rectifier FUXINSEMI US1008FL with UL 94V0 rated molded plastic body and fast switching characteristics
Key Attributes
Model Number:
US1008FL
Product Custom Attributes
Reverse Leakage Current (Ir):
5uA
Non-Repetitive Peak Forward Surge Current:
30A
Reverse Recovery Time (trr):
75ns
Operating Junction Temperature Range:
-55℃~+150℃
Voltage - DC Reverse (Vr) (Max):
1kV
Current - Rectified:
1A
Mfr. Part #:
US1008FL
Package:
SOD-123FL
Product Description
Product Overview
The US1001FL thru US1008FL series are surface mount high-efficiency rectifiers designed for high-speed switching applications. These devices feature a low reverse leakage, built-in strain relief for automated placement, and high forward surge current capability. The glass-passivated chip junction ensures reliability, and the molded plastic body offers compliance with UL Flammability Classification 94V-0. They are ideal for applications requiring efficient rectification up to 1000V.
Product Attributes
- Brand: Fuxinsemi
- Package Type: SOD-123FL
- Material: Molded plastic body
- Certifications: Underwriters Laboratory Flammability Classification 94V-0
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
Technical Specifications
| Model | VRRM (V) | VRMS (V) | VDC (V) | I(AV) (A) | IFSM (A) | VF (V) | IR (A) | trr (ns) | CJ (pF) | RJA (C/W) | TJ,TSTG (C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| US1001FL | 100 | 70 | 100 | 1.0 | 30 | 1.0 | 5.0 | 50 | 100 | 85.0 | -55 to +150 |
| US1002FL | 200 | 140 | 200 | 1.0 | 30 | 1.0 | 5.0 | 50 | 100 | 85.0 | -55 to +150 |
| US1004FL | 400 | 280 | 400 | 1.0 | 30 | 1.0 | 5.0 | 50 | 100 | 85.0 | -55 to +150 |
| US1006FL | 600 | 420 | 600 | 1.0 | 30 | 1.0 | 5.0 | 75 | 100 | 85.0 | -55 to +150 |
| US1008FL | 1000 | 700 | 1000 | 1.0 | 30 | 1.0 | 5.0 | 75 | 100 | 85.0 | -55 to +150 |
| Note 1: Reverse recovery condition IF=0.5A, IR=1.0A, Irr=0.25A | |||||||||||
| Note 2: Measured at 1MHz and applied reverse voltage of 4.0V D.C. | |||||||||||
| Note 3: P.C.B. mounted with 0.2x0.2(5.0x5.0mm) copper pad areas | |||||||||||
| Dimensions (inches / mm) | A | B | C |
|---|---|---|---|
| Package SOD-123FL | 0.075 (1.90) | 0.055 (1.40) | 0.075 (1.90) |
| Marking Code | Type Number |
|---|---|
| U1B | US1001FL |
| U1D | US1002FL |
| U1G | US1004FL |
| U1J | US1006FL |
| U1M | US1008FL |
| Soldering Condition | Parameter | Value |
|---|---|---|
| Reflow soldering | Average ramp-up rate (Tsmin to Tsmax) | <3 C/sec |
| Preheat Temperature (Tsmin) | 150 C | |
| Preheat Temperature (Tsmax) | 200 C | |
| Time (tsmin to tsmax) | 60~120sec | |
| Time maintained above TL (TL=217 C) | 60~260sec | |
| Peak Temperature (Tp) | 255 C (0/5 sec) | |
| Ramp-down Rate | <6 C/sec |
2504111706_FUXINSEMI-US1008FL_C47501219.pdf
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