Diode with solder plated terminals ChipNobo S1M 13 F CN meeting MIL STD 750 Method 2026 requirements
Product Overview
This product is a diode designed for printed circuit boards, featuring a glass-passivated junction chip. It offers low reverse leakage and high forward surge current capability, making it suitable for residential and commercial equipment. The plastic package carries an Underwriters Laboratory Flammability Classification 94V-0 and is guaranteed for high-temperature soldering up to 260C for 10 seconds.
Product Attributes
- Brand: ChipNobo
- Case Material: Molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Polarity symbol marking on body
- Mounting Position: Any
- Flammability Classification: Underwriters Laboratory 94V-0
Technical Specifications
| Symbol | Units | Parameter | Value |
|---|---|---|---|
| VRRM | V | Maximum repetitive peak reverse voltage | 55 to +150 |
| VRMS | V | Maximum RMS voltage | 100 |
| VDC | V | Maximum DC blocking voltage | 100 |
| I(AV) | A | Maximum average forward rectified current at TL=100C (Single phase half-wave 60Hz, resistive or inductive load) | 1.0 |
| IFSM | A | Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load | 35.0 |
| VF | V | Maximum instantaneous forward voltage at 1.0A | 1.0 |
| IR | A | Maximum DC reverse current at rated DC blocking voltage (TA=25C) | 2.0 |
| IR | A | Maximum DC reverse current at rated DC blocking voltage (TA=125C) | 80.0 |
| CJ | pF | Typical junction capacitance (Note1) | 18.0 |
| RqJA | C/W | Typical thermal resistance | 1000 |
| TJ,TSTG | C | Operating junction and storage temperature range | -55 to +150 |
| Weight | ounce / grams | Weight | 0.0023 / 0.07 |
| Model | N/A | Marking | M7 |
Note 1: Measured at 1MHz and applied reverse voltage of 4.0V D.C.
Note: For capacitive load current derate by 20%.
Soldering: High temperature soldering guaranteed 260C/10 seconds at terminals.
Dimensions: Provided in inches and (millimeters).
Suggested Pad Layout: Dimensions provided.
Suggested Soldering Temperature Profile: Recommended reflow methods include IR, vapor phase oven, hot air oven, wave solder. The device can be exposed to a maximum temperature of 260C for 10 seconds. Devices can be cleaned using standard industry methods and solvents. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Package Information: Carrier Dimensions and Reel/Box Specifications provided.
Website: http://www.chipnobo.com
2507091655_ChipNobo-S1M-13-F-CN_C42459019.pdf
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