P Channel Enhancement Mode MOSFET DIODES DMP2165UW 7 for Power Management Motor Control Applications

Key Attributes
Model Number: DMP2165UW-7
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
2.5A
Operating Temperature -:
-55℃~+150℃
RDS(on):
180mΩ@1.8V
Gate Threshold Voltage (Vgs(th)):
1V@250uA
Type:
P-Channel
Reverse Transfer Capacitance (Crss@Vds):
32pF
Number:
1 P-Channel
Output Capacitance(Coss):
72pF
Input Capacitance(Ciss):
335pF
Pd - Power Dissipation:
700mW
Gate Charge(Qg):
3.5nC@4.5V
Mfr. Part #:
DMP2165UW-7
Package:
SOT-323
Product Description

Product Overview

The DMP2165UW is a P-Channel Enhancement Mode MOSFET designed for high efficiency power management applications. It minimizes on-state resistance (RDS(ON)) while maintaining superior switching performance. Ideal for motor control and power management functions, this device offers low input capacitance, fast switching speed, and low input/output leakage. It is also Totally Lead-Free & Fully RoHS Compliant, and a Halogen and Antimony Free Green Device.

Product Attributes

  • Brand: Diodes Incorporated
  • Product Type: P-Channel Enhancement Mode MOSFET
  • Case Material: Molded Plastic, Green Molding Compound
  • Environmental Compliance: Totally Lead-Free & Fully RoHS Compliant, Halogen and Antimony Free. Green Device
  • Certifications: UL Flammability Classification Rating 94V-0
  • Moisture Sensitivity: Level 1 per J-STD-020

Technical Specifications

Characteristic Symbol Value Unit Test Condition
Product Summary
Drain-Source Voltage BVDSS -20 V TA = +25C
RDS(ON) max @VGS = -4.5V RDS(ON) max 90 m TA = +25C
ID max @TA = +25C ID max -2.5 A TA = +25C
RDS(ON) max @VGS = -2.5V RDS(ON) max 120 m TA = +25C
ID max @TA = +70C ID max -2.0 A TA = +70C
Mechanical Data
Case SOT323
Weight 0.006 grams (Approximate)
Ordering Information
Part Number Case Packaging
DMP2165UW-7 SOT323 3000/Tape & Reel
DMP2165UW-13 SOT323 10000/Tape & Reel
Maximum Ratings
Drain-Source Voltage VDSS -20 V @TA = +25C, unless otherwise specified.
Gate-Source Voltage VGSS 12 V @TA = +25C, unless otherwise specified.
Continuous Drain Current ID -2.5 A VGS = -4.5V, Steady State, TA = +25C (Note 6)
Continuous Drain Current ID -2.0 A VGS = -4.5V, Steady State, TA = +70C (Note 6)
Maximum Continuous Body Diode Forward Current IS -1.0 A (Note 6)
Pulsed Drain Current IDM -15 A (10s Pulse, Duty Cycle = 1%) (Note 6)
Thermal Characteristics
Total Power Dissipation PD 0.5 W (Note 5)
Thermal Resistance, Junction to Ambient RJA 259 C/W Steady State (Note 5)
Total Power Dissipation PD 0.7 W (Note 6)
Thermal Resistance, Junction to Ambient RJA 175 C/W Steady State (Note 6)
Operating and Storage Temperature Range TJ, TSTG -55 to +150 C
Electrical Characteristics
Drain-Source Breakdown Voltage BVDSS -20 V VGS = 0V, ID = -250A (Note 7)
Zero Gate Voltage Drain Current IDSS -1.0 A VDS = -20V, VGS = 0V, TJ = +25C (Note 7)
Gate-Source Leakage IGSS 100 nA VGS = 12V, VDS = 0V (Note 7)
Gate Threshold Voltage VGS(TH) -0.4 to -1.0 V VDS = VGS, ID = -250A (Note 7)
Static Drain-Source On-Resistance RDS(ON) 63 to 90 m VGS = -4.5V, ID = -1.5A (Note 7)
Static Drain-Source On-Resistance RDS(ON) 83 to 120 m VGS = -2.5V, ID = -1.2A (Note 7)
Static Drain-Source On-Resistance RDS(ON) 160 to 180 m VGS = -1.8V, ID = -1.2A (Note 7)
Diode Forward Voltage VSD -0.7 to -1.1 V VGS = 0V, IS = -1A (Note 7)
Input Capacitance Ciss 335 pF VDS = -15V, VGS = 0V, f = 1.0MHz (Note 8)
Output Capacitance Coss 72 pF VDS = -15V, VGS = 0V, f = 1.0MHz (Note 8)
Reverse Transfer Capacitance Crss 32 pF VDS = -15V, VGS = 0V, f = 1.0MHz (Note 8)
Gate Resistance RG 15.5 VGS = 0V, VDS = 0V, f = 1.0MHz (Note 8)
Total Gate Charge Qg 3.5 nC VGS = -4.5V, VDS = -4V, ID = -3.5A (Note 8)
Gate-Source Charge Qgs 0.4 nC (Note 8)
Gate-Drain Charge Qgd 1.1 nC (Note 8)
Turn-On Delay Time tD(ON) 3.7 ns VDS = -4V, VGS = -4.5V, RG = 6, ID = -1A (Note 8)
Turn-On Rise Time tR 8.7 ns (Note 8)
Turn-Off Delay Time tD(OFF) 17.8 ns (Note 8)
Turn-Off Fall Time tF 8 ns (Note 8)
Reverse Recovery Time tRR 9 ns IF = -4A, di/dt = 100A/s (Note 8)
Reverse Recovery Charge QRR 1.5 nC IF = -4A, di/dt = 100A/s (Note 8)

Notes:

  • 5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
  • 6. Device mounted on 1 x 1 FR-4 PCB with high coverage 2oz. Copper, single sided.
  • 7. Short duration pulse test used to minimize self-heating effect.
  • 8. Guaranteed by design. Not subject to product testing.

1912111437_DIODES-DMP2165UW-7_C388477.pdf

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