diode ChipNobo A7 offering high forward surge current and temperature soldering for PCB applications
Product Overview
This product is a diode designed for printed circuit board applications, featuring a glass-passivated junction chip. It offers low reverse leakage, high forward surge current capability, and high-temperature soldering guarantees. Ideal for residential and commercial equipment, it is not intended for sensitive items or specialized equipment in sanctioned areas. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0.
Product Attributes
- Brand: ChipNobo
- Material: Molded plastic body with solder-plated terminals
- Certifications: Underwriters Laboratory Flammability Classification 94V-0
- Polarity: Polarity symbol marking on body
Technical Specifications
| Symbol | Unit | Parameter | Value |
|---|---|---|---|
| VRRM | V | Maximum repetitive peak reverse voltage | 55 to +150 |
| VRMS | V | Maximum RMS voltage | 35.0 |
| VDC | V | Maximum DC blocking voltage | 1000 |
| I(AV) | A | Maximum average forward rectified current at TL=100C (Single phase half-wave 60Hz, resistive or inductive load) | 1.0 |
| IFSM | A | Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load | 35.0 |
| VF | V | Maximum instantaneous forward voltage at 1.0A | 1.0 |
| IR | A | Maximum DC reverse current at TA=25C at rated DC blocking voltage | 200 |
| IR | A | Maximum DC reverse current at TA=125C at rated DC blocking voltage | 2.0 |
| trr | s | Maximum reverse recovery time (Note 1) | 1.8 |
| CJ | pF | Typical junction capacitance (Note 2) | 23.0 |
| RJA | C/W | Typical thermal resistance | 85.0 |
| TJ, TSTG | C | Operating junction and storage temperature range | -55 to +150 |
| Weight | grams | 0.02 | |
| Weight | ounce | 0.0007 | |
| Soldering | C/seconds | High temperature soldering guaranteed | 260 / 10 |
Note 1: Reverse recovery time test condition: IF=0.5A, IR=1.0A, Irr=0.25A
Note 2: Measured at 1MHz and applied reverse voltage of 4.0V D.C.
Package Information: SOD123FL
Dimensions (mm):
- A: 1.2
- B: 0.122
- C: 3.10
- D: 4.25
- E: 1.95
- F: 3.50
Suggested Pad Layout (mm):
- A0: 2.15
- B0: 4.0
- K0: 1.35
- D0: 4.0
- P0: 2.0
- P1: 1.55
- P2: 0.25
- W: 1.75
Carrier Dimensions (mm):
- Package: SOD123FL
- Reel Size: 7'
- QTY/Reel: 3000 (Kpcs: 3)
- Box Size (mm): 180
- QTY/Box (Kpcs): 15
- Carton Size (mm): 380*200*200
- QTY/Carton (Kpcs): 178
- Reel DIA. (mm): 150
Marking: A7
Explanation: Color Band Denotes Cathode, Product Name: A7
Suggested Soldering Temperature Profile: The device can be exposed to a maximum temperature of 260C for 10 seconds. Recommended reflow methods include IR, vapor phase oven, hot air oven, wave solder. Devices can be cleaned using standard industry methods and solvents. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Website: http://www.chipnobo.com
2507091712_ChipNobo-A7_C42458960.pdf
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