Miniature dual P channel MOSFET CBI BSS84V surface mount package for compact and electronic designs
Product Overview
These miniature surface mount MOSFETs are designed to reduce power loss and conserve energy, making them ideal for use in small power management circuitry. Key features include energy efficiency, low threshold voltage, and high-speed switching. The miniature surface mount package saves board space. Applications include DC-DC converters, load switching, and power management in portable and battery-powered products such as computers, printers, cellular, and cordless telephones.
Product Attributes
- Brand: Heyuan China Base Electronics Technology Co., Ltd.
- Package Type: SOT-563
- Material: Plastic-Encapsulated
- Technology: MOSFETs
- Configuration: Dual P-Channel MOSFET
Technical Specifications
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| MAXIMUM RATINGS (Ta=25 unless otherwise noted) | ||||||
| Drain-Source Voltage | VDS | -50 | V | |||
| Gate-Source Voltage | VGS | ±20 | V | |||
| Continuous Drain Current | ID | -0.13 | A | |||
| Pulsed Drain Current (note 1) | IDM | @tp <10 µs | -0.52 | A | ||
| Power Dissipation | PD | 150 | mW | |||
| Thermal Resistance from Junction to Ambient (note 2) | RθJA | 833 | °C/W | |||
| Junction Temperature | TJ | 150 | °C | |||
| Storage Temperature | TSTG | -55 | +150 | °C | ||
| Maximum Lead Temperature for Soldering Purposes, Duration for 5 Seconds | TL | 260 | °C | |||
| ELECTRICAL CHARACTERISTICS (Ta=25 °C unless otherwise specified) | ||||||
| Drain-source breakdown voltage | V(BR)DSS | VGS = 0V, ID =-250µA | -50 | V | ||
| Zero gate voltage drain current | IDSS | VDS =-50V,VGS = 0V | -15 | µA | ||
| VDS =-25V,VGS = 0V | -0.1 | µA | ||||
| Gate-body leakage current | IGSS | VGS =±20V, VDS = 0V | ±5 | µA | ||
| Gate threshold voltage (note 3) | VGS(th) | VDS =VGS, ID =-250µA | -0.9 | -1.6 | -2 | V |
| Drain-source on-resistance (note 3) | RDS(on) | VGS =-5V, ID =-0.1A | 5.8 | 10 | Ω | |
| VGS =-10V, ID =-0.1A | 4.5 | 8 | Ω | |||
| Forward transconductance (note 1) | gFS | VDS=-25V; ID=-100mA | 50 | mS | ||
| DYNAMIC CHARACTERISTICS (note 4) | ||||||
| Input capacitance | Ciss | VDS =5V,VGS =0V,f =1MHz | 30 | pF | ||
| Output capacitance | Coss | 10 | pF | |||
| Reverse transfer capacitance | Crss | 5 | pF | |||
| SWITCHING CHARACTERISTICS (note 4) | ||||||
| Turn-on delay time | td(on) | VDD=-15V, RL=50Ω, ID =-2.5A | 2.5 | ns | ||
| Turn-on rise time | tr | 1 | ns | |||
| Turn-off delay time | td(off) | 16 | ns | |||
| Turn-off fall time | tf | 8 | ns | |||
| SOURCEDRAIN DIODE CHARACTERISTICS | ||||||
| Continuous Current | IS | -0.13 | A | |||
| Pulsed Current | ISM | -0.52 | A | |||
| Diode forward voltage | VSD | IS=-0.13A, VGS = 0V | -2.2 | V | ||
Notes:
1. Repetitive rating: Pulse width limited by junction temperature.
2. Surface mounted on FR4 board, t≤10s.
3. Pulse Test: Pulse Width≤300µs, Duty Cycle≤2%.
4. Guaranteed by design, not subject to production.
2510131755_CBI-BSS84V_C51822260.pdf
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