DIODES DMN26D0UFB4 7B N Channel Enhancement Mode MOSFET with fast switching and low RDS ON resistance

Key Attributes
Model Number: DMN26D0UFB4-7B
Product Custom Attributes
Drain To Source Voltage:
20V
Current - Continuous Drain(Id):
240mA
RDS(on):
6Ω@1.8V,20mA
Operating Temperature -:
-55℃~+150℃
Gate Threshold Voltage (Vgs(th)):
900mV
Reverse Transfer Capacitance (Crss@Vds):
3.2pF@15V
Number:
1 N-channel
Input Capacitance(Ciss):
28.2pF@15V
Pd - Power Dissipation:
350mW
Mfr. Part #:
DMN26D0UFB4-7B
Package:
DFN-3
Product Description

Product Overview

The DMN26D0UFB4 is a new generation N-Channel Enhancement Mode MOSFET designed for high-efficiency power management applications. It offers minimized on-state resistance (RDS(ON)) and superior switching performance. Ideal for DC-DC converters and power management functions, this device features a very low gate threshold voltage, low input capacitance, fast switching speed, and low input/output leakage. It is available in an ultra-small surface mount package with a maximum height of 0.4mm, ESD protected gate, and is totally lead-free and fully RoHS compliant, making it a "Green" device.

Product Attributes

  • Brand: Diodes Incorporated
  • Product Type: N-Channel Enhancement Mode MOSFET
  • Package Type: X2-DFN1006-3
  • Package Material: Molded Plastic, "Green" Molding Compound (UL Flammability Classification Rating 94V-0)
  • Moisture Sensitivity: Level 1 per J-STD-020
  • Terminal Finish: NiPdAu over Copper Leadframe
  • Certifications: Totally Lead-Free & Fully RoHS Compliant, Halogen and Antimony Free ("Green" Device), Qualified to JEDEC standards for High Reliability.
  • Automotive Grade: Available for automotive applications requiring specific change control (Q-suffix part, AEC-Q100/101/104/200 qualified, PPAP capable, manufactured in IATF 16949 certified facilities).

Technical Specifications

Characteristic Symbol Value Unit Test Condition
Drain Source Voltage BVDSS 20 V VGS = 0V, ID = 100A
Gate-Source Voltage VGSS ±10 V
Continuous Drain Current (Note 5) ID 240 mA VGS = 4.5V, Steady State, TA = +25°C
Continuous Drain Current (Note 5) ID 190 mA VGS = 4.5V, Steady State, TA = +70°C
Continuous Drain Current (Note 5) ID 180 mA VGS = 1.8V, Steady State, TA = +25°C
Continuous Drain Current (Note 5) ID 140 mA VGS = 1.8V, Steady State, TA = +70°C
Pulsed Drain Current (Note 5) IDM 805 mA tP = 10µs
Total Power Dissipation (Note 5) PD 350 mW @TA = +25°C
Thermal Resistance, Junction to Ambient (Note 5) RθJA 357 °C/W Device mounted on FR-4 PC board, minimum recommended pad layout, single sided.
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Drain-Source Breakdown Voltage BVDSS 20 V VGS = 0V, ID = 100µA
Zero Gate Voltage Drain Current IDSS 500 nA VDS = 20V, VGS = 0V, @ TC = +25°C
Gate-Body Leakage IGSS ±100 nA VGS = ±10V, VDS = 0V
Gate-Body Leakage IGSS ±1 µA VGS = ±5V, VDS = 0V
Gate Threshold Voltage VGS(TH) 0.6 - 0.9 V VDS = VGS, ID = 250µA
Static Drain-Source On-Resistance RDS(ON) 3.0 Ω VGS = 4.5V, ID = 100mA
Static Drain-Source On-Resistance RDS(ON) 6.0 Ω VGS = 1.8V, ID = 20mA
Forward Transconductance |Yfs| 180 - 242 mS VDS = 10V, ID = 0.1A
Source-Drain Diode Forward Voltage VSD 0.5 - 1.4 V VGS = 0V, IS = 115mA
Input Capacitance Ciss 14.1 - 28.2 pF VDS = 15V, VGS = 0V, f = 1.0MHz
Output Capacitance Coss 2.9 - 5.8 pF VDS = 15V, VGS = 0V, f = 1.0MHz
Reverse Transfer Capacitance Crss 1.6 - 3.2 pF VDS = 15V, VGS = 0V, f = 1.0MHz
Turn-On Delay Time tD(ON) 3.8 ns VGS = 4.5V, VDD = 10V, ID = 200mA, RG = 2.0Ω
Rise Time tR 7.9 ns VGS = 4.5V, VDD = 10V, ID = 200mA, RG = 2.0Ω
Turn-Off Delay Time tD(OFF) 13.4 ns VGS = 4.5V, VDD = 10V, ID = 200mA, RG = 2.0Ω
Fall Time tF 15.2 ns VGS = 4.5V, VDD = 10V, ID = 200mA, RG = 2.0Ω
Package Dimensions (A) A 0.40 mm Maximum
Weight 0.001 grams Approximate

Ordering Information

Part Number Package Packing Qty. Carrier
DMN26D0UFB4-7 X2-DFN1006-3 Tape & Reel 3,000
DMN26D0UFB4-7B X2-DFN1006-3 Tape & Reel 10,000

2308161643_DIODES-DMN26D0UFB4-7B_C7525126.pdf

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