Surface Mount Schottky Barrier Rectifier with JEDEC DO214AC Package FUXINSEMI SS24A 40V Metal Silicon Junction
Surface Mount Schottky Barrier Rectifiers - 20V-200V
Product Overview
The SS22A thru SS220A series are surface mount Schottky barrier rectifiers designed for various applications. They feature a metal silicon junction with majority carrier conduction, resulting in low power loss and high efficiency. These rectifiers are ideal for automated placement due to their built-in strain relief and high forward surge current capability. They are compliant with RoHS Directive 2011/65/EU and are suitable for high-temperature soldering processes, guaranteed up to 260C for 10 seconds at terminals.
Product Attributes
- Brand: Fuxinsemi (implied by URL)
- Compliance: RoHS Directive 2011/65/EU
- Flammability Classification: Underwriters Laboratory 94V-0
- Material: Metal silicon junction
- Package: JEDEC DO-214AC molded plastic body
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Color band denotes cathode end
- Mounting Position: Any
Technical Specifications
| Symbol | Unit | SS22A | SS23A | SS24A | SS25A | SS26A | SS28A | SS210A | SS215A | SS220A |
|---|---|---|---|---|---|---|---|---|---|---|
| VRRM | V | 20 | 30 | 40 | 50 | 60 | 80 | 100 | 150 | 200 |
| VRMS | V | 14 | 21 | 28 | 35 | 42 | 56 | 70 | 105 | 140 |
| VDC | V | 20 | 30 | 40 | 50 | 60 | 80 | 100 | 150 | 200 |
| I(AV) | A | 2.0 (at TL, see fig.1) | ||||||||
| IFSM | A | 50.0 (8.3ms single half sine-wave) | ||||||||
| VF | V | 0.55 (at 2.0A) | 0.70 (at 2.0A) | 0.85 (at 2.0A) | 0.95 (at 2.0A) | |||||
| IR | mA | 0.1 (at TA=25C, rated DC blocking voltage) / 5.0 (at TA=100C, rated DC blocking voltage) | ||||||||
| RJA | C/W | 80 (P.C.B. mounted with 2.0x2.0 copper pad areas) | ||||||||
| CJ | pF | 10.0 (Measured at 1MHz and applied reverse voltage of 4.0V D.C.) | ||||||||
| TJ, TSTG | C | -55 to +150 (Operating junction temperature range / Storage temperature range) | ||||||||
Dimensions
SMA/DO-214AC Package:
- Length: 0.177(4.50) - 0.157(3.99) inches (mm)
- Width: 0.108(2.75) - 0.096(2.45) inches (mm)
- Height: 0.060(1.52) - 0.030(0.76) inches (mm)
- Terminal to Terminal: 0.012(0.305) - 0.006(0.152) inches (mm)
- Overall Width: 0.096(2.42) - 0.078(1.98) inches (mm)
- Overall Height: 0.067 (1.70) - 0.051 (1.30) inches (mm)
- Overall Length: 0.208(5.28) - 0.188(4.80) inches (mm)
Marking Code
Type number marking code is printed on the device.
Soldering Conditions
Suggested thermal profiles for soldering processes (Reflow soldering):
- Storage environment: Temperature 5C to 40C, Humidity 55%25%
- Preheat - Temperature Min (Tsmin): 150C
- Preheat - Temperature Max (Tsmax): 200C
- Preheat - Time (tsmin to tsmax): 60~120 sec
- Ramp-up Rate (Tsmax to TL): <3C/sec
- Time maintained above: Temperature (TL) 217C, Time (tL) 60~260 sec
- Peak Temperature (Tp): 255C 0/+5C
- Time within 5C of actual Peak Temperature (tp): 10~30 sec
- Ramp-down Rate (Tp to 25C): <6C/sec
- Time 25C to Peak Temperature: <6 minutes
2304140030_FUXINSEMI-SS24A_C842786.pdf
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