Zener Diode ChipNobo SMAZ18-13-F-CN Molded Plastic Body Solder Plated Terminals Voltage Regulation
Product Overview
This series of Zener diodes offers a complete voltage range from 3.3 to 100 volts, featuring high peak reverse power dissipation, high reliability, and low leakage current. With a standard Zener voltage tolerance of 5%, these devices are designed for residential and commercial equipment applications. They are housed in a molded plastic body with solder plated, solderable terminals per MIL-STD-750, Method 2026, and can be mounted in any position. The product is suitable for use in areas without sanctions and is not intended for sensitive items or specialized equipment in sanctioned regions.
Product Attributes
- Case: Molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Polarity symbol marking on body
- Mounting Position: Any
- Brand: ChipNobo (implied by website and contact information)
Technical Specifications
| Rating | Symbol | Value | Unit | Device Marking | Nominal Zener Voltage (Vz @ Izt) | Izt (mA) | Zzt @ Izt () | ZZK @ IZK () | IzK (mA) | IR @ VR (A) | Izm (A) | Irm(2) (mApk) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| DC Power Dissipation at TL = 75 C (Note1) | PD | 1.0 | W | SMAZ18-13-F-CN | 18 | 14.0 | 20 | 750 | 0.25 | 5.0 | 13.7 | 50 | 250 |
| Maximum Forward Voltage at IF = 200 mA | VF | 1.2 | V | ||||||||||
| Junction Temperature Range | TJ | -55 to +150 | C | ||||||||||
| Storage Temperature Range | Ts | -55 to +150 | C | ||||||||||
| Weight | 0.0023 | ounce, 0.07 grams | |||||||||||
| Dimensions (DO-214AC/SMA) | 0.208(5.30) x 0.177(4.50) x 0.067(1.70) [L x W x H] (approximate based on diagram) | inches (millimeters) |
Characteristic Curves
Refer to the figures for detailed characteristic curves:
- FIG1: Maximum Continuous Power Dissipation
- FIG2: Typical Zener Impedance
- FIG3: Typical Reverse Characteristics
Suggested Pad Layout
| Unit | A | B | C | D | E |
|---|---|---|---|---|---|
| inch | 0.154 | 0.066 | 0.095 | 0.215 | 0.060 |
| (mm) | 3.90 | 1.68 | 2.41 | 5.45 | 1.52 |
Suggested Soldering Temperature Profile
Recommended reflow methods include IR, vapor phase oven, hot air oven, and wave solder. The device can withstand a maximum temperature of 265C for 10 seconds. Cleaning can be done using standard industry methods and solvents. Exceeding the recommended reflow profile may affect performance.
Package Information
| Package | Reel Size | QTY/Reel (Kpcs) | Box Size (mm) | QTY/Box (Kpcs) | Carton Size (mm) | QTY/Carton (Kpcs) | Reel DIA. (mm) |
|---|---|---|---|---|---|---|---|
| SMA | 11' | 5 | 285 x 10 x 7.5 | 15 | 355*310*310 | 120 | 330 |
| 13' | 340 x 15 x 80 | 360*360*360 |
2507091655_ChipNobo-SMAZ18-13-F-CN_C45369264.pdf
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