Single Phase Miniature Glass Passivated Surface Mount Bridge Rectifier FUXINSEMI MB10F with Solderable Terminals
Key Attributes
Model Number:
MB10F
Product Custom Attributes
Non-Repetitive Peak Forward Surge Current:
30A
Operating Junction Temperature Range:
-55℃~+150℃@(Tj)
Voltage - Forward(Vf@If):
1.1V@800mA
Current - Rectified:
800mA
Voltage - DC Reverse(Vr):
1kV
Mfr. Part #:
MB10F
Package:
MBS
Product Description
Product Overview
The MB05F THRU MB10F series are 0.8A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers, designed for applications requiring reverse voltages from 50V to 1000V. These rectifiers offer surge overload ratings up to 30 amperes peak, saving space on printed circuit boards and are ideal for automated replacement. Their reliable, low-cost construction utilizes molded plastic technology with glass-passivated chip junctions, making them an economical choice. Lead-free parts meet RoHS requirements.
Product Attributes
- Brand: Fuxinsemi
- Series: MB05F THRU MB10F
- Construction: Molded plastic technology
- Chip Junction: Glass passivated
- Flame Retardant: UL94-V0 rated epoxy
- Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: Marked on body
- Mounting Position: Any
- Halogen Free Option: Suffix "-H" indicates Halogen free part (e.g., MB05-H)
Technical Specifications
| Characteristics | Symbol | MB05F | MB1F | MB2F | MB4F | MB6F | MB8F | MB10F | Unit |
|---|---|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum RMS Voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V |
| Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V |
| Maximum Average Forward Rectified Current @TA=25C | I(AV) | 0.8 | A | ||||||
| Peak Forward Surge Current 8.3ms Single Half Sine-Wave Super Imposed on Rated Load (JEDEC Method) | IFSM | 30 | A | ||||||
| Maximum Forward Voltage at 0.8A DC | VF | 1.1 | V | ||||||
| Maximum DC Reverse Current @TJ=25C at Rated DC Blocking Voltage | IR | 5 | A | ||||||
| Maximum DC Reverse Current @TJ=125C at Rated DC Blocking Voltage | IR | 500 | A | ||||||
| It Rating for Fusing (t<8.3ms) | It | 15 | As | ||||||
| Typical Junction Capacitance Per Element (Note1) | CJ | 65 | pF | ||||||
| Typical Thermal Resistance (Note2) | RJA | 3.74 | C/W | ||||||
| Operating Temperature Range | TJ | -55 to +150 | C | ||||||
| Storage Temperature Range | TSTG | -55 to +150 | C | ||||||
Dimensions (MBF Package)
Dimensions in inches and (millimeters)
| Symbol | Dimension |
|---|---|
| A | 0.226 (5.75) |
| B | 0.030 (0.76) |
| C | 0.070 (1.78) |
| D | 0.023 (0.58) |
| (Overall Width) | 0.276 (7.0) - 0.260 (6.6) |
| (Overall Length) | 0.197 (5.0) - 0.181 (4.6) |
| (Lead Diameter) | 0.047 (1.2) - 0.043 (1.1) |
| (Lead Length) | 0.157 (4.0) - 0.142 (3.6) |
| (Body Width) | 0.106 (2.7) - 0.09 (2.3) |
| (Body Length) | 0.063 (1.6) - 0.047 (1.2) |
| (Centerline to Lead) | 0.071 (1.8) - 0.055 (1.4) |
| (Marking Dot Diameter) | 0.018 (0.45) |
| (Marking Pin Diameter) | 0.014 (.35) - 0.006 (.15) |
Soldering Condition
Suggested thermal profiles for soldering processes
| Parameter | Value | Unit |
|---|---|---|
| Preheat Temperature Min (Tsmin) | 150 | C |
| Preheat Temperature Max (Tsmax) | 200 | C |
| Preheat Time (ts) | 60~120 | sec |
| Average ramp-up rate (Tsmin to Tsmax) | <3 | C/sec |
| Time maintained above: Temperature (TL) | 217 | C |
| Time maintained above: Time (tL) | 60~260 | sec |
| Peak Temperature (TP) | 255 +0/-5 | C |
| Time within 5C of actual Peak Temperature (tp) | 10~30 | sec |
| Ramp-down Rate | <6 | C/sec |
| Time 25C to Peak Temperature | <6 | minutes |
Note 1: Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
Note 2: Thermal resistance from junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm)copper pads.
2011091105_FUXINSEMI-MB10F_C915622.pdf
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