical Specifications

Maximum Ratings (Ta=25C unless otherwise specified) Value Unit
Forward Voltage (@ IF = 10mA) 0.9 V
Power Dissipation (Note 1) 350 mW
Thermal Resistance from Junction to Ambient 357 /W
Junction Temperature 150
Storage Temperature Range -55 ~ +150
Type Number Type Code Zener Voltage Range (Note 2) Test Current (IZTC) Maximum Zener Impedance (Note 3) Maximum Reverse Current (VR=VRWM) Typical Temperature Coefficient
Nom (V) Min (V) Max (V) (mA) () (mA) (mV/C)
BZT52B2V4 2WX 2.4 2.35 2.45 5 100 600 1.0 -3.5
BZT52B2V7 2W1 2.7 2.65 2.75 5 100 600 1.0 -3.5
BZT52B3V0 2W2 3.0 2.94 3.06 5 95 600 1.0 -3.5
BZT52B3V3 2W3 3.3 3.23 3.37 5 95 600 1.0 -3.5
BZT52B3V6 2W4 3.6 3.53 3.67 5 90 600 1.0 -3.5
BZT52B3V9 2W5 3.9 3.82 3.98 5 90 600 1.0 -3.5
BZT52B4V3 2W6 4.3 4.21 4.39 5 90 600 1.0 -3.5
BZT52B4V7 2W7 4.7 4.61 4.79 5 80 500 1.0 -3.5
BZT52B5V1 2W8 5.1 5.00 5.20 5 60 480 1.0 -2.7
BZT52B5V6 2W9 5.6 5.49 5.71 5 40 400 1.0 -2.0
BZT52B6V2 2WA 6.2 6.08 6.32 5 10 150 1.0 0.4
BZT52B6V8 2WB 6.8 6.66 6.94 5 15 80 1.0 1.2
BZT52B7V5 2WC 7.5 7.35 7.65 5 15 80 1.0 2.5
BZT52B8V2 2WD 8.2 8.04 8.36 5 15 80 1.0 3.2
BZT52B9V1 2WE 9.1 8.92 9.28 5 15 100 1.0 3.8
BZT52B10 2WF 10 9.80 10.20 5 20 150 1.0 4.5
BZT52B11 2WG 11 10.78 11.22 5 20 150 1.0 5.4
BZT52B12 2WH 12 11.76 12.24 5 25 150 1.0 6.0
BZT52B13 2WI 13 12.74 13.26 5 30 170 1.0 7.0
BZT52B15 2WJ 15 14.70 15.30 5 30 200 1.0 9.2
BZT52B16 2WK 16 15.68 16.32 5 40 200 1.0 10.4
BZT52B18 2WL 18 17.64 18.36 5 45 225 1.0 12.4
BZT52B20 2WM 20 19.60 20.40 5 55 225 1.0 14.4
BZT52B22 2WN 22 21.56 22.44 5 55 250 1.0 16.4
BZT52B24 2WO 24 23.52 24.48 5 70 250 1.0 18.4
BZT52B27 2WP 27 26.46 27.54 2 80 300 0.5 21.4
BZT52B30 2WQ 30 29.40 30.60 2 80 300 0.5 24.4
BZT52B33 2WR 33 32.34 33.66 2 80 325 0.5 27.4
BZT52B36 2WS 36 35.28 36.72 2 90 350 0.5 30.4
BZT52B39 2WT 39 38.22 39.78 2 130 350 0.5 33.4
BZT52B43 2WU 43 41.16 42.84 2 130 350 0.5 36.4
PACKAGE OUTLINE
Symbol Dimension in Millimeters
Min Max
A 0.95 1.15
A1 0.01 0.100
B 1.55 1.65
bp 0.50 0.70
C 0.09 0.150
E 2.60 2.70
HE 3.45 3.85
Lp 0.20 0.45
0 5

Notes:
1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2
2. Short duration test pulse used to minimize self-heating effect
3. f = 1kHz


2410121341_CBI-BZT52B30_C21714233.pdf

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