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quality single phase bridge rectifiers featuring FUXINSEMI GBU810 for electronic circuit board applications factory
quality single phase bridge rectifiers featuring FUXINSEMI GBU810 for electronic circuit board applications factory

single phase bridge rectifiers featuring FUXINSEMI GBU810 for electronic circuit board applications

Key Attributes
Model Number: GBU810
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
200A
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - Forward(Vf@If):
1.1V@4A
Current - Rectified:
8A
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
GBU810
Package:
GBU
Product Description

Product Overview

The Fuxin GBU series offers Glass Passivated Single Phase Bridge Rectifiers with voltage ratings from 50V to 1000V. These rectifiers are designed for non-automatic applications and are ideal for space-saving on printed circuit boards, with applicability for automatic insertion. They feature a reliable, low-cost construction utilizing molded plastic technology, glass-passivated chip junctions, and lead-free parts meeting RoHS requirements. The GBU series is suitable for various applications where efficient rectification and high reliability are needed.

Product Attributes

  • Brand: Fuxin
  • Series: GBU
  • Technology: Glass Passivated
  • Application: Single Phase Bridge Rectifiers
  • Certifications: RoHS compliant (lead-free parts)
  • Flame Retardant: Epoxy UL94-V0 rated
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Mounting Position: Any
  • Suffix "-H": Indicates Halogen free parts

Technical Specifications

Type Number VRWM (V) VRMS (V) VDC (V) IF(AV) (A) IFSM (A) It (As) VFM (V) IR (uA) CJ (pF) RJA (C/W) RJC (C/W) RJL (C/W) Vids (V) TJ, TSTG (C)
GBU8005 50 35 50 8.0 200 166 1.1 @ IF=8.0A 5.0 @ TJ=25C 200 @ VR=4.0V, f=1.0MHz 35 5.0 8.0 2500 -55 to +150
GBU801 100 70 100 8.0 200 166 1.1 @ IF=8.0A 5.0 @ TJ=25C 200 @ VR=4.0V, f=1.0MHz 35 5.0 8.0 2500 -55 to +150
GBU802 200 140 200 8.0 200 166 1.1 @ IF=8.0A 5.0 @ TJ=25C 200 @ VR=4.0V, f=1.0MHz 35 5.0 8.0 2500 -55 to +150
GBU804 400 280 400 8.0 200 166 1.1 @ IF=8.0A 5.0 @ TJ=25C 200 @ VR=4.0V, f=1.0MHz 35 5.0 8.0 2500 -55 to +150
GBU806 600 420 600 8.0 200 166 1.1 @ IF=8.0A 5.0 @ TJ=25C 200 @ VR=4.0V, f=1.0MHz 35 5.0 8.0 2500 -55 to +150
GBU808 800 560 800 8.0 200 166 1.1 @ IF=8.0A 5.0 @ TJ=25C 200 @ VR=4.0V, f=1.0MHz 35 5.0 8.0 2500 -55 to +150
GBU810 1000 700 1000 8.0 200 166 1.1 @ IF=8.0A 5.0 @ TJ=25C 200 @ VR=4.0V, f=1.0MHz 35 5.0 8.0 2500 -55 to +150

Soldering Conditions

Reflow Soldering:

  • Preheat Temperature (Tsmin to Tsmax): 150C to 200C
  • Time (ts) from Tsmin to Tsmax: 60~120 seconds
  • Average ramp-up rate (Tsmax to TL): <3C/sec
  • Time maintained above Temperature (TL): 217C, 60~260 seconds
  • Peak Temperature (TP): 255C, 10~30 seconds
  • Time within 5C of actual Peak Temperature (tP): 10~30 seconds
  • Average ramp-down rate (TP to 25C): <6C/sec
  • Time from 25C to Peak Temperature: <6 minutes

Storage Environment: Temperature = 5~40C, Humidity = 55%25%


2010151636_FUXINSEMI-GBU810_C880914.pdf

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