Lead Free Dual Enhancement Mode Field Effect Transistor CET Chino Excel Tech CEH2609 with TSOP 6 Package

Key Attributes
Model Number: CEH2609
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
3.5A
Operating Temperature -:
-55℃~+150℃
RDS(on):
100mΩ@4.5V
Gate Threshold Voltage (Vgs(th)):
1.2V@250uA
Type:
N-Channel + P-Channel
Reverse Transfer Capacitance (Crss@Vds):
-
Number:
1 N-Channel + 1 P-Channel
Output Capacitance(Coss):
-
Input Capacitance(Ciss):
-
Pd - Power Dissipation:
1.14W
Gate Charge(Qg):
3.6nC@3.3V
Mfr. Part #:
CEH2609
Package:
TSOP-6
Product Description

Product Overview

The CEH2609 is a Dual Enhancement Mode Field Effect Transistor featuring both N-Channel and P-Channel configurations. It is designed with a super high dense cell structure for extremely low RDS(ON), offering high power and current handling capabilities. This transistor is suitable for surface mount applications and is available as a lead-free product.

Product Attributes

  • Brand: CET Semi
  • Model: CEH2609
  • Package: TSOP-6
  • Certifications: Lead free product is acquired

Technical Specifications

Parameter Symbol N-Channel Units P-Channel Units Test Condition Min Typ Max
Absolute Maximum Ratings (TA = 25C unless otherwise noted)
Drain-Source Voltage VDS 20 V -20 V
Gate-Source Voltage VGS 12 V 12 V
Drain Current-Continuous ID 3.5 A -2.5 A
Drain Current-Pulsed a IDM 14 A -10 A
Maximum Power Dissipation PD 1.14 W
Operating and Store Temperature Range TJ, Tstg C C -55 150
Thermal Resistance, Junction-to-Ambient b RJA C/W C/W 110
N-Channel Electrical Characteristics (TA = 25C unless otherwise noted)
Drain-Source Breakdown Voltage BVDSS V VGS = 0V, ID = 250A 20
Zero Gate Voltage Drain Current IDSS A VDS = 20V, VGS = 0V 1 100
Gate Body Leakage Current, Forward IGSSR nA VGS = 12V, VDS = 0V 100
Gate Body Leakage Current, Reverse IGSSF nA VGS = -12V, VDS = 0V -100
Gate Threshold Voltage VGS(th) V VGS = VDS, ID = 250A 0.4 1.2
Static Drain-Source On-Resistance RDS(on) m VGS = 4.5V, ID = 3.5A 60
Static Drain-Source On-Resistance RDS(on) m VGS = 2.5V, ID = 2.0A 80
Input Capacitance Ciss pF VDD = 10V, ID = 3.5A, VGS = 4.5V, RGEN = 6 380
Reverse Transfer Capacitance Crss pF VDS = 10V, ID = 3.5A, VGS = 3.3V 90
Output Capacitance Coss pF VDS = 10V, VGS = 0V, f = 1.0 MHz 60
Turn-On Delay Time td(on) ns 16
Turn-On Rise Time tr ns 16
Turn-Off Delay Time td(off) ns 32
Turn-Off Fall Time tf ns 7
Total Gate Charge Qg nC 3.6
Gate-Source Charge Qgs nC 1.0
Gate-Drain Charge Qgd nC 1.2
Drain-Source Diode Forward Current IS A VGS = 0V, IS = 1A 1.1
Drain-Source Diode Forward Voltage VSD V 1.14
P-Channel Electrical Characteristics (TA = 25C unless otherwise noted)
Drain-Source Breakdown Voltage BVDSS V VGS = 0V, ID = -250A -20
Zero Gate Voltage Drain Current IDSS A VDS = -16V, VGS = 0V -1 -100
Gate Body Leakage Current, Forward IGSSR nA VGS = 12V, VDS = 0V 100
Gate Body Leakage Current, Reverse IGSSF nA VGS = -12V, VDS = 0V -100
Gate Threshold Voltage VGS(th) V VGS = VDS, ID = -250A -0.4 -1.2
Static Drain-Source On-Resistance RDS(on) m VGS = -4.5V, ID = -2.5A 100
Static Drain-Source On-Resistance RDS(on) m VGS = -2.5V, ID = -1.5A 145
Input Capacitance Ciss pF VDD = -10V, ID = -2.5A, VGS = -4.5V, RGEN = 3 375
Reverse Transfer Capacitance Crss pF VDS = -10V, ID = -2.0A, VGS = -3.3V 90
Output Capacitance Coss pF VDS = -10V, VGS = 0V, f = 1.0 MHz 60
Turn-On Delay Time td(on) ns 17
Turn-On Rise Time tr ns 17
Turn-Off Delay Time td(off) ns 27
Turn-Off Fall Time tf ns 7
Total Gate Charge Qg nC 2.9
Gate-Source Charge Qgs nC 0.46
Gate-Drain Charge Qgd nC 1.19
Drain-Source Diode Forward Current IS A VGS = 0V, IS = -1A -1.1
Drain-Source Diode Forward Voltage VSD V -1.2

2411220210_CET-Chino-Excel-Tech-CEH2609_C154295.pdf

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