Surface Mount Schottky Barrier Rectifier with JEDEC DO214AC Package FUXINSEMI SS24A 40V Metal Silicon Junction

Key Attributes
Model Number: SS24A
Product Custom Attributes
Reverse Leakage Current (Ir):
500uA@40V
Operating Junction Temperature Range:
-55℃~+125℃
Voltage - DC Reverse (Vr) (Max):
40V
Diode Configuration:
Independent
Voltage - Forward(Vf@If):
550mV@2A
Current - Rectified:
2A
Mfr. Part #:
SS24A
Package:
SMA(DO-214AC)
Product Description

Surface Mount Schottky Barrier Rectifiers - 20V-200V

Product Overview

The SS22A thru SS220A series are surface mount Schottky barrier rectifiers designed for various applications. They feature a metal silicon junction with majority carrier conduction, resulting in low power loss and high efficiency. These rectifiers are ideal for automated placement due to their built-in strain relief and high forward surge current capability. They are compliant with RoHS Directive 2011/65/EU and are suitable for high-temperature soldering processes, guaranteed up to 260C for 10 seconds at terminals.

Product Attributes

  • Brand: Fuxinsemi (implied by URL)
  • Compliance: RoHS Directive 2011/65/EU
  • Flammability Classification: Underwriters Laboratory 94V-0
  • Material: Metal silicon junction
  • Package: JEDEC DO-214AC molded plastic body
  • Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
  • Polarity: Color band denotes cathode end
  • Mounting Position: Any

Technical Specifications

Symbol Unit SS22A SS23A SS24A SS25A SS26A SS28A SS210A SS215A SS220A
VRRM V 20 30 40 50 60 80 100 150 200
VRMS V 14 21 28 35 42 56 70 105 140
VDC V 20 30 40 50 60 80 100 150 200
I(AV) A 2.0 (at TL, see fig.1)
IFSM A 50.0 (8.3ms single half sine-wave)
VF V 0.55 (at 2.0A) 0.70 (at 2.0A) 0.85 (at 2.0A) 0.95 (at 2.0A)
IR mA 0.1 (at TA=25C, rated DC blocking voltage) / 5.0 (at TA=100C, rated DC blocking voltage)
RJA C/W 80 (P.C.B. mounted with 2.0x2.0 copper pad areas)
CJ pF 10.0 (Measured at 1MHz and applied reverse voltage of 4.0V D.C.)
TJ, TSTG C -55 to +150 (Operating junction temperature range / Storage temperature range)

Dimensions

SMA/DO-214AC Package:

  • Length: 0.177(4.50) - 0.157(3.99) inches (mm)
  • Width: 0.108(2.75) - 0.096(2.45) inches (mm)
  • Height: 0.060(1.52) - 0.030(0.76) inches (mm)
  • Terminal to Terminal: 0.012(0.305) - 0.006(0.152) inches (mm)
  • Overall Width: 0.096(2.42) - 0.078(1.98) inches (mm)
  • Overall Height: 0.067 (1.70) - 0.051 (1.30) inches (mm)
  • Overall Length: 0.208(5.28) - 0.188(4.80) inches (mm)

Marking Code

Type number marking code is printed on the device.

Soldering Conditions

Suggested thermal profiles for soldering processes (Reflow soldering):

  • Storage environment: Temperature 5C to 40C, Humidity 55%25%
  • Preheat - Temperature Min (Tsmin): 150C
  • Preheat - Temperature Max (Tsmax): 200C
  • Preheat - Time (tsmin to tsmax): 60~120 sec
  • Ramp-up Rate (Tsmax to TL): <3C/sec
  • Time maintained above: Temperature (TL) 217C, Time (tL) 60~260 sec
  • Peak Temperature (Tp): 255C 0/+5C
  • Time within 5C of actual Peak Temperature (tp): 10~30 sec
  • Ramp-down Rate (Tp to 25C): <6C/sec
  • Time 25C to Peak Temperature: <6 minutes

2304140030_FUXINSEMI-SS24A_C842786.pdf

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